Patent application number | Description | Published |
20100301748 | SELF-BALLASTED LAMP AND LIGHTING EQUIPMENT - The invention provides a self-ballasted lamp having high heat radiation performance, which is lightweight and inexpensive. A substrate having LED elements mounted is provided at one edge side of the radiator, and a cap is provided at the other edge side the radiator. A lighting circuit is accommodated between the radiator and the cap. The radiator includes a cylindrical cover member and an annular radiation member fitted to the outer circumferential part of the cover member and is composed by combining the cover member and the radiation member together. The cover member and the radiation member are made of metal and are formed by press-working. | 12-02-2010 |
20110074269 | SELF-BALLASTED LAMP AND LIGHTING EQUIPMENT - A base body having a base body portion and a plurality of heat radiating fins disposed on the circumference of the base body portion is provided. On one end side of the base body, a light-emitting module having semiconductor light-emitting elements, and a globe that covers the light-emitting module are provided. A cap is provided on the other end side of the base boy. A lighting circuit is housed between the base body and the cap. The lamp total length from the globe to the cap is 70 to 120 mm, and the area of a surface of the base body which is exposed to the outside per 1 W of power charged to the light-emitting module is 20.5 to 24.4 cm | 03-31-2011 |
20110074290 | SELF-BALLASTED LAMP AND LIGHTING EQUIPMENT - A self-ballasted lamp includes: a base body; a light-emitting module and a globe which are provided at one end side of the base body; a cap provided at the other end side of the base body; and a lighting circuit housed between the base body and the cap. The light-emitting module has light-emitting portions each using a semiconductor light-emitting element, and a support portion projected at one end side of the base body, and the light-emitting portions are disposed at least on a circumferential surface of the support portion. A light-transmissive member is interposed between the light-emitting module and an inner face of the globe. | 03-31-2011 |
20120306366 | BULB-TYPE LAMP AND LUMINAIRE USING BULB-TYPE LAMP - According to an embodiment, an LED lamp includes a thermal radiation unit on which an LED module with a light source mounted thereon is mounted and which has a function of radiating heat generated from the LED module, and an insulating case which is integrally molded inside the thermal radiation unit in order to electrically insulate a drive circuit of the LED module provided inside and the thermal radiation unit from each other. | 12-06-2012 |
20140003057 | Lighting Device | 01-02-2014 |
20140145590 | SELF-BALLASTED LAMP AND LIGHTING EQUIPMENT - A self-ballasted lamp includes: a base body; a light-emitting module and a globe which are provided at one end side of the base body; a cap provided at the other end side of the base body; and a lighting circuit housed between the base body and the cap. The light-emitting module has light-emitting portions each using a semiconductor light-emitting element, and a support portion projected at one end side of the base body, and the light-emitting portions are disposed at least on a circumferential surface of the support portion. A light-transmissive member is interposed between the light-emitting module and an inner face of the globe. | 05-29-2014 |
20140153249 | Bulb-Type LED Lamp - An LED lamp according to an embodiment includes an LED module, a base body, a first globe, a second globe and a light guide body. In the LED module, a plurality of LEDs are mounted on a substrate. The base body holds the LED module. The first globe is arranged to surround the outer circumference of the substrate. A bore diameter (D | 06-05-2014 |
20140191658 | SELF-BALLASTED LAMP AND LIGHTING EQUIPMENT - The invention provides a self-ballasted lamp having high heat radiation performance, which is lightweight and inexpensive. A substrate having LED elements mounted is provided at one edge side of the radiator, and a cap is provided at the other edge side the radiator. A lighting circuit is accommodated between the radiator and the cap. The radiator includes a cylindrical cover member and an annular radiation member fitted to the outer circumferential part of the cover member and is composed by combining the cover member and the radiation member together. The cover member and the radiation member are made of metal and are formed by press-working. | 07-10-2014 |
Patent application number | Description | Published |
