Patent application number | Description | Published |
20090272577 | CLAD MATERIAL FOR WIRING CONNECTION AND WIRING CONNECTION MEMBER PROCESSED FROM THE CLAD MATERIAL - A clad material for a wiring connection has an electroconductive layer formed from either pure Cu or a Cu alloy having higher electroconductivity than pure Al, a surface layer formed from either pure Al or an Al alloy and layered on one surface of the electroconductive layer, and a solder layer formed by hot-dip solder plating on the other surface of the electroconductive layer. The wiring connection member has a first connection end provided with an electroconductive layer soldered to an electrode of a semiconductor element, and a second connection end provided with an electroconductive layer soldered to, for example, an external wiring device. The wiring connection member is processed from the clad material for a wiring connection. This wiring member prevents molten solder from depositing on a pressing and heating portion of a local heating apparatus while also possessing excellent solderability. | 11-05-2009 |
20100273025 | BRAZING METHOD AND BRAZED STRUCTURE - A brazing method which provides a braze joint having excellent corrosion resistance and a brazed structure including such a braze joint includes assembling a first member and a second member to be joined into a temporary assembly, the first member including a base plate made of a ferrous material and a diffusion suppressing layer laminated on the base plate and composed of a N—Cr alloy essentially including not less than about 15% and not greater than about 40% of Cr, the second member being disposed on the diffusion suppressing layer of the first member with intervention of a brazing material of a Cu—Ni alloy essentially including not less than about 10% and not greater than about 20% of Ni, and maintaining the temporary assembly at a temperature of not less than about 1,200° C. to fuse the brazing material and diffuse Ni atoms and Cr atoms into the fused brazing material from the diffusion suppressing layer to form the braze joint, causing the resulting brazing material of the braze joint to have an increased melting point due to the increase of the Ni and Cr contents of the braze joint to self-solidify the braze joint, and then cooling the resulting assembly. | 10-28-2010 |
20120006884 | CLAD MATERIAL FOR WIRING CONNECTION AND WIRING CONNECTION MEMBER PROCESSED FROM THE CLAD MATERIAL - A clad material for a wiring connection has an electroconductive layer formed from either pure Cu or a Cu alloy having higher electroconductivity than pure Al, a surface layer formed from either pure Al or an Al alloy and layered on one surface of the electroconductive layer, and a solder layer formed by hot-dip solder plating on the other surface of the electroconductive layer. The wiring connection member has a first connection end provided with an electroconductive layer soldered to an electrode of a semiconductor element, and a second connection end provided with an electroconductive layer soldered to, for example, an external wiring device. The wiring connection member is processed from the clad material for a wiring connection. This wiring member prevents molten solder from depositing on a pressing and heating portion of a local heating apparatus while also possessing excellent solderability. | 01-12-2012 |
20120058360 | CLAD PLATE - A clad plate includes an aluminum plate and a hard metal plate such as a copper plate, joined together at side end surfaces thereof, the clad plate being excellent in joint strength and flexural separation-resistant characteristics. A side end surface of an aluminum plate and a side end surface of a hard metal plate are jointed together via a nickel layer by pressure welding. A ridge and a groove formed in the side end surface of the aluminum plate are respectively engaged and joined, via the nickel layer, to a groove and a ridge formed in the side end surface of the hard metal plate, and an end portion of the nickel layer extends beyond the rear end portion of the side end surface of the aluminum plate and is jointed to the plate surface of the aluminum plate with the end portion exposed thereon. The average width W of the exposed portion of the nickel layer exposed on the plate surface is preferably in the range from about 0.2 mm to about 1.5 mm. | 03-08-2012 |
20120077056 | HIGH-TEMPERATURE BIMETAL - A high-temperature bimetal capable of being inhibited from considerably shifting from an original position when the temperature has fallen to an ordinary temperature is provided. This high-temperature bimetal (1) includes a high thermal expansion layer (2) made of austenitic stainless steel and a low thermal expansion layer (3) made of a thermosensitive magnetic metal having a Curie point and bonded to the high thermal expansion layer. The high-temperature bimetal is employed over both a high temperature range of not less than the Curie point and a low temperature range of less than the Curie point, while an upper limit of operating temperatures in the high temperature range of not less than the Curie point is at least 500° C. | 03-29-2012 |
20120292294 | CLADDING MATERIAL FOR LEADS AND METHOD OF WELDING CLADDING MATERIAL FOR LEADS - A cladding material for a lead capable of inhibiting foreign matter from remaining on a surface can be obtained. The cladding material ( | 11-22-2012 |
20130309919 | CONNECTION PLATE FOR BATTERY TERMINALS AND METHOD FOR MANUFACTURING CONNECTION PLATE FOR BATTERY TERMINALS - A connection plate for battery terminals capable of inhibiting a first member and a second member from being detached from each other is provided. This bus bar | 11-21-2013 |
20130316217 | CONNECTION PLATE FOR BATTERY TERMINALS AND METHOD FOR MANUFACTURING CONNECTION PLATE FOR BATTERY TERMINALS - A connection plate for battery terminals capable of inhibiting a base and a battery terminal connection portion from being detached from each other is provided. This connection plate for battery terminals ( | 11-28-2013 |
20130340820 | METAL SUBSTRATE FOR DYE-SENSITIZED SOLAR CELL - This metal substrate for a dye-sensitized solar cell includes a clad material including a nonporous first metal layer, arranged on an anode side of a dye-sensitized solar cell element, made of a metal having corrosion resistance against an electrolyte of the dye-sensitized solar cell element and a second metal layer made of a metal having lower electrical resistance than the first metal layer and bonded to a side of the first metal layer opposite to the dye-sensitized solar cell element. | 12-26-2013 |