Patent application number | Description | Published |
20100039150 | METHOD, CIRCUIT, AND DESIGN STRUCTURE FOR CAPTURING DATA ACROSS A PSEUDO-SYNCHRONOUS INTERFACE - A method for source synchronous communication. The method includes dynamically adjusting a delay that is applied to a data signal and a remote clock signal until a delayed remote clock signal is synchronized with a local clock signal, and capturing data from a delayed data signal associated with the delay in a local domain. | 02-18-2010 |
20100040183 | METHOD, CIRCUIT, AND DESIGN STRUCTURE FOR CAPTURING DATA ACROSS A PSEUDO-SYNCHRONOUS INTERFACE - A structure for performing cross-chip communication with mesochronous clocks. The structure includes: a data delay line; a remote clock delay line; a structure that captures at least one value of a state of a delayed remote clock signal on the remote clock delay line; and a control that influences a delay associated with the data delay line and the remote clock delay line. | 02-18-2010 |
20130326459 | POWER/PERFORMANCE OPTIMIZATION THROUGH TEMPERATURE/VOLTAGE CONTROL - A method of optimizing power and timing for an integrated circuit (IC) chip, identifies a plurality of valid temperature and voltage combinations that allow integrated circuit chips produced according to the integrated circuit chip design to operate within average power consumption goals and timing delay goals. Such a method selects temperature cut points from the valid temperature and voltage combinations for each of the integrated circuit chips, calculates a power consumption amount of each of the temperature cut points, and adjusts the temperature cut points based on the power consumption amount until the temperature cut points achieve the average power consumption goals. Next, this method tests each of the integrated circuit chips, and records the temperature cut points in the memory of the integrated circuit chips. | 12-05-2013 |
20130326460 | POWER AND TIMING OPTIMIZATION FOR AN INTEGRATED CIRCUIT BY VOLTAGE MODIFICATION ACROSS VARIOUS RANGES OF TEMPERATURES - A method of optimizing power and timing for an integrated circuit (IC) chip, which uses an IC technology that exhibits temperature inversion, by modifying a voltage supplied to the IC chip, while meeting power consumption and timing delay performances across lower and higher temperature ranges. A high voltage is selected that meets a closed timing analysis across a full temperature range to meet a timing performance and a low voltage is selected to meet the timing performance and the power performance across a lower temperature range to a temperature cut point in the higher temperature range. The IC chip is turned on at the high voltage and the high voltage is lowered to the low voltage when the temperature cut point is exceeded to meet the power performance while maintaining the timing performance. | 12-05-2013 |
20140215429 | POWER/PERFORMANCE OPTIMIZATION THROUGH CONTINUOUSLY VARIABLE TEMPERATURE-BASED VOLTAGE CONTROL - Methods determine temperature and voltage relationships for integrated circuit library elements to produce a continuous temperature-voltage function. Some of the library elements can be used or combined to form an integrated circuit design. Further, the performance characteristics for integrated circuit chips produced according to the integrated circuit design can be defined, such performance characteristics include an operating temperature range, etc. The continuous temperature-voltage function is applied to the performance characteristics to determine a plurality of temperature/voltage combinations for the integrated circuit chips. Each of the temperature/voltage combinations comprises an operating voltage for each operating temperature within the operating temperature range of the integrated circuit chips. Next, the integrated circuit chips are produced according to the integrated circuit design. The temperature/voltage combinations are recorded in memory of the integrated circuit chips. | 07-31-2014 |
20150025857 | STATISTICAL POWER ESTIMATION - A method for predicting the power consumption of a semiconductor chip is provided. A plurality of statistical distributions characterizing a plurality of power contributing parameters for a plurality of power consuming units included in the semiconductor chip is received. A statistical distribution characterizing the power consumption is determined based on the received plurality of statistical distributions and based on the correlation between the plurality of power contributing parameters. | 01-22-2015 |
20150028937 | CONTROLLING CIRCUIT VOLTAGE AND FREQUENCY BASED UPON LOCATION-DEPENDENT TEMPERATURE - Various embodiments include approaches for controlling a supply voltage or a clock frequency to an integrated circuit (IC). Various additional embodiments include circuitry for controlling a supply voltage or a clock frequency of an IC. In some cases, a method includes: locating a set of temperature sensors on bin locations in an IC; determining temperature bounds of the bin locations in the IC as a function of a determined temperature at the set of temperature sensors; determining timing constraints as a function of supply voltages at the bin locations and the determined temperature at the set of temperature sensors; and determining operational voltage bounds for the IC as a function of the determined temperature at the set of temperature sensors. | 01-29-2015 |
20150046739 | REVERSE PERFORMANCE BINNING - Various embodiments provide systems, computer program products and computer implemented methods. In some embodiments, the system includes a computer-implemented method of binning at least one integrated circuit chip, the method including determining a baseline operational voltage for the at least one integrated circuit chip, determining a total operational power threshold for the at least one integrated circuit chip, determining an initial performance characteristic for a first component of the at least one integrated circuit chip, operating the first component at a driving voltage higher than the baseline voltage to raise the initial performance characteristic of the first component to a raised performance characteristic while ensuring that operational power does not exceed the operational power threshold and assigning the at least one integrated circuit chip to a performance bin based on the raised performance characteristic. | 02-12-2015 |