| Patent application number | Description | Published |
|---|
| 20080200102 | Polishing pad, use thereof and method for manufacturing the same - The present invention mainly relates to a polishing pad comprising a base material comprising fibers; a membrane with low permeability; and a buffer layer formed between the base material and an upper surface of the membrane with low permeability and embedded into the fibers of the base material. A method of polishing a substrate comprising using the polishing pad and a method for manufacturing the polishing pad as described above are also provided. | 08-21-2008 |
| 20080200105 | Carrier film for mounting polishing workpiece and method for making the same - The present invention relates to a carrier film for mounting a polishing workpiece. The carrier film comprises a surface substrate and a buffer substrate. The surface substrate comprises holes, and the material of the surface substrate comprises elastomer. The buffer substrate comprises holes, and the material of the buffer substrate comprises the elastomer. The surface substrate and the buffer substrate are adhered with adhesive comprising the elastomer. A method for making the carrier film is also provided. When polishing, the carrier film provides a good buffer property to conduct and release down force applied on the polishing workpiece. | 08-21-2008 |
| 20080268223 | Composite sheet for mounting a workpiece and the method for making the same - The present invention relates to a composite sheet for mounting a workpiece and a method for making the same. The composite sheet includes a buffer layer and an adsorption layer. The buffer layer has a plurality of continuous pores. The adsorption layer is located on the buffer layer for adsorbing a workpiece, and the compression ratio of the buffer layer is higher than that of the adsorption layer. Thereby, due to low hardness, good adsorption effect, and high compression ratio, the composite sheet of the present invention has good buffer effect. | 10-30-2008 |
| 20080268227 | Complex polishing pad and method for making the same - The present invention relates to a complex polishing pad and method for making the same. The method of the invention comprises the steps of: (a) providing a buffer layer, the buffer layer being continuous-porous material and having a surface; (b) flattening the surface of the buffer layer to form a flattened surface; and (c) disposing a polishing layer on the flattened surface so as to form the complex polishing pad, wherein the polishing layer is used to polish a polishing workpiece. Whereby, the complex polishing pad of the invention has a better flatness, and the buffer layer and the polishing layer have a stronger combination. | 10-30-2008 |
| 20080299879 | POLISHING PAD, THE USE THEREOF AND THE METHOD FOR MANUFACTURING THE SAME - The present invention mainly relates to a polishing pad comprising a base material comprising fibers; a membrane with low permeability; a two-component paste formed on the upper surface of the membrane with low permeability for adhering the base material to the membrane with low permeability; and a polyurethane paste formed on the lower surface of the membrane with low permeability. A method of polishing a substrate comprising using the polishing pad and a method for manufacturing the polishing pad as described above are also provided. The polishing pad as mentioned above prevents the polishing pad from detaching from the polishing platen or head. The polishing pad is easy to be replaced without leaving residues on the polishing platen or head. | 12-04-2008 |
| 20090252949 | COMPOSITE SHEET FOR MOUNTING A WORKPIECE AND THE METHOD FOR MAKING THE SAME - The present invention relates to a composite sheet for mounting a workpiece and a method for making the same. The composite sheet includes a buffer layer and an adsorption layer. The buffer layer has a plurality of continuous pores. The adsorption layer is located on the buffer layer for adsorbing a workpiece, and the compression ratio of the buffer layer is higher than that of the adsorption layer. Thereby, due to low hardness, good adsorption effect, and high compression ratio, the composite sheet of the present invention has good buffer effect. | 10-08-2009 |
| 20100227118 | SHEET HAVING DISCONTINUOUS ADHESION POINTS AND METHOD FOR MAKING THE SAME - The present invention relates to a sheet having discontinuous adhesion points and a method for making the same. The sheet includes a buffer layer, an adsorption layer, and an adhesion layer. The adhesion layer is disposed between the buffer layer and the adsorption layer. The adhesion layer has a plurality of adhesion points to bind the buffer layer and the adsorption layer together. The adhesion points are discontinuous and have gaps in between. Consequently, when the sheet is pressed, air can be vented out through the gaps between the adhesion points, so that the adsorption force is increased. | 09-09-2010 |
| 20110000141 | Polishing Pad, the Use Thereof and the Method for Manufacturing the Same - The present invention mainly relates to a polishing pad comprising a base material comprising fibers; a first membrane with low permeability; a two-component paste formed on the upper surface of the first membrane with low permeability for adhering the base material to the first membrane with low permeability; and a polyurethane paste formed on the lower surface of the first membrane with low permeability. A method of polishing a substrate comprising using the polishing pad and a method for manufacturing the polishing pad as described above are also provided. The polishing pad as mentioned above prevents the polishing pad from detaching from the polishing platen or head. The polishing pad is easy to be replaced without leaving residues on the polishing platen or head. | 01-06-2011 |
| 20110011007 | POLISHING MATERIAL HAVING POLISHING PARTICLES AND METHOD FOR MAKING THE SAME - The present invention relates to a polishing material having polishing particles and a method for making the same. The polishing material having polishing particles includes a base material, a plurality of polishing particles and a polymer elastic body. The base material has a plurality of fibers for defining a plurality of grid-spaces. The polishing particles are distributed in the grid-spaces. The polymer elastic body covers the base material and the polishing particles. Whereby, the polishing particles are uniformly distributed on a surface of a polishing workpiece during the polishing process. Furthermore, the base material prevents the polishing particles from contacting the polishing workpiece so as to avoid the scratch of the polishing workpiece. Also, the base material provides effects for sweeping the small grinded pieces. | 01-20-2011 |
| 20110045744 | Polishing Pad, Use Thereof and Method for Making the Same - The present invention relates to a polishing pad that comprises a polishing sheet for polishing a substrate, a buffer sheet comprising a plurality of holes, and adhesive for adhering the buffer sheet to the polishing sheet; wherein the adhesive is formed by polymerizing macromolecules with fluidity. A method of polishing a substrate comprising using the polishing pad and a method for manufacturing the polishing pad described above are also provided. | 02-24-2011 |
| 20110045751 | CARRIER FILM FOR MOUNTING POLISHING WORKPIECE AND METHOD FOR MAKING THE SAME - The present invention relates to a carrier film for mounting a polishing workpiece. The carrier film comprises a surface substrate and a buffer substrate. The surface substrate consists of first elastomer, the first elastomer comprising a plurality of first holes; wherein the first holes have a drop shape, and each of the first holes has an opening. The buffer substrate consists of second elastomer, the second elastomer comprising a plurality of second holes. The surface substrate and the buffer substrate are adhered with adhesive comprising the first or the second elastomer. A method for making the carrier film is also provided. When polishing, the carrier film provides a good buffer property to conduct and release down force applied on the polishing workpiece. | 02-24-2011 |
| 20110070814 | Method for Manufacturing Polishing Pad and Polishing Pad - The present invention relates to a method for manufacturing a polishing pad. The method of the invention includes the steps of forming a polishing layer from a polyurethane solution has a solid content more than about 90 wt % and drying the polyurethane solution at a temperature from about 130° C. to about 170° C. The invention also provides a polishing pad manufactured by the method mentioned above. The defect of scraping the surface of the substrate to be polished due to polishing particles remaining is avoided when applying the polishing pad according to the invention, and the flatness of the substrate to be polished is raised and the defective rate is eliminated also. | 03-24-2011 |
