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Luan
Bing Luan, Shanghai CN
| Patent application number | Description | Published |
|---|---|---|
| 20110245145 | METHODS AND REAGENTS FOR THE DIAGNOSIS, PREVENTION AND TREATMENT OF INSULIN RESISTANCE - The present invention provides the use of βarrestin2 protein or its up-regulators for manufacturing a composition for the prevention or treatment of insulin resistance or related disease in mammals. The reagents and the kits for the specific identification of βarrestin2 protein or its coding gene or transcript are also provided which can be used in diagnosis of insulin resistance or related diseases. | 10-06-2011 |
Feng Luan, Strathfield AU
| Patent application number | Description | Published |
|---|---|---|
| 20100067555 | TUNABLE OPTICAL SUPERCONTINUUM ENHANCEMENT - A method and apparatus for providing optical supercontinuum. The method comprises creating a spectrally narrow phase feature within a supercontinuum spectrum produced from a laser pulse that has been subjected to supercontinuum generation, thereby producing a modified supercontinuum spectrum, and propagating the modified supercontinuum spectrum through an optical waveguide that is suitable for supercontinuum generation, thereby further modifying the modified supercontinuum spectrum. The method may include modifying the modified supercontinuum spectrum by increasing its energy in a vicinity of the phase feature. | 03-18-2010 |
Guoyan Luan, Xiamen CN
| Patent application number | Description | Published |
|---|---|---|
| 20110129828 | SPECIFIC DOUBLE-STRANDED PROBES FOR HOMOGENEOUS DETECTION OF NUCLEIC ACID AND THEIR APPLICATION METHODS - Nucleic acid detection probes that comprise a pair of complementary, fluorophore/quencher labeled oligonucleotides, one of which is shorter than the other, are able to detect single-stranded and double-stranded targets in hybridization reactions and amplification reactions with real-time detection. Double-stranded probes of equal length are useful in PCR amplification reactions with real-time detection. | 06-02-2011 |
Haoheng Luan, Zhaoyuan CN
| Patent application number | Description | Published |
|---|---|---|
| 20090036810 | Leg and foot massage device capable of achieving foot swing - The present invention relates to a massage device, and more particularly, to a leg and foot massage device capable of achieving foot swing. The device includes an electrical machinery deceleration element, a wobbler machine element and an air inflatable bag massage element. The electrical machinery deceleration element drives the air inflatable bag massage element through the wobbler machine element, and the electrical machinery realizes the one-off deceleration. Therefore mechanical transmission steps are simplified and transmission noise obviously dropped, wobbler machine element cooperates with air inflatable bags' inflation and deflation, generating many kinds of different massage motions and obtaining a comprehensive massage effect on leg and feet muscles and joints. | 02-05-2009 |
Hongzhou Luan, Beijing CN
| Patent application number | Description | Published |
|---|---|---|
| 20110216518 | Self-Cooled Thyristor Valve - The present invention relates to a self-cooled thyistor device for ultra-high voltage fault current limiter. a self-cooled thyristor valve, it adopts horizontal structure consisted by frames, frames is divided into upper and below two spaces by crossbeams, the bottom of frames is supported by insulators. There is a cross plate between two vertical said frames, the cross plate mounts resistors connect with a high potential plate and capacitor through two wires. There is a thyistor string in said frame upper space, which is constituted of thyistors and cooler series. The thyistor string is compressed tightly by press-fit mechanism, thyistor string crosses current transformers. There are high potential plates on both sides of the thyistor, the number of the potential plates is equal to that of thyistor. One side of the high potential plates links frames, said current transformers connects with high potential plates. There are capacitors and resistors connected with the bottom plate of said frames in the below space. The small and well-structured invention meets the requirement of the energy on continuous trigger condition, improves the global reliability of thyristor valve. | 09-08-2011 |
Jian Luan, Beijing CN
| Patent application number | Description | Published |
|---|---|---|
| 20110166861 | METHOD AND APPARATUS FOR SYNTHESIZING A SPEECH WITH INFORMATION - According to one embodiment, an apparatus for synthesizing a speech, comprises an inputting unit configured to input a text sentence, a text analysis unit configured to analyze the text sentence so as to extract linguistic information, a parameter generation unit configured to generate a speech parameter by using the linguistic information and a pre-trained statistical parameter model, an embedding unit configured to embed information into the speech parameter, and a speech synthesis unit configured to synthesize the speech parameter with the information embedded by the embedding unit into a speech with the information. | 07-07-2011 |
