Patent application number | Description | Published |
20110031622 | METHOD FOR FABRICATING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE - A method for fabricating a semiconductor device according to an embodiment includes: forming a nickel (Ni) film containing phosphorus (P) elements on a substrate having at least one of a diffusion layer formed by using silicon (Si) and a gate electrode formed by using Si exposed on a surface thereof; and forming a nickel silicide (NiSi) film containing P elements on the substrate from the Ni film containing the P elements and Si in at least one of the diffusion layer and the gate electrode. | 02-10-2011 |
20130252411 | MANUFACTURING METHOD OF A SEMICONDUCTOR DEVICE - According one embodiment, a method for manufacturing a semiconductor device is provided, which includes forming a pair of element isolation insulation films on a semiconductor substrate, forming a gate electrode structure on sides of the gate electrode structure, selectively removing oxide films that are formed on a top surface of the diffusion layer and a top surface of the gate electrode by placing the substrate in a gas atmosphere selected from the group consisting of F, Cl, Br, I, H, O, Ar, or N; and irradiating the semiconductor substrate with microwave radiation. The method also includes depositing a metal film on a top surface of the diffusion layer and a top surface of the gate electrode, and a silicide film is formed by heating the substrate. | 09-26-2013 |
Patent application number | Description | Published |
20100036972 | Reconfigurable computing device and method for inspecting configuration data - A reconfigurable computing device includes a reconfigurable logical device of which a circuit logic can be changed based on configuration data, a storage part to store beforehand input-output attributes of input-output parts of the reconfigurable logical device, and a verification part to verify the configuration data by making a comparison between information on the input-output parts in the configuration data and the input-output attributes stored in the storage part. With this, it is possible to inspect the configuration data of the reconfigurable logical device by a simple method. | 02-11-2010 |
20100107005 | PROCESSOR OPERATION INSPECTION SYSTEM AND OPERATION INSPECTION CIRCUIT - A processor operation inspection system includes a processor and an operation inspection circuit that inspects an operation of the processor. When a program under execution changes from one predefined state to another state, the processor outputs a state switching signal indicating a transition of its state, a state signal indicating a current state to the inspection circuit. The inspection circuit includes a state register that stores the state of the processor, a combinational logic circuit that calculates, according to the stored state of the processor and the state switching signal, a new state to be taken by the processor, and a comparison circuit that inspects the operation of the processor by comparing the calculated new state to the state of the processor inputted as the state signal. | 04-29-2010 |
20100281134 | ARCHITECTURE FOR A SELF-HEALING COMPUTER SYSTEM - The self-healing system comprises a self-healing processor and an error mitigation system. The self-healing processor includes a code block associated with the operation of a portion of digital logic. The self-healing processor also includes a dynamic signature analysis circuit. The processor executes the code block. The dynamic signature analysis circuit creates a dynamic signature representing the operation of the portion of digital logic associated with the code block. The error mitigation system receives the dynamic signature from the dynamic signature analysis circuit. The error mitigation system compares the dynamic signature to a static signature to determine if the signatures match. If the signatures do not match, then the digital logic associated with the code block has an error. The error mitigation system retries execution of the code block. The error mitigation system stores log information describing the above events. | 11-04-2010 |
20130151894 | Fault-Tolerant Computer System - A system and method for providing a fault-tolerant basis to execute instructions is disclosed. The system comprises an error detector, a rewriting module, a recovery engine, a fault locator and a fallback programming module. The error detector detects a first error in the execution of an instruction in a faulty stage unit of a first pipeline unit. The rewriting module rewrites the instruction to form a rewritten instruction responsive to detecting the first error. The recovery engine executes the rewritten instruction in the first pipeline unit. The error detector determines if a second error occurs in the execution of the rewritten instruction. Responsive to detecting the second error, the recovery engine selects a substitute stage unit for the faulty stage unit from a second pipeline unit. The fault locator locates a faulty component for the faulty stage unit. The fallback programming module establishes a fallback unit for the faulty component. | 06-13-2013 |
