Patent application number | Description | Published |
20080232996 | Method for Fabricating Parts by PIM or MICROPIM - “The present invention relates to a method for fabricating parts by an injection molding technique including preparing a feedstock—having at least one powder mixed with a polymer binder solubilized in a solvent, injecting the feedstock into the mold under pressure, debinding, and sintering where the feedstock is maintained at a temperature above a solvent vaporization temperature during the pressing.” | 09-25-2008 |
20080264517 | Device for Distribution of at Least One Granular Product in a Container Filling Device and Method for Filling Using Such a Device - A device for distributing granular materials in a recipient, particularly of complex shape intended to be arranged between a feed hopper and the recipient to be filled. The device includes a deflector, mobile in rotation around an axis, lining a passage linking the hopper to the recipient. The deflector is formed by at least one surface that may be inclined in relation to the axis of rotation approaching the axis in the direction of flow of the granules, or perpendicular to the axis. According to the speed of rotation, a certain quantity of granules is ejected by the deflector and another part passes directly in the passage. | 10-30-2008 |
20090115092 | PROCESS FOR MANUFACTURING A MASTERBATCH FOR INJECTION MOULDING OR FOR EXTRUSION - The invention relates to a method for preparing a feedstock for injection moulding or for extrusion, consisting of inorganic powders combined with an organic, particularly polymeric binder. This method is characterized in that the constituent particles of the inorganic powders are subjected to a granulation step, prior to their mixing with the polymeric binder. | 05-07-2009 |
20090283875 | Self-supported film and silicon wafer obtained by sintering - Self-supported film and silicon wafer obtained by sintering. A silicon wafer for a photovoltaic cell is produced by a debinding step of a self-supported film formed of at least one main thin layer comprising at least 50% volume of silicon particles, devoid of silicon oxide and encapsulated in a polymer matrix protecting them against oxidation, followed by a sintering step to form the silicon wafer. | 11-19-2009 |
20100320223 | FILLING DEVICE FOR AT LEAST TWO GRANULAR MATERIALS AND FILLING METHOD USING SUCH A DEVICE - A filling device, enabling simultaneous filling with at least two granular materials, without mixing them, includes an inner hopper supplying a first type of material and an outer hopper supplying a second type of material, and a dispenser arranged downstream from the hoppers. The dispenser includes a central passageway arranged directly opposite the inner hopper, and a deflecting mechanism towards the exterior of the dispenser arranged directly opposite the outer hopper. The deflecting mechanism at least partially borders the central passageway. The dispenser is capable of rotating about a longitudinal axis, the direction of which is the mean direction of flow, in which the dispenser includes a central shaft including an upper end opposite the inner hopper forming a deflecting surface for the first type of material coming from the inner hopper. | 12-23-2010 |
20110220193 | PHOTOVOLTAIC CELL WITH DISTRIBUTED EMITTER IN A SUBSTRATE, AND METHOD FOR MANUFACTURE OF SUCH A CELL - A photovoltaic cell including a substrate composed of a semiconductor of a first type of conductivity including two main faces substantially parallel with one another, the substrate including a plurality of blind holes, openings of which are positioned in a single one of the two main faces, and the blind holes filled by a semiconductor of a second type of conductivity opposed to the first type of conductivity forming an emitter of the photovoltaic cell. The substrate forms a base of the photovoltaic cell. First collector pins composed of a semiconductor of the second type of conductivity are in contact with the emitter of the photovoltaic cell, and second collector pins composed of a semiconductor of the first type of conductivity are in contact with the substrate and interdigitated with the first collector pins. | 09-15-2011 |
20130040105 | DEVICE AND METHOD FOR MECHANICALLY TEXTURING A SILICON WAFER INTENDED TO COMPRISE A PHOTOVOLTAIC CELL, AND RESULTING SILICON WAFER - A solution for texturing silicon wafers configured to constitute photovoltaic (PV) cells. Silicon wafers can be produced, the surface of which include uniformly engraved patterns having a depth of between 5 and 50 μm. | 02-14-2013 |
20140018483 | METHOD FOR PRODUCING CERAMIC OR METAL COMPONENTS BY MEANS OF POWDER INJECTION MOULDING, BASED ON THE USE OF INORGANIC FIBRES OR NANOFIBRES - The invention first relates to a feedstock for PIM, including a metal or ceramic powder; a polymeric binder; metallic or ceramic fibres or nanofibres, the fibres or nanofibres being metallic when the powder is metallic, and the fibres or nanofibres being ceramic when the powder is ceramic. It also relates to the method for producing such a feedstock, as well as the method for producing parts by means of powder injection moulding (PIM) using said feedstock. | 01-16-2014 |
20140021660 | METHOD FOR PRODUCING COMPONENTS BY MEANS OF POWDER INJECTION MOULDING, BASED ON THE USE OF ORGANIC YARNS OR FIBRES, ADVANTAGEOUSLY TOGETHER WITH THE USE OF SUPERCRITICAL CO2 - The invention relates to a feedstock for power injection molding, PIM, comprising: at least one inorganic powder, advantageously metallic or ceramic or made of cermet; a polymeric binder; organic fibres or yarns, advantageously polymeric, the fibres or yarns being made of a material different from that of the polymeric binder. It then relates to the method for producing such a feedstock, as well as the method for producing parts by means of the powder injection moulding (PIM) technique using said feedstock. | 01-23-2014 |