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Makoto Hirano

Makoto Hirano, Kawasaki JP

Patent application numberDescriptionPublished
20100251530REPAIR METHOD AND REPAIR JIG - A repair method for detaching a part from a board in an electronic device module having at least the board and the part bonded with the board by a press fitting process. A repair use block having a repair use through hole is placed on the part, and a repair use bolt is fastened with a repair use female thread formed in the part, in advance, through the repair use through hole. The repair use bolt head abuts against the top surface of the repair use block, then is further fastened, whereupon the part is pulled up together with the repair use female thread upward above the board. When a repair use female thread cannot be directly formed in the part, a repair use auxiliary part which is to be pulled up integrally with the part, is interposed.10-07-2010

Makoto Hirano, Toyama JP

Patent application numberDescriptionPublished
20080236487Semiconductor Manufacturing Apparatus And Semiconductor Device Manufacturing Method - Adverse effects when a carrier is open, such as particles adhesion to the substrate or natural oxidation film deposits on the substrate, as well as a rise in oxygen concentration and contamination of the substrate transfer chamber are prevented. Semiconductor manufacturing apparatus includes a carrier (10-02-2008
20100170436Substrate treatment equipment and manufacturing method of substrate - The invention aims to provide substrate treatment equipment that can automatically collect a substrate in a normal condition without needing manual operation. The equipment includes a substrate holder 07-08-2010
20110183446Method of manufacturing a semiconductor device - The invention aims to provide substrate treatment equipment that can automatically collect a substrate in a normal condition without needing manual operation. The equipment includes a substrate holder for holding substrates in a multistage manner and a substrate transfer unit for transferring the substrates into the substrate holder, wherein a substrate holding condition of the substrate holder is sensed by a sensing section. The sensing section has photo-sensors, and sensing waveforms sensed by the photo-sensors are compared with a normal waveform. A control section is provided, which controls a substrate transfer unit such that substrates other than at least a substrate that was determined to be abnormal are transferred by the unit.07-28-2011

Patent applications by Makoto Hirano, Toyama JP

Makoto Hirano, Saitama JP

Patent application numberDescriptionPublished
20090288900Inverted pendulum mobile vehicle - Provided is an inverted pendulum mobile vehicle such as a single-passenger coaxial two-wheel vehicle which is capable of turning with a small turning radius without causing discomfort to a rider or a vehicle occupant or causing a cargo or the like on the vehicle from shifting or falling off from the vehicle. The vehicle comprises a wheel supporting frame (11-26-2009
20100139996FRICTION DRIVE VEHICLE - In a frictional drive vehicle, a load acting on the vehicle such as the weight of a rider is converted into a force that urges two frictionally engaging parts (06-10-2010
20110209932OMNI-DIRECTIONAL VEHICLE - [Task] Provided is a vehicle that can make tight turns without significantly changing an attitude of a rider, and is highly convenient in narrow places.09-01-2011
20110233989WHEEL, AND FRICTION DRIVE DEVICE AND OMNI-DIRECTIONAL VEHICLE USING THE SAME - In a wheel for use in an omni-directional vehicle, gravel and other foreign matters are prevented from being trapped between free rollers forming the wheel, and traveling vibrations and noises are minimized at the same time. The wheel includes an annular member and a plurality of free rollers each rotatably supported by the annular member around a corresponding tangential line of the annular member, and a gap member is placed between each adjacent pair of the free rollers to fill a gap defined between the free rollers.09-29-2011
20110260523FRICTION DRIVE DEVICE AND OMNI-DIRECTIONAL VEHICLE USING THE SAME - In a friction drive device comprising first free rollers and second free rollers contacting each other at the outer circumferential surfaces thereof to frictionally transmit power from the second free rollers to the first free rollers, in order to minimize the slippage between the first and second free rollers, minimize the power loss and cause the first free rollers to move as designed, an outer peripheral part of each first free roller defining an outer circumferential surface thereof has a different stiffness from that of an outer peripheral part of each second free roller defining an outer circumferential surface thereof.10-27-2011

Patent applications by Makoto Hirano, Saitama JP

Makoto Hirano, Wako JP

Patent application numberDescriptionPublished
20100038960OMNI-DIRECTIONAL DRIVE DEVICE AND OMNI-DIRECTIONAL VEHICLE USING THE SAME - [Task] Provided is an omni-directional drive device that does not complicate the arrangement for a power source for a drive source such as an electric motor, and achieves a high durability and an ease of maintenance.02-18-2010
20100096905OMNI-DIRECTIONAL DRIVE DEVICE AND OMNI-DIRECTIONAL VEHICLE USING THE SAME - The omni-directional drive device comprises a main wheel (04-22-2010

Makoto Hirano, Amagasaki-Shi JP

Patent application numberDescriptionPublished
20100030943Semiconductor Memory - A semiconductor memory having a burst mode reading function in synchronization with a clock signal comprises a memory array composed of a plurality of memory cells, a sync read control circuit for releasing an upper group of the received address as a memory access address and a lower group of the received address as a burst address in synchronization with the clock signal, a sense amplifier for releasing an output data from each of the memory cells selected by the memory address, a decoder for decoding the burst address, a address latch for latching the decoded burst address in synchronization with the clock signal, a page selector for holding the output data and selecting corresponding one of the output data determined by the burst address of the address latch, and an output latch for latching the output data in synchronization with the clock signal.02-04-2010

Makoto Hirano, Yokohama JP

Patent application numberDescriptionPublished
20090016128Semiconductor integrated circuits and non-volatile memory devices including semiconductor integrated circuits - A semiconductor integrated circuit may include: a mode register and a clock delay control circuit. The mode register may store latency information corresponding to a plurality of frequencies. The clock delay control circuit may generate a delay clock signal using an external clock signal and the latency information. The delay clock signal may be used to control a timing margin of output data read during synchronous burst read operations of a non-volatile memory. A non-volatile memory device may include the semiconductor integrated circuit and a data output unit. The data output unit may use the delay clock signal to control the timing margin of the output data read during synchronous burst read operations. A memory system may include the semiconductor integrated circuit. A computing system may the semiconductor integrated circuit, as well as one or more of a memory controller, bus, modem, microprocessor, user interface, and battery.01-15-2009
20090016132Semiconductor memory devices, memory systems and computing systems including the same - A semiconductor memory device includes a reference current generating circuit configured to generate a bias signal in response to a precharge signal during a precharge operation. Each of a plurality of sense amplifier circuits is connected to a corresponding one of a plurality of bit lines. Each sense amplifier is configured to precharge a corresponding bit line in response to the bias signal. The reference current generating circuit is configured to maintain the bias signal at a level higher than a voltage of the bit lines, but lower than a supply voltage during a sensing operation.01-15-2009

Makoto Hirano, Osaka JP

Patent application numberDescriptionPublished
20080317181Single-Line Bidirectional Communication Apparatus and System - A communication apparatus (12-25-2008

Makoto Hirano, Kanagawa JP

Patent application numberDescriptionPublished
20110279990PRINTED BOARD AND ELECTRONIC EQUIPMENT INCORPORATING THE PRINTED BOARD - A printed board includes footprints which are electrically solder-bonded to a surface-mounting substrate, on which electronic components are mounted, and which assists the heat release from the surface-mounting substrate. The footprint comprises a fillet-forming division which is placed on an outer-edge side of the surface-mounting substrate and where solder is supplied independently when solder-bonding is performed. The fillet-forming division is solder-bonded to the same electrode as the electrode of the surface-mounting substrate to which the footprint is solder-bonded.11-17-2011