Patent application number | Description | Published |
20090115008 | MANUFACTURING METHOD OF AN ELECTRONIC DEVICE INCLUDING OVERMOLDED MEMS DEVICES - A method manufactures an electronic device comprising a MEMS device overmolded in a protective casing. The MEMS device includes an active surface wherein a portion of the MEMS device is integrated, and is sensitive, through a membrane, to chemical/physical variations of a fluid. Prior to the molding step, at least one resin layer is formed on at least one region overlying the active surface in correspondence with the membrane. After, at least one portion of at least one resin layer is removed from at least one region, so that in the region an opening is formed, through which the MEMS device is activated from the outside of the protective casing. | 05-07-2009 |
20100165581 | PACKAGE FOR MICRO-ELECTRO-MECHANICAL SYSTEMS OF THE MEMS TYPE AND CORRESPONDING MANUFACTURING PROCESS - An embodiment of a package for Micro-Electro-Mechanical Systems of the MEMS type comprising a base for the assembly of said MEMS and a protective envelope, for containing the MEMS. The base is a multi-layer structure with at least one layer of composite material to make a substrate and at least one flexible wing projecting from the substrate, such base being a monolithic element suitable for being connected to external connection tracks. | 07-01-2010 |
20100297797 | MANUFACTURING METHOD OF AN ELECTRONIC DEVICE INCLUDING OVERMOLDED MEMS DEVICES - A method manufactures an electronic device comprising a MEMS device overmolded in a protective casing. The MEMS device includes an active surface wherein a portion of the MEMS device is integrated, and is sensitive, through a membrane, to chemical/physical variations of a fluid. Prior to the molding step, at least one resin layer is formed on at least one region overlying the active surface in correspondence with the membrane. After, at least one portion of at least one resin layer is removed from at least one region, so that in the region an opening is formed, through which the MEMS device is activated from the outside of the protective casing. | 11-25-2010 |
20110274299 | ENCAPSULATED MICRO-ELECTRO-MECHANICAL DEVICE, IN PARTICULAR A MEMS ACOUSTIC TRANSDUCER - An encapsulated micro-electro-mechanical device, wherein a MEMS chip is encapsulated by a package formed by a first, a second, and a third substrates that are bonded together. The first substrate has a main surface bearing the MEMS chip, the second substrate is bonded to the first substrate and defines a chamber surrounding the MEMS chip, and the third substrate is bonded to the second substrate and upwardly closes the chamber. A grid or mesh structure of electrically conductive material is formed in or on the third substrate and overlies the MEMS chip; the second substrate has a conductive connection structure coating the walls of the chamber, and the first substrate incorporates an electrically conductive region, which forms, together with the conductive layer and the grid or mesh structure, a Faraday cage. | 11-10-2011 |
20120132817 | ENCAPSULATED PHOTOMULTIPLIER DEVICE OF SEMICONDUCTOR MATERIAL, FOR USE, FOR EXAMPLE, IN MACHINES FOR PERFORMING POSITRON-EMISSION TOMOGRAPHY - An embodiment of a photomultiplier device is formed by a base substrate of insulating organic material forming a plurality of conductive paths and carrying a plurality of chips of semiconductor material. Each chip integrates a plurality of photon detecting elements, such as Geiger-mode avalanche diodes, and is bonded on a first side of the base substrate. Couplings for photon-counting and image-reconstruction units are formed on a second side of the base substrate. The first side of the base substrate is covered with a transparent encapsulating layer of silicone resin, which, together with the base substrate, bestows stiffness on the photomultiplier device, preventing warpage, and covers and protects the chips. | 05-31-2012 |
20140015071 | ENCAPSULATED MICRO-ELECTRO-MECHANICAL DEVICE, IN PARTICULAR A MEMS ACOUSTIC TRANSDUCER - An encapsulated micro-electro-mechanical device, wherein a MEMS chip is encapsulated by a package formed by a first, a second, and a third substrates that are bonded together. The first substrate has a main surface bearing the MEMS chip, the second substrate is bonded to the first substrate and defines a chamber surrounding the MEMS chip, and the third substrate is bonded to the second substrate and upwardly closes the chamber. A grid or mesh structure of electrically conductive material is formed in or on the third substrate and overlies the MEMS chip; the second substrate has a conductive connection structure coating the walls of the chamber, and the first substrate incorporates an electrically conductive region, which forms, together with the conductive layer and the grid or mesh structure, a Faraday cage. | 01-16-2014 |
20140291781 | METHOD OF PACKAGING A MEMS TRANSDUCER DEVICE AND PACKAGED MEMS TRANSDUCER DEVICE - A packaged MEMS transducer device comprising: a die, including: a semiconductor body having a front side and a back side, opposite to one another in a first direction, at least one cavity extending through the semiconductor body between the front side and the back side, and at least one membrane extending on the front side at least partially suspended over the cavity; and a package designed to house the die on an inner surface thereof. The transducer device moreover includes a sealing layer extending on the back side of the semiconductor body for sealing the cavity, and includes a paste layer extending between the sealing layer and the inner surface of the package for firmly coupling the die to the package. | 10-02-2014 |
20140312484 | ELECTRONIC ASSEMBLY FOR MOUNTING ON ELECTRONIC BOARD - An embodiment of an electronic assembly for mounting on an electronic board includes a plurality of electric contact regions exposed on a mounting surface of the electronic board. The electronic assembly includes a chip of semiconductor material in which at least one electronic component is integrated, at least one support element including a first main surface and a second main surface opposite to the first main surface, the chip being enclosed by the at least one support element, a heat dissipation plate thermally coupled to said chip to dissipate the heat produced by it, exposed on the first main surface of the support element, a plurality of contact elements, each electrically coupled to a respective electric terminal of the electronic component integrated in the chip, exposed on the same first main surface of which is exposed to the dissipation plate. Also included are a plurality of electric connection elements, each adapted to electrically intercouple a respective contact element of the electronic assembly with a corresponding electric contact region of the electronic board, in such a way that the second main surface of the at least one support element faces the mounting surface of the electronic board. | 10-23-2014 |
20140355995 | OPTOELECTRONIC DEVICE HAVING IMPROVED OPTICAL COUPLING - An optoelectronic device may include a package having a component for sending/receiving optical signals along a first direction, and a chip of semiconductor material housed within the package. The chip may have a main surface and a portion exposed on the main surface for sending/receiving the optical signals along a second direction different from the first direction. The optoelectronic device may further include a component for deflecting the optical signals between the first direction and the second direction, the component being mounted on the main surface. | 12-04-2014 |