Patent application number | Description | Published |
20090054804 | Neurophysiologic monitoring system - The present invention relates to a system and methods generally aimed at surgery. More particularly, the present invention is directed at a system and related methods for performing surgical procedures and assessments involving the use of neurophysiology. | 02-26-2009 |
20100006784 | METHOD AND SYSTEM FOR A LIGHT SOURCE ASSEMBLY SUPPORTING DIRECT COUPLING TO AN INTEGRATED CIRCUIT - Methods and systems for a light source assembly supporting direct coupling to a photonically enabled complementary metal-oxide semiconductor (CMOS) chip are disclosed. The assembly may include a laser, a microlens, a turning mirror, reciprocal and/or non-reciprocal polarization rotators, and an optical bench. The laser may generate an optical signal that may be focused utilizing the microlens. The optical signal may be reflected at an angle defined by the turning mirror, and may be transmitted out of the light source assembly to one or more grating couplers in the chip. The laser may include a feedback insensitive laser. The light source assembly may include two electro-thermal interfaces between the optical bench, the laser, and a lid affixed to the optical bench. The turning mirror may be integrated in a lid affixed to the optical bench or may be integrated in the optical bench. | 01-14-2010 |
20100046955 | INTEGRATED TRANSCEIVER WITH LIGHTPIPE COUPLER - Systems and methods for configuring an integrated transceiver are disclosed. In one embodiment, very small form factor transceivers can be configured to allow 10G optical interconnects over distances up to 2k km. Transceiver circuitry can be integrated on a single die, and be electrically connected to a transmitter such as a laser-diode and a receiver such as a photo-diode. In one embodiment, the laser and photo diodes can be edge-operating, and be mounted on the die. In one embodiment, one or both of the diodes can be surface-operating so as to allow relaxation of alignment requirement. In one embodiment, one or both of the diodes can be mounted to a submount that is separate from the die so as to facilitate separate assembly and testing. In one embodiment, the diodes can be optically coupled to a ferrule via an optical coupling element so as to manage loss in certain situations. | 02-25-2010 |
20110236029 | INTEGRATED TRANSCEIVER WITH LIGHTPIPE COUPLER - A transceiver comprising a CMOS chip and a laser coupled to the chip may be operable to communicate an optical source signal from a semiconductor laser into the CMOS chip. The optical source signal may be used to generate first optical signals that are transmitted from the CMOS chip to optical fibers coupled to the CMOS chip. Second optical signals may be received from the optical fibers and converted to electrical signals via photodetectors in the CMOS chip. The optical source signal may be communicated from the semiconductor laser into the CMOS chip via optical fibers in to a top surface and the first optical signals may be communicated out of a top surface of the CMOS chip. The optical source signal may be communicated into the CMOS chip and the first optical signals may be communicated from the CMOS chip via optical couplers, which may comprise grating couplers. | 09-29-2011 |
20110243569 | INTEGRATED TRANSCEIVER WITH LIGHTPIPE COUPLER - A transceiver comprising a plurality of CMOS chips may be operable to communicate an optical source signal from a semiconductor laser into a first CMOS chip via optical couplers. The optical source signal may be used to generate first optical signals that are transmitted from the first CMOS chip to optical fibers coupled to the first CMOS chip via one or more optical couplers. Second optical signals may be received from the optical fibers and converted to electrical signals via photodetectors in the first CMOS chip. The optical source signal may be communicated from the semiconductor laser into the first CMOS chip via optical fibers in to a top surface and the first optical signals may be communicated out of a top surface of the first CMOS chip. The electrical signals may be communicated to at least a second of the plurality of CMOS chips comprising electronic devices. | 10-06-2011 |
20120177378 | Novel Low-Cost Transceiver Approach - A transceiver comprising a CMOS chip and a plurality of semiconductor lasers coupled with the CMOS chip may be operable to communicate optical source signals from the plurality of semiconductor lasers into the CMOS chip. The source signals may be used to generate first optical signals that may be transmitted from the CMOS chip to optical fibers. Second optical signals may be received from the optical fibers and converted to electrical signals for use by the CMOS chip. The optical source signals may be communicated from the semiconductor lasers into the CMOS chip via optical fibers in to a top surface and the first optical signals may be communicated out of a top surface of the CMOS chip. The first optical signals may be communicated from the CMOS chip via optical couplers, which may comprise grating couplers. | 07-12-2012 |
