Patent application number | Description | Published |
20080245766 | METHOD FOR MANUFACTURING LIQID DISCHARGE HEAD - A method for manufacturing liquid discharge heads having a substrate where energy generation elements that generate energy used for discharging liquid are formed, a wiring electrically connected to the energy generation elements, and a flow path communicating with discharge ports for discharging liquid and corresponding to the energy generation elements. The method includes forming a resin layer on the substrate, a first pattern for forming the wiring on the resin layer, the wiring on the substrate using the first pattern, a second pattern for forming the flow path on the resin layer, a coating layer for coating the second pattern, and the flow path by removing the second pattern. | 10-09-2008 |
20080277379 | METHOD FOR MANUFACTURING A FILTER SUBSTRATE, INKJET RECORDING HEAD, AND METHOD FOR MANUFACTURING THE INKJET RECORDING HEAD - A filter capable of separating or filtering micro foreign particles in a flow passage is provided. A first mask and a second mask are formed on a silicon substrate by dry etching. Before performing the dry etching, a resist of the first mask is subjected to a heat treatment performed at a temperature equal to or higher than a glass transition point. A resist of the second mask is not subjected to such a heat treatment. This processing simultaneously forms in the substrate a groove portion and a wall having a hole that is located in the groove portion. A silicon material located beneath a wide portion of the first mask remains as a wall portion separating the holes. | 11-13-2008 |
20090040266 | LIQUID-DISCHARGING HEAD AND METHOD OF PRODUCING THE SAME - A liquid-discharging head includes a substrate; a flow passage wall-forming layer bonded to the substrate so as to form a flow passage for liquid between the substrate and the flow passage wall-forming layer, the flow passage communicating with a discharge port configured to discharge the liquid; an element configured to generate energy used for discharging the liquid from the discharge port and provided on the flow passage wall-forming layer; a metal layer provided with the discharge port so as to correspond to the element; and a projecting portion made of a metal and extending from the metal layer through the flow passage wall-forming layer and projecting in the direction of the substrate. | 02-12-2009 |
20090160913 | INK JET RECORDING HEAD AND MANUFACTURE METHOD FOR THE SAME - An ink jet recording head has sufficient and uniform ink refill for all orifices and separate flow paths even though the substrate has a high rigidity by dividing a supply port into a plurality of ports. The substrate of the ink jet recording head has a plurality of separate flow paths corresponding to discharge pressure generating elements, a common flow path communicating with the separate flow paths, an ink supply port communicating with the common flow path and supplying ink to the common flow path, and a plurality of beam portions dividing the ink supply port. A recess is formed on the common flow path, extending to the separate flow paths formed nearest to the beam portion. | 06-25-2009 |
20090212008 | LIQUID EJECTION HEAD AND MANUFACTURING METHOD THEREOF - A liquid ejection head includes a substrate, having a front surface and a back surface, provided on the front surface with an energy generating element for generating energy used for ejecting liquid; a supply port, provided so as to penetrate between the front surface and the back surface of the substrate, for supplying the liquid to the energy generating element; a first film provided on the front surface of the substrate; and a second film provided so as to coat a wall of the substrate defining the supply port. The first film and the second film surface-contact each other with respect to two directions substantially perpendicular to each other. | 08-27-2009 |
20110027530 | BEAM, INK JET RECORDING HEAD HAVING BEAMS, AND METHOD FOR MANUFACTURING INK JET RECORDING HEAD HAVING BEAMS - A beam having a base material of silicon monocrystal and at least one projection which is integrally formed so as to be supported at least at one end thereof and which has two surfaces having an orientation plane ( | 02-03-2011 |
20150022590 | LIQUID EJECTION HEAD AND METHOD FOR MANUFACTURING SAME - A liquid ejection head includes a substrate, an energy-generating element provided on a front surface side of the substrate, the energy-generating element generating energy for ejecting liquid, sidewall members of a liquid flow path, and an ejection port forming member that defines an ejection port from which the liquid is ejected. In the liquid ejection head, sidewalls of the liquid flow path are formed of the sidewall members and a top wall of the liquid flow path is formed of the ejection port forming member, the sidewall members are each formed of a core member that extends from a front surface of the substrate and a covering member that covers the surface of the core member, the covering member covers the front surface of the substrate, and the ejection port forming member is formed of an inorganic material. | 01-22-2015 |
Patent application number | Description | Published |
20120006592 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board including a first insulation layer, a conductive pattern formed on the first insulation layer, a second insulation layer formed on the conductive pattern and the first insulation layer and having an opening portion exposing at least a portion of the conductive pattern, and a connection conductor formed in the opening portion of the second insulation layer such that the connection conductor is positioned on the portion of the conductive pattern. The connection conductor has a tip portion which protrudes from a surface of the second insulation layer and which has a tapered side surface tapering toward an end of the tip portion. | 01-12-2012 |
20120008295 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board has a first resin insulation layer, a first conductive pattern formed on the first resin insulation layer, a second resin insulation layer formed on the first conductive pattern and having an opening portion exposing at least a portion of the first conductive pattern, a second conductive pattern formed on the second resin insulation layer, and a via conductor formed in the opening portion of the second resin insulation layer and electrically connecting the first conductive pattern and the second conductive pattern. The via conductor has a side surface extending between the first conductive pattern and the second conductive pattern and a bent portion where an inclination of the side surface of the via conductor changes in a depth direction of the via conductor. | 01-12-2012 |
