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Maitani
Shinya Maitani, Inuyama JP
| Patent application number | Description | Published |
|---|---|---|
| 20100316312 | SLIDING BEARING FOR INTERNAL COMBUSTION ENGINE - Disclosed is a sliding bearing for an internal combustion engine which is used as a cylindrical bearing by combining a pair of semi-cylindrical bearings. An axial groove A exists between the circumferential end surface and an opposite circumferential end surface. A circumferential oil groove and the axial groove A communicate with each other, depths of the circumferential oil groove in the communication portion and the axial groove A in the circumferential end surfaces differ from each other, and a groove bottom of the circumferential oil groove is located at a position displaced to a side of the inner circumferential bearing surface from the groove bottom of the axial groove A. A cross-sectional area of the circumferential oil groove in the communication portion is larger than a cross-sectional area of the axial groove A. | 12-16-2010 |
Tamio Maitani, Tokyo JP
| Patent application number | Description | Published |
|---|---|---|
| 20100112709 | HIGHLY SENSITIVE METHOD FOR DETECTING PROTEIN IN FOOD - A method for accurate and precise measurement of target proteins such as food allergen proteins in the specific foods is provided. The method is a method for immunological measurement of a food allergen protein in a processed food using an antibody against the food allergen protein, comprising adding animal tropomyosin to an assay solution upon measurement. | 05-06-2010 |
Tota Maitani, Tokyo JP
| Patent application number | Description | Published |
|---|---|---|
| 20090117730 | MANUFACTURING METHOD OF SEMICONDUCTOR INTEGRATED DEVICE - Manufacture of semiconductor products such as LCD driver requires a bump plating step for forming a gold bump electrode having a size of from about 15 to 20 μm. This bump plating step is performed by electroplating with a predetermined plating solution, but projections intermittently appear on the bump electrode during a mass production process. In the invention, abnormal growth of projections over the gold bump electrode is prevented by adding, prior to the gold bump plating step, a step of circulating and stirring a plating solution while erecting a plating cup and efficiently dissolving/discharging a precipitate. This step is performed for each wafer to be treated. | 05-07-2009 |
Tota Maitani, Kanagawa JP
| Patent application number | Description | Published |
|---|---|---|
| 20110117736 | MANUFACTURING METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE - When relatively hard Au bump electrodes are mass-produced by electrolytic plating while ensuring usually required properties such as a non-glossy property and shape-flatness, combination of conditions, such as low liquid temperature, high current density, and low concentration of added Tl (thallium) that is an adjuvant, will be selected by itself. However, in such conditions, there is a problem that it is difficult to maintain the Tl concentration in a plating solution and, when the Tl concentration is reduced, defective appearance of the Au bump electrodes is generated by anomalous deposition. Conventionally, there has been no means to directly monitor minute Tl concentration and the Tl concentration has been controlled by analyzing the plating solution periodically. However, this cannot prevent generation of a lot of defective products. | 05-19-2011 |
Yoshie Maitani, Tokyo JP
| Patent application number | Description | Published |
|---|---|---|
| 20110318298 | VIRAL INFECTION THERAPEUTIC DRUG CONTAINING POLYALKYLENEIMINE - Methods for administering a polyalkyleneimine to treat or prevent a viral infection, inactivate a virus, inhibit viral adsorption to a cell, and inhibit viral invasion of a cell are presented. | 12-29-2011 |
Yoshifumi Maitani, Nara JP
| Patent application number | Description | Published |
|---|---|---|
| 20090119525 | Power Supply Device and Communication System - The invention relates to a power supply device and a communication system. The power supply device supplies power to a main device. The communication system is provided with the main device mounting the power supply device therein and an external device connected to the main device. A feature of the invention is to offer a power supply device and a communication system that are capable of being responsive to external signals for returning to a normal operation mode with minimum power consumption in a power-saving operation mode. In the power saving operation mode, a main power supply circuit ( | 05-07-2009 |