20120177380 | Novel Low-Cost Transceiver Approach - A transceiver comprising a plurality of CMOS chips, a first chip comprising optical and optoelectronic devices and at least a second chip comprising electronic devices may be operable to communicate an optical source signal from a semiconductor laser into the first CMOS chip. The optical source signal may be used to generate first optical signals that may be transmitted from the first CMOS chip to optical fibers. Second optical signals may be received from the optical fibers and converted to electrical signals via photodetectors. The optical source signal may be communicated from the semiconductor laser into the CMOS chip via optical fibers in to a top surface and the first optical signals may be communicated out of a top surface of the CMOS chip. The first optical signals may be communicated from the first CMOS chip via optical couplers, which may comprise grating couplers. | 07-12-2012 |
20120177381 | Method And System For A Photonic Interposer - Methods and systems for a photonic interposer are disclosed and may include receiving one or more continuous wave (CW) optical signals in a silicon photonic interposer from an external optical source, either from an optical source assembly or from optical fibers coupled to the silicon photonic interposer. The received CW optical signals may be processed based on electrical signals received from the electronics die. The modulated optical signals may be received in the silicon photonic interposer from optical fibers coupled to the silicon photonic interposer. Electrical signals may be generated in the silicon photonic interposer based on the received modulated optical signals, and may then be communicated to the electronics die via copper pillars. Optical signals may be communicated into and/or out of the silicon photonic interposer utilizing grating couplers. The electronics die may comprise one or more of: a processor core, a switch core, or router. | 07-12-2012 |
20120205524 | Method And System For A Light Source Assembly Supporting Direct Coupling To An Integrated Circuit - Methods and systems for a light source assembly for coupling to a photonically enabled complementary metal-oxide semiconductor (CMOS) chip are disclosed. The light source assembly may comprise a laser, a microlens, a turning mirror, and an optical bench, and may generate an optical signal utilizing the laser, focus the optical signal utilizing the microlens, and reflect the optical signal at an angle defined by the turning mirror. The reflected optical signal may be transmitted out of the assembly to grating couplers in the photonically enabled CMOS chip. The assembly may comprise a non-reciprocal polarization rotator, comprising a latching faraday rotator. The assembly may comprise a reciprocal polarization rotator, which may comprise a half-wave plate comprising birefringent materials operably coupled to the optical bench. The turning mirror may be integrated in the optical bench and may reflect the optical signal to transmit through a lid operably coupled to the optical bench. | 08-16-2012 |
20120301149 | Method And System For Hybrid Integration Of Optical Communication Systems - Methods and systems for hybrid integration of optical communication systems are disclosed and may include receiving continuous wave (CW) optical signals in a silicon photonics die (SPD) from an optical source external to the SPD. The received CW optical signals may be processed based on electrical signals received from an electronics die bonded to the SPD via metal interconnects. Modulated optical signals may be received in the SPD from optical fibers coupled to the SPD. Electrical signals may be generated in the SPD based on the received modulated optical signals and communicated to the electronics die via the metal interconnects. The CW optical signals may be received from an optical source assembly coupled to the SPD and/or from one or more optical fibers coupled to the SPD. The received CW optical signals may be processed utilizing one or more optical modulators, which may comprise Mach-Zehnder interferometer modulators. | 11-29-2012 |