| 20110320199 | METHOD AND APPARATUS FOR FUSING VOICED PHONEME UNITS IN TEXT-TO-SPEECH - According to one embodiment, an apparatus for fusing voiced phoneme units in Text-To-Speech, includes a reference unit selection module configured to select a reference unit from the plurality of units based on pitch cycle information of the each unit and the number of pitch cycles of the target segment. The apparatus includes a template creation module configured to create a template based on the reference unit selected by the reference unit selection module and the number of pitch cycles of the target segment, wherein the number of pitch cycles of the template is same with that of pitch cycles of the target segment. The apparatus includes a pitch cycle alignment module configured to align pitch cycles of each unit of the plurality of units except the reference unit with pitch cycles of the template by using a dynamic programming algorithm. | 12-29-2011 |
Jing-En Luan, Singapore SG
| Patent application number | Description | Published |
|---|---|---|
| 20100140810 | CHIP PACKAGE WITH COPLANARITY CONTROLLING FEATURE - A chip package includes a substrate, an integrated circuit proximate a top surface of the substrate, and a cap comprising encapsulant that encapsulates the integrated circuit on at least a portion of the top surface of the substrate. The chip package further includes at least one extension feature positioned on at least a portion of the top surface of the substrate. The at least one extension feature also comprises the encapsulant and extends from the cap to a perimeter of the substrate. | 06-10-2010 |
| 20100148347 | CHIP SCALE PACKAGE STRUCTURE WITH CAN ATTACHMENT - A chip scale package (CSP) device includes a CSP having a semiconductor die electrically coupled to a plurality of solder balls. A can having an inside top surface and one or more side walls defines a chamber. The CSP is housed in the chamber and is attached to the inside top surface of the can. A printed circuit board is attached to the solder balls and to the one or more side walls to provide support to the CSP and to the can. The CSP may be a Wafer-Level CSP. The can may be built from a metallic substance or from a non-metallic substance. The can provides stress relief to the CSP during a drop test and during a thermal cycle test. | 06-17-2010 |
| 20100148363 | STEP CAVITY FOR ENHANCED DROP TEST PERFORMANCE IN BALL GRID ARRAY PACKAGE - A ball grid array (BGA) package includes a substrate layer having first and second sides. A semiconductor chip is attached to the first side of the substrate layer by a dielectric adhesive layer. A plurality of solder balls are attached to the second side of the substrate layer. The solder balls may be set out by rows and columns. A plurality of wires electrically connect the semiconductor chip to the solder balls. A layer of encapsulating compound is deposited over the semiconductor chip. A step cavity of a selected depth and shape is formed in the layer of encapsulating compound at or near the edge or periphery of the layer of encapsulating compound. The step cavity is separated from the solder balls by the substrate layer but spans over a plurality of selected solder balls. | 06-17-2010 |
| 20100297813 | Semiconductor package with position member - The present disclosure provides a very thin semiconductor package including a leadframe with a die-attach pad and a plurality of lead terminals, a die attached to the die-attach pad and electrically connected to the lead terminals via bonding wires, a position member disposed upon the die and/or die-attach pad, and a molding material encapsulating the leadframe, the die, and the position member together to form the semiconductor package. The method for manufacturing a very thin semiconductor package includes disposing a first position member on one side of the die-attach pad of a leadframe, attaching a die onto the opposite side of the die-attach pad, optionally disposing a second position member on top of the die, electrically connecting the die to the lead terminals of the leadframe, and encapsulating the leadframe, the die, and the position member(s) together to form the very thin semiconductor package. | 11-25-2010 |
| 20100327421 | IC PACKAGE DESIGN WITH STRESS RELIEF FEATURE - A protective structure is provided on a substrate to which a semiconductor die is attached. The protective structure surrounds the die and reduces the thermo-mechanical stresses to which the die is subject. The die is protected against cracking, warping, and delamination. | 12-30-2010 |
| 20110018125 | SEMICONDUCTOR PACKAGE WITH A STIFFENING MEMBER SUPPORTING A THERMAL HEAT SPREADER - A semiconductor package includes a substrate board and a semiconductor die attached to a top surface of that substrate board. A heat spreader is provided over the semiconductor die. A stiffening ring is positioned surrounding the semiconductor die, the stiffening ring being attached to the top surface of the substrate board and attached to a bottom surface of the plate portion of the heat spreader. Space is left on the board outside of the stiffening ring to support the installation of passive components to the substrate board. An external ring may be included, with that external ring being interconnected to the stiffening ring by a set of tie bars. Alternatively, the heat spreader includes an integrally formed peripheral sidewall portion. | 01-27-2011 |
