| Patent application number | Description | Published |
|---|
| 20090029848 | Process for Producing Microparticulate Hardening Catalyst - A process for producing a microparticulate hardening catalyst, comprising the steps of jetting a liquid composition containing epoxy resin hardening catalyst (A), monomer having an ethylenically unsaturated group (B) and photopolymerization initiator (C) through a minute nozzle into a gas so as to form microparticles; and while the microparticles are floating, irradiating the same with high-energy rays to thereby effect polymerization of the monomer having an ethylenically unsaturated group (B). | 01-29-2009 |
| 20090056982 | Process for producing a double-sided flexible printed board and double-sided flexible printed board - [Problems] To provide a process for producing a printed board having sufficient heat resistance.
| 03-05-2009 |
| 20090071697 | Rubber-Modified Polyamide Resin, Epoxy Resin Compositon and Cured Product Thereof - The present invention relates to a phenolic hydroxy group-containing rubber-modified polyamide resin which has, in the molecule, a phenolic hydroxy group-containing aromatic polyamide segment having a structure represented by the following formula (A) | 03-19-2009 |
| 20090081466 | Polyamide resin, epoxy resin compositions, and cured articles thereof - Provided herein are a phenolic hydroxyl group-containing aromatic polyamide resin and a resin composition containing the resin, such as an epoxy resin composition containing an epoxy resin. The phenolic hydroxyl group-containing aromatic polyamide resin has a structure represented by the following formula (1): | 03-26-2009 |
| 20090202793 | Photosensitive, Aqueous Alkaline Solution-Soluble Polyimide Resin and Photosensitive Resin Composition Containing the same - The present invention relates to a photosensitive, aqueous alkaline solution-soluble polyimide resin (A) obtained by reacting a polyimide resin (a) which can be obtained by a tetracarboxylic acid dianhydride with a diamine compound with an energy ray-curing type aqueous alkaline solution-soluble resin (b); the resin has excellent photosensitivity obtained by mixing with a photopolymerization initiator and the like; the obtained cured products can be photosensitive resin compositions excellent in flexibility, low warping property, adhesion properties, solvent resistance, acid resistance, heat resistance, gold plating resistance and the like. | 08-13-2009 |
| 20090286087 | Thermosetting Resin Composition and Use thereof - Disclosed is related to a thermosetting resin composition which comprises a polyimide resin (A) having a phenolic hydroxyl group, preferably a polyimide resin (A) produced from an aminophenol (a), a diamino compound (b) and a tetrabasic acid dianhydride (c), and an epoxy resin (B); and a cured product thereof. The resin composition is excellent in storage stability, and gives a cured product excellent in flame retardancy and heat resistance. Furthermore, when the cured product is in a film form, the product has sufficient flexibility and excellent folding endurance. | 11-19-2009 |
| 20100035182 | PHOTOSENSITIVE RESIN COMPOSITION - The present invention relates to a positive type photosensitive polyimide resin composition comprising a phenolic hydroxy group-containing soluble polyimide resin (A) formed from a tetrabasic acid dianhydride (a), an aminophenol compound having at least two amino groups and at least one phenolic hydroxy group in one molecule (b), and a diamino compound (c); a diazo-based positive type photosensitizer (B); and an epoxy resin (C). Using the positive type photosensitive polyimide resin composition of the present invention, a resin composition which allows easy patterning, satisfies various properties such as flame retardancy, heat resistance, mechanical properties and flexibility, and is capable of coping with high functionalization of various electronic devices, and a cured product thereof can be provided. | 02-11-2010 |
| 20100096169 | Polyamide Resin as Well as Epoxy Resin Composition Using the Same and Use Thereof - The invention provides a phenolic hydroxyl group-containing rubber-modified polyamide resin capable of providing a cured product with excellent heat resistance, adhesion properties, electrically insulating property and flame retardance and having a sufficient flexibility when being shaped into a film, which is characterized by having in its molecule (a) a phenolic hydroxyl group-containing aromatic polyamide segment represented by the following formula (1): | 04-22-2010 |
| 20100129604 | COPPER FOIL WITH RESIN LAYER - An object of the present invention is to provide a copper foil with a resin layer to be used as a resin substrate for a flexible printed wiring board and having good adhesiveness between the copper foil, to which no roughening treatment is applied, and a raw material resin layer. | 05-27-2010 |
| 20100207282 | PRIMER RESIN FOR SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE - The present invention relates to a primer resin for semiconductor devices which comprises a polyamide resin represented by the following formula (1): | 08-19-2010 |