20100219735 | LIGHTING DEVICE AND LIGHTING FIXTURE - A lighting device and a lighting fixture of the embodiment of the present invention comprises a thermally conductive main body having a substrate support portion in one end portion, and having a through-hole and a groove portion formed in the substrate support portion, the through-hole penetrating from the one end portion to the other end portion of the main body, the groove portion extending continuously from the through-hole, a substrate mounted with a semiconductor light-emitting device, and disposed on the substrate support portion, an electrical connector connected to the semiconductor light-emitting device, a power supply device housed in the main body and configured to light the semiconductor light-emitting device, a wire connected to the power supply device and to the electrical connector while being inserted through the through-hole and the groove portion, and a base member provided in the other end portion of the main body and connected to the power supply device. Therefore, a lighting device and a lighting fixture of this embodiment of the present invention reduced in size, is configured to be suitable for mass production and is capable of producing a certain luminous flux. | 09-02-2010 |
20110291594 | LAMP DEVICE AND LIGHTING FIXTURE - In a lamp device | 12-01-2011 |
20130063942 | LUMINAIRE - A luminaire according to embodiments includes a body portion, a light source provided at one end portion of the body portion and having a light-emitting element, a globe provided so as to cover the light source, and a thermal transfer portion thermally joined to at least either one of the globe or a thermal radiating surface of the body portion on the end portion side. Then, an end surface of the thermal transfer portion on the side of the globe is exposed from the globe. | 03-14-2013 |
20130063957 | LIGHTING DEVICE AND MANUFACTURING METHOD THEREOF - A lighting device according to an embodiment includes a main body unit, a light source which is provided at one end portion of the main body unit, and includes a light emitting element, a globe which is provided so as to cover the light source, and a heat conducting unit whose end surface on the globe side is exposed on the outside of the globe, and which thermally bonds the globe and a heat radiating surface of the main body unit on the end portion side. The heat conducting unit includes a plate-shaped unit in which a first plate-shaped body, and a second plate-shaped body which crosses the first plate-shaped body are integrally formed. | 03-14-2013 |
20130070460 | LIGHTING APPARATUS - A lighting apparatus according to an exemplary embodiment includes a light source including a light emitting element, a reflection portion main body that is formed of an incombustible resin and is provided at an emission side of the light source, and a reflection layer that is formed of resin substantially not containing halogen or phosphorus and is provided on a surface of the reflection portion main body. | 03-21-2013 |
20130229813 | LUMINAIRE - According to one embodiment, a luminaire includes a main body part, a holding part at least a part of which is provided inside the main body part, a light source part that is provided on one end side of the main body part and includes a light-emitting element, a control part that is provided inside the holding part and controls the light-emitting element, an area control part that is provided between the control part and the holding part and includes a concave part, and a first heat transfer part that is provided inside the concave part and between the control part and the holding part. | 09-05-2013 |
20130242558 | LUMINAIRE AND METHOD OF MANUFACTURING THE SAME - A luminaire according to one embodiment includes a light-emitting portion including a light-emitting element, a power control unit configured to supply power to the light-emitting portion, an external terminal connecting the power control unit and an external power source, and a ceramic housing having the power control unit housed therein, including the light-emitting portion mounted on one end side thereof and the external terminal mounted on the other end side thereof and configured to allow at least part of light radiated from the light emitting element to pass therethrough. | 09-19-2013 |
Patent application number | Description | Published |
20100208473 | LAMP SYSTEM AND LIGHTING APPARATUS - A lamp system which can improve radiation performance is provided. A metallic heat conduction part provided along a peripheral portion of a metallic cover is fitted with a resin heat conduction part provided along a peripheral portion of a transparent cover so as to thermally contact each other. Heat generated by an LED is radiated into air from the metallic cover and at the same time is efficiently conducted from the metallic cover to the transparent cover to be radiated into air from the transparent cover. | 08-19-2010 |