20130044978 | Method And System For A Multi-Core Fiber Connector - Methods and systems for a multi-core fiber connector are disclosed and may include communicating optical signals in a fiber comprising a multi-core. The connectors may comprise dimensions to fit one or more of: SC, LC, FC, or MU connectors. The optical signals may be collimated utilizing a lens in the connectors, and may comprise a graded-index (GRIN) lens or a ball lens. The connectors may comprise a ferrule assembly that encompasses an end of the optical fiber and is at least partially within a stem assembly. The ferrule assembly may comprise zirconia and the stem assembly may comprise stainless steel. The lens may be fixed adjacent to the ferrule assembly utilizing a stainless steel tube. The collimated optical signals may be communicated to a receiving lens that may focus the collimated optical signals onto a plurality of optical cores in a receiving optical fiber. | 02-21-2013 |
20130090568 | Neurophysiologic Monitoring System - The present invention relates to a system and methods generally aimed at surgery. More particularly, the present invention is directed at a system and related methods for performing surgical procedures and assessments involving the use of neurophysiology. | 04-11-2013 |
20130336664 | METHOD AND SYSTEM FOR A LIGHT SOURCE ASSEMBLY SUPPORTING DIRECT COUPLING TO AN INTEGRATED CIRCUIT - Methods and systems for a photonically enabled complementary metal-oxide semiconductor (CMOS) chip are disclosed. The CMOS chip may comprise a laser, a microlens, a turning mirror, and an optical bench, and may generate an optical signal utilizing the laser, focus the optical signal utilizing the microlens, and reflect the optical signal at an angle defined by the turning mirror. The reflected optical signal may be transmitted into the photonically enabled CMOS chip, which may comprise a non-reciprocal polarization rotator, comprising a latching faraday rotator. The CMOS chip may comprise a reciprocal polarization rotator, which may comprise a half-wave plate comprising birefringent materials operably coupled to the optical bench. The turning mirror may be integrated in the optical bench and may reflect the optical signal to transmit through a lid operably coupled to the optical bench. | 12-19-2013 |
20140306131 | LIGHT SOURCE ASSEMBLY SUPPORTING DIRECT COUPLING TO AN INTEGRATED CIRCUIT - Methods and systems for a photonically enabled complementary metal-oxide semiconductor (CMOS) chip are disclosed. The CMOS chip may comprise a plurality of lasers, a microlens, a turning mirror, and an optical bench, and may generate optical signals utilizing the lasers, focus the optical signals utilizing the microlens, and reflect the optical signals at an angle defined by the turning mirror. The reflected optical signals may be transmitted into the photonically enabled CMOS chip, which may comprise a non-reciprocal polarization rotator, comprising a latching faraday rotator. The CMOS chip may comprise a reciprocal polarization rotator, which may comprise a half-wave plate comprising birefringent materials operably coupled to the optical bench. The turning mirror may be integrated in the optical bench and may reflect the optical signals to transmit through a lid operably coupled to the optical bench. | 10-16-2014 |
20140369693 | METHOD AND SYSTEM FOR A PHOTONIC INTERPOSER - Methods and systems for a photonic interposer are disclosed and may include receiving one or more continuous wave (CW) optical signals in a silicon photonic interposer from an optical source external to the silicon photonic interposer. The received CW optical signals may be processed based on electrical signals received from a CMOS electronics die bonded to the interposer, and modulated optical signals may be received in the interposer via optical couplers on the interposer. Electrical signals may be generated in the interposer based on the received modulated optical signals, and may be communicated to the CMOS electronics die. The generated electrical signals to may be communicated to the CMOS electronics die via copper pillars. The CW optical signals may be received in the interposer from an optical source assembly coupled to the interposer. The CW optical signals may be received from optical fibers coupled to the interposer. | 12-18-2014 |
20150037044 | METHOD AND SYSTEM FOR AN OPTICAL COUPLER FOR SILICON PHOTONICS DEVICES - Methods and systems for an optical coupler for photonics devices are disclosed and may include a photonics transceiver comprising a silicon photonics die, an optical source module, and a fiber connector for receiving optical fibers and including a die coupler and an optical coupling element. The die coupler may be bonded to a top surface of the photonics die and aligned above an array of grating couplers. The optical coupling element may be attached to the die coupler and the electronics die and the source module may be bonded to the top surface of the photonics die. A continuous wave (CW) optical signal may be received in the photonics die from the optical source module. Modulated optical signals may be received in the photonics die from optical fibers coupled to the fiber connector. | 02-05-2015 |