20130256000 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board includes a first insulation layer, first conductive patterns formed on the first insulation layer, a second insulation layer formed on the first insulation layer and the first conductive patterns and having an opening portion, a wiring structure accommodated in the opening portion of the second insulation layer and including an insulation layer and conductive patterns on the insulation layer, second conductive patterns formed on the second insulation layer; and a via conductor formed in the second insulation layer and connecting one of the first conductive patterns and one of the second conductive patterns. | 10-03-2013 |
20130258625 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board includes a first insulation layer, a second insulation layer formed on the first insulation layer, a wiring structure interposed between the first insulation layer and the second insulation layer and including an insulation layer and conductive patterns formed on the insulation layer, second conductive patterns formed on the second insulation layer, and a via conductor formed through the second insulation layer and connected to one of the second conductive patterns on the second insulation layer. | 10-03-2013 |
20140102768 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board includes a first insulation layer, a first conductive pattern structure formed on the first insulation layer, a wiring structure formed on the first insulation layer and including a second insulation layer and a second conductive pattern structure on the second insulation layer, and a third insulation layer formed on the first insulation layer and the first conductive pattern structure and having first and second openings such that the first opening is exposing at least a portion of a surface of the wiring structure and the second opening is exposing at least a portion of the first conductive pattern structure. The wiring structure includes a third conductive pattern structure forming an outermost layer of the wiring structure and including a mounting pad structure which mounts a semiconductor device. The first opening is formed such that the first opening is exposing pad formation area of the mounting pad structure. | 04-17-2014 |
20140231990 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A semiconductor device includes a semiconductor chip and a wiring board formed on the semiconductor chip. The wiring board includes a first insulation layer, first conductive patterns on the first layer, first via conductors formed in the first layer and connecting the first patterns and electrode pads of the chip, respectively, a second insulation layer on the first layer, second conductive patterns on the second layer, and second via conductors formed in the second layer and connecting the first conductive patterns and the second patterns, respectively, each second via conductors has a side surface extending through the second layer such that the side surface has a bent portion which changes inclination of the side surface in depth direction of each second via conductor, and the second patterns are positioned to fan in or out with respect to the electrode pads. | 08-21-2014 |
20140311780 | ELECTRONIC COMPONENT, METHOD FOR MANUFACTURING THE SAME AND METHOD FOR MANUFACTURING MULTILAYER PRINTED WIRING BOARD - An electronic component includes an insulation layer, an alignment mark positioned on a first surface of the insulation layer, and an adhesive layer including an optically opaque agent and formed on the first surface of the insulation layer or a second surface of the insulation layer on the opposite side with respect to the first surface of the insulation layer. The adhesive layer has an opening portion formed at the position corresponding to the alignment mark such that the opening portion exposes the alignment mark directly or through the insulation layer. | 10-23-2014 |
20140347837 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board includes multiple insulation layers including an outermost insulation layer, a first conductive pattern formed between the insulation layers, a wiring structure positioned in the outermost insulation layer and having multiple first pads such that the first pads are positioned to connect multiple terminals of a first electronic component, respectively, and multiple second pads formed on the outermost insulation layer such that the second pads are positioned to connect terminals of a second electronic component, respectively, and are set at intervals which are greater than intervals of the first pads. | 11-27-2014 |
20140360759 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board includes a first insulation layer, first conductive patterns formed on the first insulation layer and including first mounting pads positioned to mount a semiconductor element, a wiring structure positioned in the first insulation layer and having a second insulation layer, second conductive patterns formed on the second insulation layer, and second mounting pads connected to the second conductive patterns, and third mounting pads formed on the first insulation layer above the second mounting pads and connected to the second mounting pads such that the third mounting pads are positioned to mount the semiconductor element and form a distance between adjacent first and third mounting pads which is greater than a distance between adjacent first mounting pads. | 12-11-2014 |
20140360767 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board includes a first insulation layer, first conductive patterns formed on the first insulation layer and including first mounting pads positioned to mount a semiconductor element, a wiring structure positioned in the first insulation layer and including a second insulation layer, second conductive patterns formed on the second insulation layer, and second mounting pads connected to the second conductive patterns, and third mounting pads formed on the first insulation layer above the second mounting pads and connected to the second mounting pads such that the third mounting pads are positioned to mount the semiconductor element and are set off from the second mounting pads toward the semiconductor element. | 12-11-2014 |