Patent application number | Description | Published |
20130077280 | Electronic Arrangement and Method for Producing an Electronic Arrangement - An electronic arrangement ( | 03-28-2013 |
20130240935 | METHOD FOR PRODUCING A SURFACE-MOUNTABLE SEMICONDUCTOR COMPONENT - A method of producing a surface-mountable semiconductor component including providing an auxiliary carrier made with a plastics material; applying at least one insert and at least one optoelectronic component to a mounting surface of the auxiliary carrier; enclosing, the optoelectronic component and the insert in a common molding, wherein the molding covers the optoelectronic component and the insert form-fittingly at least in places the optoelectronic component and the insert are not in direct contact with one another, and the optoelectronic component and the insert are connected together mechanically by the molding; removing the auxiliary earner; and producing individual surface-mountable semiconductor components by severing the molding. | 09-19-2013 |
20130309788 | Leadframe for Optoelectronic Components and Method for Producing Optoelectronic Components - A leadframe for producing a number of optoelectronic components is specified. At least one mounting region includes a number of chip mounting areas for a number of semiconductor chips. Alongside the mounting region at at least one main area of the leadframe one or more of grooves for reducing mechanical stresses in the leadframe are formed. The groove(s) do not completely penetrate through the leadframe. A method for producing a number of optoelectronic components on a leadframe of this type is furthermore specified. | 11-21-2013 |
20130334558 | METHOD FOR PRODUCING AN OPTOELECTRONIC COMPONENT, AND OPTOELECTRONIC COMPONENT - A method of producing an optoelectronic component includes providing a cavity; introducing a liquid matrix material with phosphor particles distributed therein into the cavity; introducing a semiconductor chip into the matrix material; sedimenting the phosphor particles in the matrix material; and curing the matrix material, wherein a conversion layer including phosphor particles is produced, said conversion layer being arranged on the semiconductor chip. | 12-19-2013 |
20140014995 | OPTOELECTRONIC COMPONENT AND METHOD FOR PRODUCING AN OPTOELECTRONIC COMPONENT - An optoelectronic component includes a substrate, a semiconductor chip arranged on the substrate, and a light-transmissive cover, wherein the light-transmissive cover covers at least an area of the semiconductor chip facing away from the substrate, the light-transmissive cover has a hardness greater than that of silicone, and a connecting material is arranged as a potting material between the light-transmissive cover and the substrate such that those areas of the semiconductor chip not covered by the substrate are surrounded by the connecting material, and the connecting material forms a cavity seal. | 01-16-2014 |
20140167303 | PRESSING TOOL AND METHOD FOR PRODUCING A SILICONE ELEMENT - A pressing tool for pressing a silicone element may include: an upper pressing tool half and a lower pressing tool half, which in the closed state of the pressing tool form a cavity for pressing a silicone element, and a carrier foil, which bears on one of the pressing tool halves, for the silicone element to be pressed, wherein at least the upper pressing tool half or the lower pressing tool half has at least one clamping element for aligning the two pressing tool halves with respect to one another, and wherein the clamping element is arranged between the pressing tool halves and outside the region covered by the carrier foil. | 06-19-2014 |
20140168988 | OPTICAL ELEMENT, OPTOELECTRONIC COMPONENT AND METHOD FOR THE PRODUCTION THEREOF - An optical element for light outcoupling and/or conversion of light includes a light-emitting semiconductor chip with at least one layer selected from a wavelength conversion layer, a scattering layer, a light outcoupling layer and a lens layer, which each includes a plastics material processable in a compression molding method. | 06-19-2014 |
20140191272 | Optoelectronic Component and Method for Producing an Optoelectronic Component - An optoelectronic component includes a substrate, on which a semiconductor chip and a wettable attractor element are arranged. A medium including pigments at least regionally covers the exposed region of the substrate that is not covered by the semiconductor chip and the attractor element. The medium at least partly wets the semiconductor chip and the attractor element. | 07-10-2014 |