20130158895 | Signal Processing System - A system and method for processing sensor signals is disclosed. The system comprises a sensor array, a multiplexer, a converter, a selection module and a combination module. The sensor array measures a physical parameter in a first dimension on a seat and generates a first set of sensor signals. The sensor array measures the physical parameter in a second dimension on the seat and generates a second set of sensor signals. The multiplexer multiplexes the first set of sensor signals into a first signal stream and the second set of sensor signals into a second signal stream. The converter converts the first signal stream to a first set of digital signals and the second signal stream to a second set of digital signals. The selection module determines a set of first-dimension data and a set of second-dimension data. The combination module forms a set of two-dimensional data. | 06-20-2013 |
Patent application number | Description | Published |
20100124631 | OPTICAL SHEET AND METHOD FOR PRODUCING THE SAME - The main object of the present invention is to provide an optical sheet having excellent abrasion resistance and hardness, and a method for producing the same. The present invention provides an optical sheet in which a hard coat layer is provided on one surface of a substrate, wherein the hard coat layer comprises a cured product of a curable resin composition for a hard coat layer, which comprises reactive inorganic fine particles and a binder component, and wherein fine protrusions are provided on an interface on the side opposite to the substrate side of the hard coat layer, in which the minimum angle of each of the fine protrusions making angles with a virtual plane that is parallel to the hard coat layer is an acute angle. The present invention also provides a method for producing the optical sheet, comprising the steps of: forming a coating by applying a curable resin composition for a hard coat layer to one surface of a substrate, which composition comprising reactive, irregularly shaped silica fine particles and a binder component, and forming a hard coat layer and fine protrusions by curing the coating while or after preventing that the long axes of the reactive, irregularly shaped silica fine particles are each oriented in a direction planar to a virtual plane. | 05-20-2010 |
20100124656 | OPTICAL SHEET AND METHOD FOR PRODUCING THE SAME - The present invention is to provide an optical sheet having excellent abrasion resistance and hardness, and a method for producing the same. The object of the present invention was accomplished by an optical sheet in which a hard coat layer is provided on one surface of a substrate, wherein the hard coat layer comprises a cured product of a curable resin composition for a hard coat layer, which composition comprising reactive, irregularly shaped silica fine particles and a binder component, and wherein at least part of the irregularly shaped silica fine particles have a specific three-dimensional configuration and are present on an interface on the side opposite to the substrate side of the hard coat layer. The object of the present invention was also accomplished by a method for producing the optical sheet, comprising the steps of: forming a coating by applying a curable resin composition for a hard coat layer comprising reactive, irregularly shaped silica fine particles and a binder component onto one surface of a substrate, and forming a hard coat layer by curing the coating with or after preventing that the long axes of the reactive, irregularly shaped silica fine particles are each oriented in a direction planar to a virtual plane. | 05-20-2010 |
20120327341 | LIQUID CRYSTAL DISPLAY DEVICE - A main object of the present invention is to provide a liquid crystal display device having high impact resistance and good display properties. In the present invention, the above-described object is attained by providing a liquid crystal display device comprising a liquid crystal panel, a transparent substrate having rigidity, and a fusion bonding layer comprising a thermoplastic resin, characterized in that the transparent substrate is bonded to a viewing-side surface of the liquid crystal display panel with the fusion bonding layer interposed therebetween. | 12-27-2012 |
Patent application number | Description | Published |
20100003816 | Method of manufacturing a semiconductor device from which damage layers and native oxide films in connection holes have been removed - An insulating film formed on a conducting layer is dry-etched so as to make a connection hole in the insulating film to expose the conducting layer. Plasma is supplied onto the exposed conducting layer to dry-clean a damage layer produced in the connection hole. A product produced in the connection hole as a result of the dry cleaning is removed by a wet process. An oxide film formed in the connection hole as a result of the wet process is etched by a chemical dry process using a gas including either NF | 01-07-2010 |