| 20110156240 | RELIABLE LARGE DIE FAN-OUT WAFER LEVEL PACKAGE AND METHOD OF MANUFACTURE - A fan-out wafer level package includes a semiconductor die with contact pads positioned on a top surface. A fan-in redistribution layer positioned over the die includes contact pads in electrical communication with the first contact pads of the die. A buffer layer positioned over the fan-in layer includes a plurality of vias, in electrical contact with the contact pads of the fan-in layer. A fan-in redistribution layer is positioned over the buffer layer and includes contact pads on a surface opposite the buffer layer, in electrical communication with the vias. The semiconductor die, fan-in layer, and buffer layer are encapsulated in a molding com-pound layer. Solder contacts, for electrically connecting the semiconductor device to a electronic circuit board, are positioned on contact pads of the fan-out layer. The buffer layer has a substantial thickness, to reduce and distribute shear stresses resulting from thermal mismatch of coefficients of thermal expansion of the semiconductor die and a circuit board. | 06-30-2011 |
| 20110156250 | FLIP-CHIP FAN-OUT WAFER LEVEL PACKAGE FOR PACKAGE-ON-PACKAGE APPLICATIONS, AND METHOD OF MANUFACTURE - A flip-chip fan-out wafer level package for package-on-package applications includes a semiconductor die with solder bumps on an upper surface in a flip chip configuration. The die is inverted, with an upper surface facing an upper side of a redistribution layer, with the solder bumps in electrical contact with respective chip contact pads of the redistribution layer. The redistribution layer includes conductive traces that place each of the solder bumps in electrical contact with one or both of one of a plurality of upper redistribution contact pads and one of a plurality of lower redistribution contact pads. Each of the plurality of upper redistribution contact pads has an upper solder ball in electrical contact therewith. The die and the upper solder balls are at least partially encapsulated in a layer of mold compound positioned on the upper surface of the redistribution layer, and whose lateral dimensions are defined by the lateral dimensions of the redistribution layer. The layer of mold compound has a back-ground surface at which a portion of each of the upper solder balls is exposed, for electrical contact with an upper package. Each of the lower redistribution contact pads has a lower solder ball a coupled thereto. | 06-30-2011 |
| 20110157452 | FAN-OUT WAFER LEVEL PACKAGE FOR AN OPTICAL SENSOR AND METHOD OF MANUFACTURE THEREOF - An optical sensor package has a transparent substrate with a redistribution layer formed on a face thereof, which includes a window and a plurality of electrically conductive traces. A semiconductor substrate, including an optical sensor and a plurality of contact terminals on a face thereof, is positioned on the transparent substrate in a face-to-face arrangement, with the optical sensor directly opposite the window, and with each of the contact terminals electrically coupled to a respective one of the electrically conductive terminals. The transparent substrate has larger overall dimensions than the semiconductor substrate, so that one or more edges of the transparent substrate extend beyond the corresponding edges of the semiconductor substrate. A plurality of solder balls are positioned on the face of the transparent substrate, each in electrical contact with a respective one of the electrically conductive terminals. The solder balls and the semiconductor substrate are at least partially encapsulated in an encapsulating layer formed on the face of the transparent substrate, which has been planarized to expose upper portions of the solder balls, as contact pads of the optical sensor package. | 06-30-2011 |
Ju Luan, Hong Kong CN
| Patent application number | Description | Published |
|---|---|---|
| 20100286291 | MULTIPLEX DETECTION OF HEPATITIS VIRUS VARIATIONS - Disclosed is a method for the detection of virus variations. Disclosed also is a method for the treatment of virus infection in a subject based on the detection of virus variations. Additionally, a kit is provided for the detection of virus variations. | 11-11-2010 |
Qing Luan, Xian CN
| Patent application number | Description | Published |
|---|---|---|
| 20090109236 | LOCALIZED COLOR TRANSFER - Techniques for providing localized color transfer are disclosed. In some aspects, a user may select a source region of a source image and a destination region of a destination image. The source region and the destination region may be associated by a designator to create a color transfer pair. A localized color transfer based on the color style of the source region may be implemented to modify the destination region color style. Further aspects may include optimizing the destination image to reduce discontinuities resulting from the color transfer and enabling the user to select regions of the destination image which are not modified by localized color transfer. | 04-30-2009 |
Qing Luan, Beijing CN
| Patent application number | Description | Published |
|---|---|---|
| 20100085383 | RENDERING ANNOTATIONS FOR IMAGES - Techniques are described for rendering annotations associated with an image. A view of an image maybe shown on a display, and different portions of the image are displayed and undisplayed in the view according to panning and/or zooming of the image within the view. The image may have annotations. An annotation may have a location in the image and may have associated renderable media. The location of the annotation relative to the view may change according to the panning and/or zooming. A strength of the annotation may be computed, the strength changing based the panning and/or zooming of the image. The media may be rendered according to the strength. Whether to render the media may be determined by comparing the strength to a threshold. | 04-08-2010 |
Quoc Hung Luan, Toulouse FR
| Patent application number | Description | Published |
|---|---|---|
| 20100308473 | METHOD FOR MAKING AN ELECTRICALLY CONDUCTING MECHANICAL INTERCONNECTION MEMBER - A method of fabricating an electrically conductive mechanical interconnection element ( | 12-09-2010 |
