Patent application number | Description | Published |
20080232961 | FAN AND FAN FRAME THEREOF - A fan frame of a fan includes a main body, a base and at least one connecting element. The main body has at least one mounting portion and at least one auxiliary passage, which are not communicated with each other. A main passage is disposed in the main body, and the auxiliary passage is obliquely communicated with the main passage from the upper part of the main body. The base is disposed in the central portion of the main body. The connecting element is disposed between the main body and the base. A fan including such fan frame is also disclosed. | 09-25-2008 |
20130056902 | MOTOR AND MANUFACTURING METHOD THEREOF AND FAN - A method for manufacturing a motor includes the following steps of: providing a substrate with an opening and a bushing; disposing the bushing within the opening of the substrate; providing a cushioning material disposed between the substrate and the bushing by injection molding. | 03-07-2013 |
20130068425 | ELECTRONIC DEVICE AND HEAT DISSIPATION MODULE AND CENTRIFUGAL FAN THEREOF - A centrifugal fan is provided. The centrifugal fan includes an impeller and a housing. The housing includes an upper plate, a lower plate and a side wall, wherein the upper plate axially corresponds to the lower plate, a side wall is formed between the upper plate and the lower plate, an axial inlet is formed on the upper plate, a lateral outlet is formed on the side wall, the impeller is disposed in the housing and corresponds to the inlet, and a flow path communicates the inlet to the outlet, wherein the housing further includes a guiding groove, and at least one auxiliary inlet is formed in the guiding groove. | 03-21-2013 |
20130071238 | CENTRIFUGAL FAN - A centrifugal fan is provided. The centrifugal fan includes an impeller and a housing. The impeller has an impeller diameter. The housing includes an upper plate, a lower plate and a side wall, wherein the upper plate axially corresponds to the lower plate, a side wall is formed between the upper plate and the lower plate, an axial inlet is formed on the upper plate, a lateral outlet is formed on the side wall, the impeller is disposed in the housing and corresponds to the inlet, and a flow path communicates the inlet to the outlet, wherein a greatest width of the inlet is greater than or equal to the impeller diameter. | 03-21-2013 |
20150068719 | HEAT SINK - A heat sink includes a heat conduction portion and a heat dissipation portion. The heat conduction portion has a thickness, and a flat portion of the heat conduction portion contacts a heat source. The heat dissipation portion is extended from at least one side of the thickness of the heat conduction portion and includes at least a bending portion including a plurality of holes. | 03-12-2015 |
Patent application number | Description | Published |
20090046422 | Protection structure for heat dispersing device of power supplier - The present invention includes a metal housing, a power input end, a power output end, and an accommodating space thereinside between the power input end and the power output end, the accommodating space has a power processing unit mounted inside and the output terminal of the power processing unit is located at the power output end of the power supplier. The metal housing of the power supplier has an assembling opening mounted thereon and located above the accommodating space for assembling at least a heat dispersing device. The protection structure includes a fixing frame, mounted in the accommodating space and fixedly connected with two sides of the heat dispersing device and the metal housing, and a metal protection case, covered on the assembling opening and tightly engaged with the metal housing, wherein the metal protection case and the fixing frame respectively have positioning portions corresponding to each other. | 02-19-2009 |
20100177465 | REDUNDANT POWER SYSTEM TRANSFORMATION STRUCTURE - A transformation structure for a redundant power system which includes at least two power supplies and a first circuit board to cluster the power supplies and deliver output thereof and a second circuit board electrically connected to the first circuit board. The second circuit board is coupled with at least one transformation module according to output potentials defined by users. The transformation module receives power from the second circuit board and regulates at least one output power. Hence, the present invention could be formed in an independent module with a function of power transformation. Thereby, the transformation module can be selected and mounted onto the second circuit board according to customer's requirements. The second circuit board has a sufficient area serving heat radiation and insulation. The present invention can obtains merits of decreasing the product size, enhancing heat radiation and providing changeable output specifications to meet customizing requirements. | 07-15-2010 |
20100177466 | REDUNDANT POWER SYSTEM OUTPUT STRUCTURE - An output structure for a redundant power system includes at least two power supplies, a first circuit board and a second circuit board. The power supplies and the first circuit board have respectively a first connection port and a second connection port that correspond and connect to each other. The second connection ports are electrically connected to at least one conductive element to conduct output of the power supplies. The conductive element has another end transporting power to the second circuit board. The second circuit board has at least one transformation circuit to regulate the power passing through the conductive element to form at least one output power to a load. Through the first and second circuit boards, the power of multiple power supplies can be clustered and transformed and delivered. Heat dissipation improves and the size can be shrunk, and insulation density between circuit elements can be maintained. | 07-15-2010 |
20100253155 | STRUCTURE FOR TRANSMISSION IN POWER SUPPLY - A structure for transmission in a power supply, particularly to a power structure for transmission for bearing large DC current, wherein the power supply includes a power input port for connecting to DC input power and a DC/DC conversion circuit for converting the DC input power into DC output power. The architecture including at least one power transmission board for disposing the power input port, wherein the power transmission board is electrically connected to the power process board with the DC/DC conversion circuit mounted thereon by at least one power conduction element. Therefore, through the power conduction elements replacing the conventional connecting wires with large diameter to connect the power input port and the power process board without disobeying the safety regulation, not only the space occupied by the bent connection wires can be reduced, but the collisions and damage to other components caused therefrom also can be avoided. | 10-07-2010 |
