| Patent application number | Description | Published |
|---|
| 20080305428 | METHOD FOR APPLYING A RESIST LAYER, USES OF ADHESIVE MATERIALS, AND ADHESIVE MATERIALS AND RESIST LAYER - A method in which a resist layer is applied to a base layer is disclosed. The resist layer includes an adhesive material, and the adhesive force of the adhesive material decreases or increases during an irradiation process. Residues of the resist layer may be stripped using the disclosed method. | 12-11-2008 |
| 20080315423 | SEMICONDUCTOR DEVICE - A semiconductor device includes a carrier, a chip including a first face having a contact area, where the chip is attached to the carrier such that the contact area faces away from the carrier, a copper connector configured for attachment to the contact area, and a solder material configured to couple the copper connector to the contact area. | 12-25-2008 |
| 20090079038 | Method Of Making An Integrated Circuit Including Singulating A Semiconductor Wafer - A method of making an integrated circuit includes providing a semiconductor wafer having a first surface and a second surface opposite the first surface, at least one of the first surface and the second surface including a metallization layer deposited onto the surface. The method additionally includes forming a first trench in the semiconductor wafer extending from one of the first surface and the second surface toward an other of the first surface and the second surface. The method further includes sawing a second trench in the other surface until the second trench communicates with the first trench, thus singulating the integrated circuit from the semiconductor wafer. | 03-26-2009 |
| 20090102032 | Electronic Device - An electronic device is disclosed. In one embodiment, the electronic device includes a substrate, a plurality of conducting lines formed on a first conducting material that is disposed on the substrate, and a layer of a second conducting material disposed on the plurality of conducting lines. The conducting lines include a top face and a side face. The layer of the second conducting material includes a first thickness disposed on each of the top faces and a second thickness disposed on each of the side faces. To this end, the first thickness is greater than the second thickness. | 04-23-2009 |
| 20100330744 | ULTRATHIN SEMICONDUCTOR CIRCUIT HAVING CONTACT BUMPS AND CORRESPONDING PRODUCTION METHOD - The invention relates to an ultrathin semiconductor circuit having contact bumps and to a corresponding production method. The semiconductor circuit includes a bump supporting layer having a supporting layer thickness and having a supporting layer opening for uncovering a contact layer element being formed on the surface of a semiconductor circuit. An electrode layer is situated on the surface of the contact layer element within the opening of the bump supporting layer, on which electrode layer is formed a bump metallization for realizing the contact bump. On account of the bump supporting layer, a thickness of the semiconductor circuit can be thinned to well below 300 micrometers, with the wafer reliably being prevented from breaking. Furthermore, the moisture barrier properties of the semiconductor circuit are thereby improved. | 12-30-2010 |
| 20110084369 | DEVICE INCLUDING A SEMICONDUCTOR CHIP AND A CARRIER AND FABRICATION METHOD - A description is given of a method. In one embodiment the method includes providing a semiconductor chip with semiconductor material being exposed at a first surface of the semiconductor chip. The semiconductor chip is placed over a carrier with the first surface facing the carrier. An electrically conductive material is arranged between the semiconductor chip and the carrier. Heat is applied to attach the semiconductor chip to the carrier. | 04-14-2011 |
| 20110107595 | SEMICONDUCTOR DEVICE - A method of electrically interconnecting a semiconductor chip to another electronic device including providing a carrier including contact pins and a chip attached to the carrier, the chip having a copper contact pad that faces away from the carrier, extending a copper electrical connector between the contact pins and the contact pad, and diffusion soldering the copper electrical connector to the active area with a solder material including tin to form a solder connection including a contiguous bronze coating disposed between and in direct contact with both the copper electrical connector and the contact pad. | 05-12-2011 |
| 20110146567 | Device for Treating Wafers on Assembly Carriers - A device for treating wafers on assembly carriers is disclosed. A wafer to be treated can be fixed on a liquid film that is located between the front side of the wafer and the assembly carrier by freezing of the film. | 06-23-2011 |