20110261572 | LIGHTING FIXTURE - There is provided a lighting fixture | 10-27-2011 |
20120002429 | SOCKET DEVICE, LAMP DEVICE AND LIGHTING DEVICE - There is provided a lighting fixture capable of efficiently radiating heat of a lamp device attached to a socket device. | 01-05-2012 |
20120320565 | Lighting System - A lighting fixture capable of efficiently radiating heat of a lamp device may be configured to be attached to a socket device. In some examples, by attaching the lamp device to the socket device, a cap portion of the lamp device is brought into contact with a fixture body, and pressed against and brought into close contact with the fixture body by an elastic body. Heat generated by lighting of LEDs of the lamp device is conducted from the cap portion to the fixture body and efficiently radiated. | 12-20-2012 |
20120320609 | Socket Device - A lighting fixture capable of efficiently radiating heat of a lamp device may be configured to be attached to a socket device. In some examples, by attaching the lamp device to the socket device, a cap portion of the lamp device is brought into contact with a fixture body, and pressed against and brought into close contact with the fixture body by an elastic body. Heat generated by lighting of LEDs of the lamp device is conducted from the cap portion to the fixture body and efficiently radiated. | 12-20-2012 |
20120320610 | Socket Device - A lighting fixture capable of efficiently radiating heat of a lamp device may be configured to be attached to a socket device. In some examples, by attaching the lamp device to the socket device, a cap portion of the lamp device is brought into contact with a fixture body, and pressed against and brought into close contact with the fixture body by an elastic body. Heat generated by lighting of LEDs of the lamp device is conducted from the cap portion to the fixture body and efficiently radiated. | 12-20-2012 |
20120320611 | Socket Device - A lighting fixture capable of efficiently radiating heat of a lamp device may be configured to be attached to a socket device. In some examples, by attaching the lamp device to the socket device, a cap portion of the lamp device is brought into contact with a fixture body, and pressed against and brought into close contact with the fixture body by an elastic body. Heat generated by lighting of LEDs of the lamp device is conducted from the cap portion to the fixture body and efficiently radiated. | 12-20-2012 |
Patent application number | Description | Published |
20100070141 | Electronic apparatus - An electronic apparatus includes an integrated circuit, a capacitor, and first and second wires. The integrated circuit has a terminal connected to a power supply line or a signal line. The capacitor eliminates noise on the power supply line or the signal line. The first wire connects a first end of the capacitor to the terminal of the integrated circuit. The second wire connects a second end of the capacitor to a reference potential. A length of the first wire is substantially equal to a length of the second wire. | 03-18-2010 |
20140109693 | PRESSURE SENSING DEVICE AND MANUFACTURING METHOD OF THE SAME - A pressure sensing device includes a sensor chip having a sensing portion, a bonding wire electrically connected with the sensor chip, a protection section, and a package. The sensor chip detects a pressure with the sensing portion and generates a signal corresponding to the detected pressure. The protection section includes a first protection section and a second protection section. The first protection section includes a predetermined portion, which seals the sensing portion, and a remaining portion other than the predetermined portion. The second protection section is arranged on the remaining portion of the first protection section and seals at least the bonding wire so that the bonding wire is not exposed to an outside. | 04-24-2014 |
20140117474 | PRESSURE SENSING DEVICE AND MANUFACTURING METHOD OF THE SAME - A pressure sensing device includes a sensor chip having a sensing portion, a bonding wire, a protection section, a package, and a guide member. The sensor chip detects a pressure with the sensing portion and generates a signal corresponding to the pressure. The bonding wire is electrically connected with the sensor chip in order to transmit the signal generated by the sensor chip. The protection section has an electrical insulation property and seals the sensor chip and the bonding wire. The package houses the sensor chip, the bonding wire, and the protection section. The guide member has a tubular section arranged opposed to the sensing portion. The protection section has a first thickness at an inside portion of the tubular section and has a second thickness, which is larger than the first thickness, at an outside portion of the tubular section. | 05-01-2014 |
