Malhotra, NY
Anil K. Malhotra, Rye Brook, NY US
Patent application number | Description | Published |
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20100297619 | GENETIC PREDICTION OF SCHIZOPHRENIA SUSCEPTIBILITY - Provided are methods of determining the likelihood that a patient will be diagnosed with schizophrenia. | 11-25-2010 |
Anil K. Malhotra, Bye Brook, NY US
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20100285455 | PREDICTION OF SCHIZOPHRENIA RISK USING HOMOZYGOUS GENETIC MARKERS - Provided are methods of identifying a genetic profile influencing the relative probability of a subject manifesting a phenotype that is at least partially heritable. Also provided are methods of determining the relative likelihood that a subject will manifest a phenotype that is at least partially heritable. Additionally, methods of determining the relative risk of a human subject for manifesting schizophrenia are provided. Further provided are methods of screening a human embryo in vitro for the risk of becoming a human manifesting schizophrenia. Also, methods of identifying a single nucleotide polymorphism (SNP) variant affecting the risk of a human subject for manifesting schizophrenia are provided. Methods of screening for a compound that may affect schizophrenia are additionally provided. | 11-11-2010 |
Anupam Malhotra, Tonawanda, NY US
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20100136199 | Cooking Cream - A cooking cream was prepared that is useful for cooking and preferably has a good whipping capability also. The cream comprises about 55 to 93% by weight water, about 5 to 45% by weight fat, about 1 to 10% by weight protein, about 0.5 to 10% by weight starch, and an effective amount of emulsifier. Preferably, the cream also contains an effective amount of stabilizer and an effective amount of buffer. | 06-03-2010 |
Ashwani K. Malhotra, Lagrangeville, NY US
Patent application number | Description | Published |
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20080286886 | Monitoring Cool-Down Stress in a Flip Chip Process Using Monitor Solder Bump Structures - A semiconductor chip and methods for forming the same. The semiconductor chip includes M regular solder bump structures and N monitor solder bump structures, M and N being positive integers. If a flip chip process is performed for the semiconductor chip, then the N monitor solder bump structures are more sensitive to a cool-down stress than the M regular solder bump structures. The cool-down stress results from a cool-down step of the flip chip process. Each of the M regular solder bump structures is electrically connected to either a power supply or a device of the semiconductor chip. Each of the N monitor solder bump structures is not electrically connected to a power supply or a device of the semiconductor chip. | 11-20-2008 |
20100155943 | SEMICONDUCTOR CHIP USED IN FLIP CHIP PROCESS - A semiconductor chip for forming the same. The semiconductor chip includes M regular solder bump structures and N monitor solder bump structures, M and N being positive integers. If a flip chip process is performed for the semiconductor chip, then the N monitor solder bump structures are more sensitive to a cool-down stress than the M regular solder bump structures. The cool-down stress results from a cool-down step of the flip chip process. Each of the M regular solder bump structures is electrically connected to either a power supply or a device of the semiconductor chip. Each of the N monitor solder bump structures is not electrically connected to a power supply or a device of the semiconductor chip. | 06-24-2010 |
Kushal Malhotra, Lake Grove, NY US
Patent application number | Description | Published |
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20090137334 | Method and apparatus for striking golf balls simulating the angular stances frequently found during play on a course - An efficient, low cost and versatile golf practice device, which stimulates the angular stances frequently found during play on a course. The practicing golfer stands on top of a turf practice platform. This platform sits flat on top a region comprising a plane. The plane cuts off a slice of the area of a sphere. The plane faces north towards the sky while the opposite side is comprised of a curved arc portion that faces south, towards the earth. The spherical slice, (containing the flat platform), fits as a male portion into and on top of a female inverted dome region. The female spherical slice itself encompasses a space less than a full hemisphere. The female spherical slice is set inside the top surface of a rectangular box of length and width proportions roughly similar to an average driving range mat. The golfer stands on the platform and is capable of simulating a plurality of hitting conditions using the simple process of manual adjustment. | 05-28-2009 |
Rimmy Malhotra, Huntington, NY US
Patent application number | Description | Published |
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20100078476 | System and method for funding via a prepaid card a financial product intended or targeted by the purchaser at the time of purchase - System and method for funding via a prepaid card a financial product intended at a time of purchase by a purchaser for a customer. A customer cash account is created and funds allocated to the prepaid card are redeemed solely as cash funds in the customer's cash account. The customer may either withdraw at least some of the cash funds in the customer's cash account or apply at least some of the cash funds in the customer's cash account to a financial product. In response to receiving the customer's instructions to apply at least some of the cash funds from the customer's cash account to a financial product selected by the customer as well as their acknowledgement of disclosures or consent to an agreement related to the selected financial product, the cash funds are applied to an associated financial product account. | 04-01-2010 |
R. Rimmy Malhotra, New York, NY US
Patent application number | Description | Published |
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20080228614 | Consumer-driven system and method for promoting philanthropic giving/lending and social activism based on customer purchases - A consumer-driven system and method for promoting philanthropic giving/lending and social activism based on customer purchases. The system and method optimizes the choices on the part of the Customer in the selection of one or more Funding Options and allocation of Funding Points among one or more selected Funding Options. Feedback information concerning the progress of the funds permits the Customer to evaluate the effectiveness or success of the Funding Option; target feedback content to the Customers that have provided funds via the sponsoring entity; and/or prompt the donor/lendor for additional involvement or action concerning the Funding Option to promote continued engagement on the part of the Customer. | 09-18-2008 |