20120068343 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - According to one embodiment, a semiconductor device includes a semiconductor substrate, an interlayer dielectric film, a contact hole, a contact plug and a nickel silicide film. The semiconductor substrate includes silicon. The interlayer dielectric film is formed on the semiconductor substrate. The contact hole is formed in the interlayer dielectric film. A contact plug is formed within the contact hole. A nickel silicide film is formed on a bottom part of the contact hole and electrically connected to the contact plug. A position of an interface between the nickel silicide and the contact plug is higher than a position of an interface between the semiconductor substrate and the interlayer dielectric film. | 03-22-2012 |
20130189838 | SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - According to one embodiment, a semiconductor manufacturing apparatus has a chamber, a microwave generator for generating a microwave, a waveguide for introducing the microwave into the chamber, a stage for mounting a semiconductor substrate, and a cover for covering an outer circumference portion of the stage exposed from the semiconductor substrate. In the semiconductor manufacturing apparatus, the stage is made of a material to be heated by the microwave, and the cover is made of a material through which the microwave penetrates. | 07-25-2013 |
20140287582 | METHOD OF MANUFACTURING METAL SILICIDE LAYER - According to one embodiment, a method of manufacturing a metal silicide layer, the method includes forming a metal layer including impurities on a silicon layer by a vapor deposition method using a gas of a metal and a gas of the impurities, and forming a metal silicide layer including the impurities by chemically reacting the metal layer with the silicon layer. A thickness and a composition of the metal silicide layer are controlled by an amount of the impurities in the metal layer. | 09-25-2014 |
Patent application number | Description | Published |
20090110111 | SIGNAL PROCESSING APPARATUS, SIGNAL TRANSMITTING SYSTEM, AND SIGNAL PROCESSING METHOD - A signal processing apparatus, which executing a decoding process for a digital signal Manchester-encoded by assigning two bits of “10” to any one of binary digital signals “0 and “1”, and assigning two bits of “01” to the other binary digital signal, is provide with a decoding unit which executes the decoding process with a processing unit corresponding to a tern of two bits of the Manchester-encoded digital signal so as to detect only any one of the first bit and the second bit of the Manchester-encoded digital signal. | 04-30-2009 |
20090111315 | CONNECTOR - A connector for transmitting signals using electrostatic coupling, comprises an inner first conductor portion and an outer first conductor portion respectively connected to two signal lines, an inner electrode portion having a facing area larger than the cross-sectional area of the inner first conductor portion in the direction perpendicular to the direction of the common axis, an outer electrode portion outside it, an inner second conductor portion for electrically connecting between the inner first conductor portion and the inner electrode portion, and an outer second conductor portion outside it, wherein the ratio of outer diameter of the inner second conductor portion to inner diameter of the outer second conductor portion is set to provide substantially fixed characteristic impedance at every position along the direction of the common axis. | 04-30-2009 |
20120088970 | ENDOSCOPE SYSTEM - An endoscope system includes: an endoscope scope insertion portion having an insertion portion configured to be inserted inside a living organism; an extracorporeal device which is disposed outside the living organism; a first scope-side signal connecting portion that is provided on the endoscope scope insertion portion and has a first electrode; and a cylindrical first extracorporeal-side signal connecting portion that is provided on the extracorporeal device and has a second electrode, the first extracorporeal-side signal connecting portion configured to engage with the first scope-side signal connecting portion. In this endoscope system, when the first scope-side signal connecting portion is engaged with the first extracorporeal-side signal connecting portion, at least a portion of the first scope-side signal connecting portion is located within an inside-cylinder space of the first extracorporeal-side signal connecting portion, and the first electrode and the second electrode are electrostatically coupled together. | 04-12-2012 |
20120197085 | SIGNAL TRANSMISSION DEVICE AND ENDOSCOPE SYSTEM - A signal transmission device includes a transmission unit, a first connection unit, a second connection unit, and a reception unit. The transmission unit sends a transmission signal. The first connection unit includes a first electrode electrically connected to the transmission unit. The second connection unit includes a second electrode that engages with the first connection unit, and, when engaged with the first connection unit, is statically coupled with the first electrode. The reception unit is electrically connected to the second electrode and receives the transmission signal. | 08-02-2012 |