20140297100 | EMERGENCY REPORT SYSTEM - An emergency report system includes a transmitter, a fixing member, and a portable terminal. The transmitter includes an accelerometer and a transmitting section, the accelerometer detects an acceleration of a vehicle, and the transmitting section transmits acceleration information including the acceleration detected by the accelerometer. The fixing member fixes the transmitter to a predetermined portion of the vehicle. The portable terminal includes a receiving section and a report section, the receiving section receives the acceleration information transmitted from the transmitting section, and the report section reports an emergency to a report destination preliminarily stored in the portable terminal based on the acceleration information. | 10-02-2014 |
20150153241 | PRESSURE SENSOR FOR VEHICLE - A pressure sensor includes a sensor housing mounted on a vehicle, a first detector located in the housing and having a first diaphragm facing a sealed space of the vehicle, a second detector located in the housing and having a second diaphragm facing the sealed space, and a protector located in the housing and covering the first and second detectors. A first chamber is formed between the first diaphragm and the housing and isolated from the sealed space so that the first diaphragm can be deformed by a pressure in the sealed space. A second chamber is formed between the second diaphragm and the sensor housing and communicates with the sealed space. The first and second diaphragms produce the same signal when being deformed by the same amount in the same direction. | 06-04-2015 |
Patent application number | Description | Published |
20120132530 | TIN PLATING SOLUTION - To provide a tin plating solution having uniformity of through-hole plating, uniformity of film thickness distribution and no burn deposits even. The tin plating solution include a tin ion source, at least one non-ionic surfactant, imidazoline dicarboxylate and 1,10-phenanthroline. | 05-31-2012 |
20140174937 | COPPER ELECTROPLATING SOLUTION AND METHOD OF COPPER ELECTROPLATING - A copper plating solution which contains compounds with the structure —X—S—Y— where X and Y are, independently of each other, atoms selected from a group consisting of hydrogen, carbon, sulfur, nitrogen, and oxygen, and X and Y can be the same only if they are carbon atoms and aliphatic semialdehydes. By using this copper electroplating solution it is possible to form good filled vias without worsening the appearance of the plating. | 06-26-2014 |
20140183052 | COPPER ELECTROPLATING SOLUTION AND METHOD OF COPPER ELECTROPLATING - A copper electroplating solution which contains compounds with the structure —X—S—Y— wherein X and Y are, independently atoms selected from a group consisting of hydrogen, carbon, sulfur, nitrogen, and oxygen, and X and Y can be the same only if they are carbon atoms and ninhydrin. By using this copper electroplating solution, it is possible to form good filled vias without worsening the appearance of the plating. | 07-03-2014 |
Patent application number | Description | Published |
20130319867 | ELECTROLYTIC COPPER PLATING SOLUTION AND METHOD OF ELECTROLYTIC COPPER PLATING - An electrolytic copper plating solution is provided which has an excellent via filling ability without using formaldehyde, which is harmful to the environment. An electrolytic copper plating solution which contains compounds which have an —X—S—Y— structure wherein X and Y are individually atoms selected from a group comprising hydrogen, carbon, sulfur, nitrogen, and oxygen atoms and X and Y can be the same only when they are carbon atoms and specific nitrogen-containing compounds. Good filled vias can be made without causing a worsening of the exterior appearance of the plating by using this electrolytic copper plating solution. | 12-05-2013 |
20140097087 | ELECTROLYTIC COPPER PLATING LIQUID AND THE ELECTROLYTIC COPPER PLATING METHOD - Copper electroplating liquid which does not use formaldehyde, which is harmful to the environment, and which exhibits excellent via filling ability is offered. The copper electroplating liquid of this invention includes the compound that has the structure of —X—S—Y— where X and Y are each an atom selected from the group of hydrogen atoms, carbon atoms, sulfur atoms, nitrogen atoms and oxygen atoms, and X and Y can be the same only when they are carbon atoms, and a specific urea derivative. When the said copper electroplating liquid is used, deterioration of the appearance will not occur and a good filled via can be formed. | 04-10-2014 |