Patent application number | Description | Published |
20080274355 | SEMIAROMATIC POLYAMIDE MOLDING COMPOSITIONS AND THEIR USE - A polyamide molding composition with the following constitution is described:
| 11-06-2008 |
20100125119 | Polyamide molding material, molded articles that can be produced therefrom and the use thereof - A novel polyamide molding material for highly lustrous and rigid polyamide molded articles contains a polyamide mixture consisting of a semicrystalline linear polyamide, a special branched graft polyamide, an amorphous polyamide, reinforcing substances as well as conventional additives. | 05-20-2010 |
20100159175 | POLYAMIDE SHEET SILICATE COMPOSITIONS - The invention relates to polyamide sheet silicate compositions, containing an untreated clay mineral and a water-soluble polyamide, the concentration of the clay material being greater than 30% by weight. Furthermore the invention relates to nanocomposites which contain clay minerals distributed homogeneously in a water-insoluble thermoplastic matrix. These nanocomposites are produced by mixing the polyamide sheet silicate composition and a water-insoluble thermoplastic in the melt. | 06-24-2010 |
20110123749 | SEMIAROMATIC MOULDING COMPOSITIONS AND USES OF THESE - A polyamide moulding composition with the following constitution is described:
| 05-26-2011 |
20110184099 | PARTIALLY AROMATIC MOULDING COMPOSITIONS AND THEIR USES - Polyamide moulding composition, in particular for use for components of electronic and/or electrical components, having the following composition:
| 07-28-2011 |
20110217495 | POLYAMIDE MOULDING MATERIALS FOR THE PRODUCTION OF MOULDED ARTICLES HAVING REDUCED SURFACE CARBONIZATION - Moulded articles having reduced surface carbonization and longer retention of the mechanical properties and methods of producing same are presented. In an embodiment, the moulded article comprises polyamides with nanofillers, which can be produced by means of injection moulding or extrusion, in particular by extrusion blow moulding, coextrusion blow moulding or sequential blow moulding with and without 3D hose manipulation. For example, the polyamide moulding materials for the production of moulded articles have reduced surface carbonization in the moulded articles in subsequent long-term use at elevated temperatures. | 09-08-2011 |
20110281990 | POLYAMIDE MOULDING MATERIAL AND USE THEREOF FOR PRODUCTION OF LED HOUSING COMPONENTS - What is described is a polyamide moulding material based on semicrystalline polyamides for production of LED housings or housing components with high strength, high long-term reflectivity and low blistering tendency. The polyamide moulding material proposed consists of the following components | 11-17-2011 |
20120022194 | PARTIALLY AROMATIC POLYAMIDE MOULDING COMPOSITIONS AND THEIR USES - An unreinforced, halogen-free polyamide moulding composition which is provided with flame retardants and from which it is possible to produce electric and/or electronic components which can be reliably soldered, i.e. in particular without blisters being formed in the soldering process, in particular at 260° C. and possibly higher temperatures after water absorption and in the case of critical designs of the components, and which have an elongation at break of at least 5% and reliably achieve the UL94 classification V0. These polyamide moulding compositions have the following composition: (A) 62-87% by weight of a partially aromatic, partially crystalline copolyamide having a melting point of 270° C. to 320° C. and made up of 100% by weight of diacid fraction composed of: 50-100% by weight of terephthalic acid (TPA) and/or naphthalenedicarboxylic acid; 0-50% by weight of isophthalic acid (IPA), and 100% by weight of diamine fraction composed of at least one diamine selected from the group consisting of: butanediamine, pentanediamine, hexanediamine, octanediamine, methyloctanediamine, nonanediamine, decanediamine, undecanediamine and dodecanediamine; (B) 5-15% by weight of ionomer; (C) 8-18% by weight of flame retardants; (D) 0-5% by weight of additives; where the components (A)-(D) add up to 100% by weight. | 01-26-2012 |
20120321829 | SEMIAROMATIC MOLDING COMPOUNDS AND USES THEREOF - Disclosed is a polyamide molding compound having heat aging resistance for use as automobile or electrical components and composed of: (A) 27-84.99 wt % of a polyamide mixture consisting of (A1) at least one semiaromatic, semicrystalline polyamide having a melting point of 255° C. to 330° C., (A2) at least one caprolactam-containing polyamide that is different from (A1) and that has a caprolactam content of at least 50 wt %, where the total caprolactam content is 22-30 wt %, with respect to the polyamide mixture, (B) 15-65 wt % of at least one filler and reinforcing agent, (C) 0.01-3.0 wt % of at least one thermal stabilizer, and (D) 0-5.0 wt % of at least one additive, where the components (A)-(D) add up to 100 wt %. | 12-20-2012 |
20130164477 | POLYAMIDE SHEET SILICATE COMPOSITIONS - The invention relates to polyamide sheet silicate compositions, containing an untreated clay mineral and a water-soluble polyamide, the concentration of the clay material being greater than 30% by weight. Furthermore the invention relates to nanocomposites which contain clay minerals distributed homogeneously in a water-insoluble thermoplastic matrix. These nanocomposites are produced by mixing the polyamide sheet silicate composition and a water-insoluble thermoplastic in the melt. | 06-27-2013 |
20140171573 | POLYAMIDE MOLDING MATERIAL AND MOLDINGS MANUFACTURED FROM SAME - The present invention relates to heat-aging resistant polyamide molding materials based on partially crystalline, partially aromatic polyamides as well as to moldings manufactured therefrom. | 06-19-2014 |