Patent application number | Description | Published |
20090259327 | METHOD AND SYSTEM FOR UNIFIED AUDIO CONTROL ON A PERSONAL COMPUTER - A system and method for improved audio controls on a personal computer is provided. The system and method provide a unified architecture for audio controls across hardware and software interfaces of the personal computer. An intelligent facility may automatically change audio controls for users to simply interact with various communications and media applications. To this end, a configurable audio controller intelligently handles various aspects of the system's audio devices by following various rules that may be based at least in part on user-configurable settings and a current operating state. The present invention also provides audio controls so that a user may easily change audio settings such as the volume of an audio output device. There are many applications that may use the present invention for automatic control of audio devices based upon the user's context. | 10-15-2009 |
20090305695 | REAL-TIME COMMUNICATIONS ARCHITECTURE AND METHODS FOR USE WITH A PERSONAL COMPUTER SYSTEM - A system and method for improved real-time communications in a computer system that eliminates the distinctions between various communication devices, communication channels and types of communication, including voice, text and video, is provided. When connected for communication, the user may easily move between modalities, including switching devices on which the user is communicating, switching networks, and transitioning between types of communication. A computer system includes various integrated communications-related devices, and a controller controls those devices based on user actions entered via buttons or user interface software and provides notifications to the user. The user is able to input data via any appropriate input mechanism, and receive data on any suitable output mechanism. Improved non-linear caller ID navigation is also provided. | 12-10-2009 |
20100008488 | METHOD AND SYSTEM FOR UNIFIED AUDIO CONTROL ON A PERSONAL COMPUTER - A system and method for improved audio controls on a personal computer is provided. The system and method provide a unified architecture for audio controls across hardware and software interfaces of the personal computer. An intelligent facility may automatically change audio controls for users to simply interact with various communications and media applications. To this end, a configurable audio controller intelligently handles various aspects of the system's audio devices by following various rules that may be based at least in part on user-configurable settings and a current operating state. The present invention also provides audio controls so that a user may easily change audio settings such as the volume of an audio output device. There are many applications that may use the present invention for automatic control of audio devices based upon the user's context. | 01-14-2010 |
20100010653 | METHOD AND SYSTEM FOR UNIFIED AUDIO CONTROL ON A PERSONAL COMPUTER - A system and method for improved audio controls on a personal computer is provided. The system and method provide a unified architecture for audio controls across hardware and software interfaces of the personal computer. An intelligent facility may automatically change audio controls for users to simply interact with various communications and media applications. To this end, a configurable audio controller intelligently handles various aspects of the system's audio devices by following various rules that may be based at least in part on user-configurable settings and a current operating state. The present invention also provides audio controls so that a user may easily change audio settings such as the volume of an audio output device. There are many applications that may use the present invention for automatic control of audio devices based upon the user's context. | 01-14-2010 |
20120200518 | METHOD AND SYSTEM FOR UNIFIED AUDIO CONTROL ON A PERSONAL COMPUTER - A system and method for improved audio controls on a personal computer is provided. The system and method provide a unified architecture for audio controls across hardware and software interfaces of the personal computer. An intelligent facility may automatically change audio controls for users to simply interact with various communications and media applications. To this end, a configurable audio controller intelligently handles various aspects of the system's audio devices by following various rules that may be based at least in part on user-configurable settings and a current operating state. The present invention also provides audio controls so that a user may easily change audio settings such as the volume of an audio output device. There are many applications that may use the present invention for automatic control of audio devices based upon the user's context. | 08-09-2012 |
Patent application number | Description | Published |
20090205424 | FLEXURE TYPE ACCELEROMETER AND METHOD OF MAKING SAME - A proof mass for flexure type, magnetic and capacitance circuit accelerometer includes one or more standoff pads integrally formed on a fused silica paddle, such as being etched or patterned on the fused silica paddle. Further, the standoff pads have a thickness sufficient to locate at least a portion of one active coil in proximity to or even within a linear flux region of a magnetic circuit of the accelerometer. As such, the proof mass is configured to function with the magnetic circuit in a consistent and stable manner over a selected operational life of the accelerometer. | 08-20-2009 |
20100089154 | MOUNTING SYSTEM FOR TORSIONAL SUSPENSION OF A MEMS DEVICE - A mounting system for a MEMS device includes a proof mass selectively coupled to a substrate using a centrally located, single anchor mount that minimizes sensitivity to strain variations experienced by the MEMS device. The mounting system may include isolation cuts arranged in the proof mass to advantageously achieve a desired amount of strain isolation and to produce hinges that extend in opposite directions from the anchor mount. The single anchor mount is arranged to reduce a separation distance from a mid-point or centroid of the anchor mount to its perimeter as compared to conventional mounting schemes that have multiple anchor mounts positioned distally from a common mid-point. | 04-15-2010 |
