Patent application number | Description | Published |
20080200811 | Ultrasonic transducer, method for manufacturing ultrasonic transducer, and ultrasonic endoscope - An ultrasonic transducer according to the invention includes a flexible sheet, a rigid body portion including a lower electrode made of at least a thin-film conductive material on a surface of the flexible sheet, a dividing portion which divides the rigid body portion into segments, and a plurality of transducer elements including the divided rigid body portion, has at least one transducer cell composed of one of the segments, an insulating partition portion bonded to the segment, an air gap portion surrounded by the partition portion, an upper electrode opposed to the lower electrode extending to the partition portion to sandwich the air gap portion therebetween, and an upper insulating layer formed on the upper electrode, and includes an upper protection film which continuously covers a surface portion of the transducer elements and the dividing portion. | 08-21-2008 |
20090058228 | ULTRASONIC TRANSDUCER, METHOD OF MANUFACTURING ULTRASONIC TRANSDUCER, ULTRASONIC DIAGNOSTIC APPARATUS, AND ULTRASONIC MICROSCOPE - A ultrasonic transducer of the invention comprises: a transducer cell including a first electrode and a second electrode disposed separated from the first electrode by an air gap portion; and an electret for applying a potential difference between the first electrode and the second electrode. The electret is disposed in a region where at least a part thereof does not overlap with the transducer cell when viewed from a transmitting direction of ultrasonic waves. | 03-05-2009 |
20090262605 | ULTRASOUND TRANSDUCER AND ELECTRONIC DEVICE - An ultrasound transducer includes a substrate, an ultrasound transducer cell placed on one surface of the substrate and having a lower electrode, a first gap portion placed on the lower electrode and an upper electrode placed on the first gap portion, a first conductive layer placed on the other surface of the substrate and electrically connected to one of the lower electrode and the upper electrode, an electret film placed on the first conductive layer, an insulating layer placed on the electret film, and a second conductive layer placed on the insulating layer and electrically connected to the one of the lower electrode and the upper electrode not electrically connected to the first conductive layer. | 10-22-2009 |
20110036808 | ULTRASONIC TRANSDUCER, ULTRASONIC TRANSDUCER FABRICATION METHOD, AND ULTRASONIC ENDOSCOPE - An ultrasonic transducer according to the present invention includes: two or more ultrasonic transducer cells, each of which has a lower electrode, a first insulating layer placed on the lower electrode, a cavity placed on the first insulating layer, a second insulating layer placed on the cavity, and an upper electrode placed above the second insulating layer; channels which communicate the cavities with each other; the second insulating layer placed on the channels; holes formed in the second insulating layer placed on the channels; and sealing portions which seal the holes, where that part of the sealing portions which enters the channels is the same in cross-sectional shape as the holes. | 02-17-2011 |
20130018269 | ULTRASOUND TRANSDUCER AND ULTRASOUND DIAGNOSTIC APPARATUS - An ultrasound transducer includes a substrate and a lower electrode layer, a lower insulating layer, an upper insulating layer, and an upper electrode layer. The lower insulating layer and the upper insulating layer are arranged to be opposed to each other via an air gap section. The upper insulating layer and the lower insulating layer are different in a material and thickness and satisfy Equation 1 below. In Equation 1, K | 01-17-2013 |
20130286786 | ULTRASOUND TRANSDUCER ARRAY, METHOD OF MANUFACTURING ULTRASOUND TRANSDUCER ARRAY AND ULTRASOUND ENDOSCOPE - An ultrasound transducer array according to an embodiment includes a substrate, a plurality of groove-like recesses arranged at a predetermined interval on one surface of the substrate, a cell region arranged between the recesses on the one surface side of the substrate, a flexible film configured to cover the substrate and the cell region and having fragility lower than fragility of the substrate, and a dividing groove having a width smaller than a width of the recess and reaching from the other surface of the substrate to the flexible film in the recess. | 10-31-2013 |
20140121526 | ULTRASOUND ELEMENT AND ULTRASOUND ENDOSCOPE - A US element includes a silicon substrate, wherein a lower electrode layer that has a plurality of lower electrode sections, and a plurality of lower wiring sections, and is connected to a lower electrode terminal to which a drive signal and a bias signal are applied, a lower insulating layer, an upper insulating layer in which a plurality of cavities are formed, an upper electrode layer that has a plurality of upper electrode sections and a plurality of upper wiring sections, and is connected to an upper electrode terminal at a ground potential for detecting a capacitance signal, and a protection layer are sequentially stacked on the silicon substrate, and the US element further includes a shield electrode section that is formed at least at an upper side of the lower wiring sections, and is connected to a shield electrode terminal at a ground potential. | 05-01-2014 |
20140128741 | ULTRASOUND ELEMENT AND ULTRASOUND ENDOSCOPE - An ultrasound element includes a silicon substrate, a lower electrode layer that has a plurality of lower electrode sections, and a plurality of lower wiring sections, and is connected to a lower electrode terminal to which a drive signal and a bias signal are applied, a lower insulating layer, an upper insulating layer in which a plurality of cavities smaller than the respective lower electrode sections are formed, an upper electrode layer that has a plurality of upper electrode sections that are disposed to face the respective lower electrode sections via the respective cavities, and are smaller than the lower electrode sections and larger than the cavities, and a plurality of upper wiring sections, and is connected to an upper electrode terminal at a ground potential that detects a capacitance signal, and a protection layer. | 05-08-2014 |