Shang-Wen Luan, Kaohsiung County TW
| Patent application number | Description | Published |
|---|---|---|
| 20110291695 | MONITORING DEVICE FOR AN ELECTRIC POWER SYSTEM - A monitoring device for an electric power system includes a detection unit and a display unit. The detection unit has a power module, a current detecting module and a transmission module. The power module includes positive and negative electrodes and is coupled to the current detecting module. The current detecting module includes a first switching unit and a second switching unit. The first and second switching units are coupled between the positive and negative electrodes to detect currents on detection points of the electric power system. The transmission module includes a micro-controller unit and a transmission device coupled to the micro-controller unit. The micro-controller unit includes a first end and a second end. The first end is coupled to the first switching unit and the second end is coupled to the second switching unit. The display unit is coupled to the transmission device for receiving signals from the detection unit. | 12-01-2011 |
| 20110309830 | CURRENT DETECTING AND INDICATING DEVICE - A current detecting and indicating device includes a detection unit and a display unit. The detection unit has a power module, a current detecting module, a multiplexer module and a transmission module. The power module includes positive and negative electrodes. The current detecting module includes a plurality of upper-limit switching units and a lower-limit switching unit. Each upper-limit switching unit has two ends coupled to the positive and negative electrodes, and the lower-limit switching unit has two ends coupled to the positive and negative electrodes. The multiplexer module includes a first input port and a first output port. The transmission module includes a micro-controller unit and a transmission device. The micro-controller unit includes a low-level end, a high-level end and a second input port. The second input port is coupled to the first output port. The display unit is coupled to the transmission device for receiving signals therefrom. | 12-22-2011 |
Shifang Luan, Changchun City CN
| Patent application number | Description | Published |
|---|---|---|
| 20110288236 | RESIN COMPOSITION - The present invention provides a resin composition consisting of a functionalized polypropylene (PP) and a functionalized styrenic thermoplastic elastomer (TPS). The functionalized PP is a PP grafted with N-vinyl pyrrolidone (NVP) and glycidyl methacrylate (GMA), and the functionalized TPS is a TPS grafted with acrylamide or methacrylamide. The functionalized PP and the functionalized TPS are subjected to melt blending to obtain the resin composition with a slight cross-linking structure due to the reaction between GMA and acrylamide or methacrylamide, therefore the resin composition presents good physical properties. Besides, the resin composition without additional plasticizer or other small molecular organic compounds can be utilized in blood bags, blood transfusion and collection apparatuses, etc. Thus, it does not release small molecular substances which are of potential harm to human body during use. | 11-24-2011 |
Ta-Nien Luan, Hsinchu TW
| Patent application number | Description | Published |
|---|---|---|
| 20120026577 | DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF - A display device includes an active element array substrate, a display layer and a transparent shock absorption layer. The display layer is disposed on the active element array substrate. The transparent shock absorption layer is disposed on the display layer. The transparent shock absorption layer is formed by curing liquid adhesive material. A manufacturing method of display device is also provided. | 02-02-2012 |
Yuanhua Luan, Shenzhen CN
| Patent application number | Description | Published |
|---|---|---|
| 20090175435 | METHOD AND APPARATUS FOR DETERMINING INTERNAL USER FOR CALL CENTER SYSTEM - The disclosure relates to a method and apparatus for determining an internal user for a call center system. The information servicing function provided in the existing communication networks may be utilized in the invention. After a call initiated from an internal user for a call center system to an external user fails, the call center system sends the call information to the external user in a timely manner so that the external user can obtain identification information of the internal user for the call center system in a timely and accurate manner. With the invention, the possibility of reaching the internal user for the call center system is enhanced and thus the interests of the external user and the enterprise entity can be secured. | 07-09-2009 |
Yuantao Luan, Beijing CN
| Patent application number | Description | Published |
|---|---|---|
| 20110130179 | ANTENNA DEVICE AND PORTABLE ELECTRONIC DEVICE COMPRISING SUCH AN ANTENNA DEVICE - An antenna device for a portable electronic device, preferably for the FM frequency range, generally includes a monopole radiating and/or radiation receiving element including a feeding portion adapted to be connected to an antenna connection point. An inductor is connectable between the antenna connection point and ground. The input of an amplifier stage is also connectable to the antenna connection point. An output of the amplifier stage is connectable to a radio circuit, all provided in the interior of the portable electronic device. | 06-02-2011 |