Patent application number | Description | Published |
20080196664 | MOISTURE BARRIER COATINGS FOR ORGANIC LIGHT EMITTING DIODE DEVICES - A process for fabricating an amorphous diamond-like film layer for protection of a moisture or oxygen sensitive electronic device is described. The process includes forming a plasma from silicone oil, depositing an amorphous diamond-like film layer from the plasma, and | 08-21-2008 |
20090015142 | LIGHT EXTRACTION FILM FOR ORGANIC LIGHT EMITTING DIODE DISPLAY DEVICES - A multifunctional optical film for enhancing light extraction includes a flexible substrate, a structured layer, and a backfill layer. The structured layer effectively uses microreplicated diffractive or scattering nanostructures located near enough to the light generation region to enable extraction of an evanescent wave from an organic light emitting diode (OLED) device. The backfill layer has a material having an index of refraction different from the index of refraction of the structured layer. The backfill layer also provides a planarizing layer over the structured layer in order to conform the light extraction film to a layer of an OLED display device. The film may have additional layers added to or incorporated within it to an emissive surface in order to effect additional functionalities beyond improvement of light extraction efficiency. | 01-15-2009 |
20090155458 | METHOD FOR MANUFACTURING ON A FILM SUBSTRATE AT A TEMPERATURE ABOVE ITS GLASS TRANSITION - A method for preparing a flexible film substrate with a low glass transition temperature can be used in the production of an article that retains dimensions and improves the surface smoothness after high temperature processing. The invention, for example, would enable low temperature films such as PET and PEN to be dimensionally stable and ultra flat at conditions commonly used in electronic processing which can typically exceed 200° C. More specifically, the methods enable the use of e.g. barrier films based on PET or PEN in OLED/PLED manufacturing. | 06-18-2009 |
20090252894 | MOISTURE BARRIER COATINGS FOR ORGANIC LIGHT EMITTING DIODE DEVICES - A barrier assembly having a flexible or rigid substrate, an organic electronic device, and one or more layers of diamond-like film. The diamond-like film layers can be used to mount, cover, encapsulate or form composite assemblies for protection of moisture or oxygen sensitive articles such as organic light emitting diode devices, photovoltaic devices, organic transistors, and inorganic thin film transistors. The diamond-like film layers can also provide for edge sealing of adhesive bond lines in the assemblies. | 10-08-2009 |
20100073936 | FLEXIBLE HIGH-TEMPERATURE ULTRABARRIER - A flexible barrier assembly having a flexible visible light-transmissive substrate having a Tg greater than or equal to that of heat-stabilized polyethylene terephthalate (“HSPET”) overcoated with a first polymer layer having a Tg greater than or equal to that of HSPET and further overcoated with at least two visible light-transmissive inorganic barrier layers separated by at least one second polymer layer having a Tg greater than or equal to that of HSPET can be used to mount, cover, encapsulate or form moisture- and oxygen-sensitive articles such as organic light emitting devices and light valves. | 03-25-2010 |
20100272933 | FLEXIBLE ENCAPSULATING FILM SYSTEMS - An encapsulating film system comprises (a) a flexible barrier film, (b) an adhesive on at least a portion of the flexible barrier film, and (c) a desiccant on at least a portion of the flexible barrier film or the adhesive. | 10-28-2010 |
20110223434 | GRADIENT COMPOSITION BARRIER - Generally, the present disclosure relates to barrier assemblies that have a reduced transmission of water vapor, and processes for making the barrier assemblies. The barrier assemblies include a substrate and an inorganic layer disposed adjacent the substrate. The inorganic layer has a composition that changes throughout the thickness of the inorganic layer. The composition includes at least a first and a second inorganic material, and the relative proportion of the first and second inorganic material in the composition changes throughout the thickness of the inorganic layer. A process for making the barrier assemblies includes dual AC sputtering of pairs of targets having different elemental compositions. | 09-15-2011 |
20110229992 | LIGHT EXTRACTION FILM FOR ORGANIC LIGHT EMITTING DIODE LIGHTING DEVICES - A multifunctional optical film for enhancing light extraction includes a flexible substrate, a structured layer, and a backfill layer. The structured layer effectively uses microreplicated diffractive or scattering nanostructures located near enough to the light generation region to enable extraction of an evanescent wave from an organic light emitting diode (OLED) device. The backfill layer has a material having an index of refraction different from the index of refraction of the structured layer. The backfill layer also provides a planarizing layer over the structured layer in order to conform the light extraction film to a layer of an OLED lighting device such as solid state lighting devices or backlight units. The film may have additional layers added to or incorporated within it to an emissive surface in order to effect additional functionalities beyond improvement of light extraction efficiency. | 09-22-2011 |
20120003448 | BARRIER ASSEMBLY WITH ENCAPSULANT AND PHOTOVOLTAIC CELL - An assembly that includes a barrier film interposed between a first polymeric film substrate and a first major surface of a pressure sensitive adhesive layer is provided. The first polymeric film substrate has a first coefficient of thermal expansion that is, in some embodiments, up to 50 parts per million per Kelvin. The pressure sensitive adhesive layer has a second major surface opposite the first major surface that is disposed on a second polymeric film substrate. The second polymeric film substrate is typically resistant to degradation by ultraviolet light. In some embodiments, the second polymeric film substrate has a second coefficient of thermal expansion that is at least 40 parts per million per Kelvin higher than the first coefficient of thermal expansion. The assembly is transmissive to visible and infrared light. | 01-05-2012 |