20100105167 | MEMS DEVICES AND METHODS OF ASSEMBLING MICRO ELECTROMECHANICAL SYSTEMS (MEMS) - A Micro ElectroMechanical Systems device according to an embodiment of the present invention is formed by dicing a MEMS wafer and attaching individual MEMS dies to a substrate. The MEMS die includes a MEMS component attached to a glass layer, which is attached to a patterned metallic layer, which in turn is attached to a number of bumps. Specifically, the MEMS component on the glass layer is aligned to one or more bumps using windows that are selectively created or formed in the metallic layer. One or more reference features are located on or in the glass layer and are optically detectable. The reference features may be seen from the front surface of the glass layer and used to align the MEMS components and may be seen through the windows and used to align the bumps. As an end result, the MEMS component may be precisely aligned with the bumps via optical detection of the reference features in the glass layer. | 04-29-2010 |
20100147075 | MEMS DEVICES AND METHODS WITH CONTROLLED DIE BONDING AREAS - Microelectromechanical system (MEMS) devices and methods with controlled die bonding areas. An example device includes a MEMS die having a glass layer and a protective package. The glass layer includes a side facing the protective package with at least one mesa protruding from a recessed portion of the glass layer. The at least one mesa is attached to the protective package. An example method includes creating at least one mesa on a glass layer of a MEMS die and attaching the at least one mesa to a protective package. | 06-17-2010 |
20100181652 | SYSTEMS AND METHODS FOR STICTION REDUCTION IN MEMS DEVICES - Systems and methods for reducing stiction between elements of a microelectromechanical systems (MEMS) device during anodic bonding. The MEMS device includes a substrate cover with an optional conductor on its interior surface and the cover is anchored to a first portion of a sensing element. The MEMS device further includes a second portion of the sensing element separated from the substrate cover with a space and an antistiction element disposed between the second portion and cover. The antistiction element can be formed of a material type with high electrostatic resistance, to prevent stiction between MEMS device elements during anodic bonding. | 07-22-2010 |
20140109673 | STRESS REDUCTION COMPONENTS FOR SENSORS - An accelerometer device for reducing stress on the sensor resulting from temperature extremes and multiple coefficients of thermal expansion. An exemplary accelerometer device includes upper and lower stators and a reed. The reed includes a support ring and a paddle that is flexibly connected to the support ring. The support ring includes a ring section and at least two mounting devices. The mounting devices are at least partially mechanically isolated from the ring section. The ring section flexibly receives the paddle. The mounting devices include a pad area and a neck area that connect the pad area to the ring section. The neck area includes a width dimension that is narrower than a diameter dimension of the pad area. | 04-24-2014 |
Patent application number | Description | Published |
20080261343 | VACUUM PACKAGED SINGLE CRYSTAL SILICON DEVICE - A method for forming a vibrating micromechanical structure having a single crystal silicon (SCS) micromechanical resonator formed using a two-wafer process, including either a Silicon-on-insulator (SOI) or insulating base and resonator wafers, wherein resonator anchors, capacitive air gap, isolation trenches, and alignment marks are micromachined in an active layer of the base wafer; the active layer of the resonator wafer is bonded directly to the active layer of the base wafer; the handle and dielectric layers of the resonator wafer are removed; windows are opened in the active layer of the resonator wafer; masking the active layer of the resonator wafer with photoresist; a SCS resonator is machined in the active layer of the resonator wafer using silicon dry etch micromachining technology; and the photoresist is subsequently dry stripped. A patterned SCS cover is bonded to the resonator wafer resulting in hermetically sealed chip scale wafer level vacuum packaged devices. | 10-23-2008 |
20080261344 | VACUUM PACKAGED SINGLE CRYSTAL SILICON DEVICE - A method for forming a vibrating micromechanical structure having a single crystal silicon (SCS) micromechanical resonator formed using a two-wafer process, including either a Silicon-on-insulator (SOI) or insulating base and resonator wafers, wherein resonator anchors, capacitive air gap, isolation trenches, and alignment marks are micromachined in an active layer of the base wafer; the active layer of the resonator wafer is bonded directly to the active layer of the base wafer; the handle and dielectric layers of the resonator wafer are removed; windows are opened in the active layer of the resonator wafer; masking the active layer of the resonator wafer with photoresist; a SCS resonator is machined in the active layer of the resonator wafer using silicon dry etch micromachining technology; and the photoresist is subsequently dry stripped. A patterned SCS cover is bonded to the resonator wafer resulting in hermetically sealed chip scale wafer level vacuum packaged devices. | 10-23-2008 |
20080261372 | METHOD OF MANUFACTURING VIBRATING MICROMECHANICAL STRUCTURES - A method for fabrication of single crystal silicon micromechanical resonators using a two-wafer process, including either a Silicon-on-insulator (SOI) or insulating base and resonator wafers, wherein resonator anchors, a capacitive air gap, isolation trenches, and alignment marks are micromachined in an active layer of the base wafer; the active layer of the resonator wafer is bonded directly to the active layer of the base wafer; the handle and dielectric layers of the resonator wafer are removed; viewing windows are opened in the active layer of the resonator wafer; masking the single crystal silicon semiconductor material active layer of the resonator wafer with photoresist material; a single crystal silicon resonator is machined in the active layer of the resonator wafer using silicon dry etch micromachining technology; and the photoresist material is subsequently dry stripped. | 10-23-2008 |
20090007413 | METHOD OF MANUFACTURING VIBRATING MICROMECHANICAL STRUCTURES - A method for fabrication of single crystal silicon micromechanical resonators using a two-wafer process, including either a Silicon-on-insulator (SOI) or insulating base and resonator wafers, wherein resonator anchors, a capacitive air gap, isolation trenches, and alignment marks are micromachined in an active layer of the base wafer; the active layer of the resonator wafer is bonded directly to the active layer of the base wafer; the handle and dielectric layers of the resonator wafer are removed; viewing windows are opened in the active layer of the resonator wafer; masking the single crystal silicon semiconductor material active layer of the resonator wafer with photoresist material; a single crystal silicon resonator is machined in the active layer of the resonator wafer using silicon dry etch micromachining technology; and the photoresist material is subsequently dry stripped. | 01-08-2009 |