Markus Schneider
Markus Schneider, Schonhofen DE
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20080251900 | Conductor Frame For an Electronic Component and Method For the Production Thereof - Disclosed is a leadframe for at least one electronic component, comprising at least two electrical lead elements, each of which comprises at least one electrical lead tab and at least one retention tab. Provided between the at least one retention tab and the lead element is a score defining a parallel offset between the retention tab and the adjacent region of lead element. An additional parallel offset is defined between the lead element and the electrical lead tab, such that the retention tab and the electrical lead tab are located in a common plane. The score enables the retention tab to be removed easily without the need for a disadvantageous punched gap between the lead element and the retention tab. | 10-16-2008 |
20140312375 | Method for producing an optoelectronic assembly and optoelectronic assembly - A method for producing an optoelectronic assembly ( | 10-23-2014 |
Markus Schneider, Nittendorf-Schönhofen DE
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20130207145 | OPTOELECTRONIC SEMICONDUCTOR COMPONENT - An optoelectronic semiconductor component includes a carrier with a carrier top, at least one optoelectronic semiconductor chip mounted on the carrier top and having a radiation-transmissive substrate and a semiconductor layer sequence which includes at least one active layer that generates electromagnetic radiation, and a reflective potting material, wherein, starting from the carrier top, the potting material surrounds the semiconductor chip in a lateral direction at least up to half the height of the substrate. | 08-15-2013 |
Markus Schneider, Dusseldorf DE
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20130244018 | FIBER PREFORM MADE FROM REINFORCING FIBER BUNDLES AND COMPRISING UNIDIRECTIONAL FIBER TAPES, AND COMPOSITE COMPONENT - A fiber preform for producing fiber composite structures, a wall thereof including a first zone made from reinforcing fiber bundles having a first resin composition and a second zone made from at least one fiber tape comprising at least one unidirectionally directed reinforcing yarn strand having a second resin composition. The reinforcing fiber bundles in the first zone are oriented in different spatial directions to each other when viewed in a direction parallel to the extension of the thickness. Each reinforcing fiber has a length of from 3 to 50 mm, and contains the first resin composition in a concentration of from 1 to 10 wt % of the fiber weight. The wall of the fiber preform has a proportion of reinforcing fibers of more than 35 vol %, and the second zone forms a discrete region when viewed in a direction perpendicular to the thickness extension of the wall. | 09-19-2013 |
20140205831 | FLEXIBLE REINFORCING FIBER YARN PRE-IMPREGNATED WITH RESIN - A pre-impregnated yarn having a bundle made of reinforcing fiber filaments impregnated with a first resin composition infiltrated into the pre-impregnated yarn and at least partially connected via the first resin composition. The first resin composition contains at least two bisphenol A epichlorohydrin resins H1 and H2 in a weight ratio H1:H2 of 1.1 to 1.4, and an aromatic polyhydroxy ether P1. The pre-impregnated yarn has a second resin composition on the bundle outer side in the form of adhesive particles or drops. The second resin composition is solid at ambient temperatures and has a melting temperature in the range from 80 to 150° C. The bundle interior and at least 50% of the surface of the bundle outer side are free of the second resin composition. | 07-24-2014 |
Markus Schneider, Nittendorf - Schoenhofen DE
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20130285084 | Optoelectronic Semiconductor Component - An optoelectronic semiconductor component includes a carrier which has an upper side and a lower side opposite to the upper side. At least one radiation-emitting semiconductor device is disposed on the upper side and has a radiation emission surface, through which at least a portion of the electromagnetic radiation, which is generated during operation of the semiconductor device, leaves the semiconductor device. A radiation-absorbing layer is arranged to absorb ambient light, which impinges upon the component, such that an outer surface of the component facing away from the carrier appears black at least in places. | 10-31-2013 |
20140264422 | Optoelectronic Semiconductor Component and Conversion Element - In at least one embodiment, an optoelectronic semiconductor component includes an optoelectronic semiconductor chip. The semiconductor component includes a conversion element that is arranged to convert at least some radiation emitted by the semiconductor chip into radiation of a different wavelength. The conversion element comprises at least one luminescent substance and scattering particles and also at least one matrix material. The scattering particles are embedded in the matrix material. A difference in the refractive index between the matrix material and a material of the scattering particles at a temperature of 300 K is at the most 0.15. The difference in the refractive index between the matrix material and the material of the scattering particles at a temperature of 380 K is greater than at a temperature of 300 K. | 09-18-2014 |
Markus Schneider, Planegg DE
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20140088817 | METHOD AND SAFETY CONCEPT FOR RECOGNIZING DEFECTS IN A DRIVE SYSTEM OF A MOTOR VEHICLE - A method and associated safety system are provided for the recognition of defects in a drive system of a motor vehicle, having an electronically controllable brake control system and having at least one electronically controlled driving engine, an electronically controllable clutch and/or having an electronically controllable transmission. An electronic braking control device is assigned to the brake control system, which braking control device is connected with an independent monitoring module. The independent monitoring module checks for an occurrence of an implausible braking torque, for detecting a defect in the drive system. | 03-27-2014 |
Markus Schneider, Nittendorf-Schönhofen DE
Patent application number | Description | Published |
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20130207145 | OPTOELECTRONIC SEMICONDUCTOR COMPONENT - An optoelectronic semiconductor component includes a carrier with a carrier top, at least one optoelectronic semiconductor chip mounted on the carrier top and having a radiation-transmissive substrate and a semiconductor layer sequence which includes at least one active layer that generates electromagnetic radiation, and a reflective potting material, wherein, starting from the carrier top, the potting material surrounds the semiconductor chip in a lateral direction at least up to half the height of the substrate. | 08-15-2013 |