20120003451 | BARRIER ASSEMBLY - An assembly that includes a barrier film interposed between a first polymeric film substrate and a first major surface of a pressure sensitive adhesive layer is provided. The first polymeric film substrate has a first coefficient of thermal expansion that is, in some embodiments, up to 50 parts per million per Kelvin. The pressure sensitive adhesive layer has a second major surface opposite the first major surface that is disposed on a second polymeric film substrate. The second polymeric film substrate is typically resistant to degradation by ultraviolet light. In some embodiments, the second polymeric film substrate has a second coefficient of thermal expansion that is at least 40 parts per million per Kelvin higher than the first coefficient of thermal expansion. The assembly is transmissive to visible and infrared light. | 01-05-2012 |
20120003484 | MOISTURE RESISTANT COATING FOR BARRIER FILMS - A barrier film having a substrate, a base polymer layer applied to the substrate, an oxide layer applied to the base polymer layer, and a top coat polymer layer applied to the oxide layer. An optional inorganic layer can be applied over the top coat polymer layer. The top coat polymer includes a silane and an acrylate co-deposited to form the top coat layer. The use of a silane co-deposited with an acrylate to form the top coat layer of the barrier films provide for enhanced resistance to moisture and improved peel strength adhesion of the top coat layer to the underlying barrier stack layers. | 01-05-2012 |
20120208033 | BARRIER FILM - A barrier film is disclosed that includes a polymeric film substrate and at least first and second polymer layers separated by an inorganic barrier layer. The first polymer layer is disposed on the polymeric film substrate. At least one of the first or second polymer layers is prepared from co-deposited amino silane and acrylate or methacrylate monomer. A method of making the barrier film is also disclosed. | 08-16-2012 |
20120227809 | FLEXIBLE ASSEMBLY AND METHOD OF MAKING AND USING THE SAME - An assembly including a pressure sensitive adhesive layer at least 0.25 mm in thickness disposed on a barrier assembly, wherein the barrier assembly comprises a polymeric film substrate and a barrier film. The assembly is flexible and transmissive to visible and infrared light. A pressure sensitive adhesive in the form of a film at least 0.25 mm thick is also provided, the pressure sensitive adhesive including a polyisobutylene having a weight average molecular weight less than 300,000 grams per mole; and a hydrogenated hydrocarbon tackifier. Methods of making and using the assembly and the pressure sensitive adhesive are also included. | 09-13-2012 |
20120229893 | MULTI-LAYER OPTICAL FILMS - Multi-layer optical film ( | 09-13-2012 |
20120273976 | MOISTURE BARRIER COATINGS FOR ORGANIC LIGHT EMITTING DIODE DEVICES - A process for fabricating an amorphous diamond-like film layer for protection of a moisture or oxygen sensitive electronic device is described. The process includes forming a plasma from silicone oil, depositing an amorphous diamond-like film layer from the plasma, and | 11-01-2012 |
20130302627 | VAPOR-DEPOSITED COATING FOR BARRIER FILMS AND METHODS OF MAKING AND USING THE SAME - A barrier film including a substrate, a base polymer layer applied on a major surface of the substrate, an oxide layer applied on the base polymer layer, and a protective polymer layer applied on the oxide layer. The protective polymer layer is formed as the reaction product of a first (meth)acryloyl compound and a (meth)acryl-silane compound derived from a Michael reaction between a second (meth)acryloyl compound and an aminosilane. The first and second (meth)acryloyl compounds may be the same. In some embodiments, a multiplicity of alternating layers of the oxide layer and the protective polymer layer may be used. An oxide layer can be applied over the top protective polymer layer. The barrier films provide, in some embodiments, enhanced resistance to moisture and improved peel strength adhesion of the protective polymer layer(s) to the underlying layers. A process of making, and methods of using the barrier film are also described. | 11-14-2013 |
20130323519 | COATINGS FOR BARRIER FILMS AND METHODS OF MAKING AND USING THE SAME - A barrier film including a substrate, a base (co)polymer layer applied on a major surface of the substrate, an oxide layer applied on the base (co)polymer layer, and a protective (co)polymer layer applied on the oxide layer. The protective (co)polymer layer is formed as the reaction product of a first (meth)acryloyl compound and a (meth)acryl-silane compound derived from a Michael reaction between a second (meth)acryloyl compound and an aminosilane. The first and second (meth)acryloyl compounds may be the same. In some embodiments, a multiplicity of alternating layers of the oxide layer and the protective (co)polymer layer may be used. An oxide layer can be applied over the top protective (co)polymer layer. The barrier films provide, in some embodiments, enhanced resistance to moisture and improved peel strength adhesion of the protective (co)polymer layer(s) to the underlying layers. A process of making, and methods of using the barrier film are also described. | 12-05-2013 |
20140283910 | EDGE PROTECTED BARRIER ASSEMBLIES - The present application is directed to an assembly comprising an electronic device, and a multilayer film. The multilayer film comprises a substrate adjacent the electronic device, a barrier stack adjacent the substrate opposite the electronic device, and a weatherable sheet adjacent the barrier stack opposite the substrate. The multilayer film is transparent and flexible and the barrier stack and the substrate are insulated from the environment. | 09-25-2014 |
20140290736 | BARRIER ASSEMBLIES - The present application is directed to an assembly comprising an electronic device and a multilayer film. The multilayer film comprises a barrier stack adjacent the electronic device, and a weatherable sheet adjacent the barrier stack opposite the electronic device. The weatherable sheet is bonded to the electronic device. | 10-02-2014 |