20100254097 | OUTPUT ARCHITECTURE OF POWER SUPPLY - An output architecture of a power supply is disclosed, wherein the power supply includes an input portion to obtain input power and a conversion circuit board connecting to the input portion to convert the input power into output power of different voltage potential. The conversion circuit board includes plural power output areas with different preset output voltages, and after selecting the output standard, the power output areas connect to at least one power extension board via plural electrical conductive elements, so as to provide the power extension board the output power, and the power extension board has plural output wires connected to a load. Through the architecture described above, the corresponding output wires can be selected after the output standard is selected for connecting to the power extension board, and then, the power extension board is connected to the conversion circuit board. | 10-07-2010 |
20100254105 | PRINTED CIRCUIT BOARD FASTENING STRUCTURE - A printed circuit board fastening structure aims to fasten a printed circuit board which has a first bearing surface abutting and coupling on a casing and a second bearing surface. The first bearing surface is coupled with at least one support member. The support member has at least one leg connecting to the first bearing surface and an end portion formed with a fastening hole. The end portion is adjacent to the casing. A fastening element is provided to run through the casing from another side thereof to couple with the support member, thereby to fasten the printed circuit board to the casing. | 10-07-2010 |
Patent application number | Description | Published |
20140115888 | METHOD OF MANUFACTURING A CHIP SUPPORT BOARD STRUCTURE - A method of manufacturing a chip support board structure which includes the steps of forming a metal substrate structure, forming a photo resist pattern, etching the metal substrate structure to form a paddle, removing the photo resist pattern, pressing an insulation layer against the paddle, polishing the insulation layer, forming a circuit layer and forming a solder resist is disclosed. The metal substrate structure is formed by sandwiching a block layer with two metal substrate layers, multilayer. The metal substrate structure is etched under control to an effective depth such that each paddle thus formed has the same shape and depth. Therefore, the method of the present invention can be widely applied to the general mass production processes to effectively solve the problems in the prior arts due to depth differences, such offset, position mismatch and peeling off in the chip support board. | 05-01-2014 |
20140115889 | METHOD OF MANUFACTURING A LAMINATE CIRCUIT BOARD - A method of manufacturing a laminate circuit board which includes the sequential steps of metalizing the substrate to form the base layer, forming the first circuit metal layer, forming at least one insulation layer and at least one second circuit metal layer interleaved, removing the substrate, forming the support frame and forming the solder resist is disclosed. The laminate circuit board has a thickness less than 150 μm. The support frame which does not overlap the first circuit metal layer is formed on the edge of the base layer by the pattern transfer process after the substrate is removed. The base layer formed of at least one metal layer is not completely removed. The support frame provides enhanced physical support for the entire laminate circuit board without influence on the electrical connection of the circuit in the second circuit metal layer, thereby solving the warping problem. | 05-01-2014 |
20140116755 | LAMINATE CIRCUIT BOARD STRUCTURE - A laminate circuit board structure which includes a first circuit metal layer, a first insulation layer, at least one second circuit metal layer, at least one second insulation layer and a support frame is disclosed. The total thickness of the laminate circuit board structure is less than 150 μm. The support frame provided at the outer edge of the co-plane surface formed by the first circuit metal layer and the first insulation layer does not cover the first circuit metal layer, and is formed of at least one metal material. The support frame provides physical support for the entire board structure without influence on the circuit connection so as to prevent the laminate circuit board structure from warping. | 05-01-2014 |
20140116757 | CHIP SUPPORT BOARD STRUCTURE - A chip support board structure which includes at least a metal substrate, a block layer, a paddle, an insulation layer, a circuit layer and a solder resist is disclosed. The circuit layer connects with the paddle. The material of the block layer is different from that of the metal substrate and the block layer is provided between the metal substrate and the paddle such that the shape and the depth of the paddle is maintained constant and the problem of different depth and easily peeling off is avoided, thereby improving the yield rate of the chip support board. | 05-01-2014 |
20140290057 | METHOD OF MANUFACTURING A STACKED MULTILAYER STRUCTURE - Disclosed is a method of manufacturing a stacked multilayer structure, including the steps of forming a first circuit layer with bumps on a substrate, punching an aluminum plate to form recesses corresponding to the bumps, forming openings in a plastic film including a glass fiber layer corresponding to the bumps, pressing the aluminum plate, the plastic film and the substrate, removing the aluminum plate, polishing to level the resulting surface, forming a second circuit layer connected to the first circuit layer, and finally removing the substrate to form the stacked multilayer structure. Because the glass fiber layer in the plastic film is not exposed after polishing, the thickness of the dielectric layer is uniform and the reliability of the circuit layer is improved so as to increase the yield. | 10-02-2014 |
20140290983 | STACKED MULTILAYER STRUCTURE - Disclosed is a stacked multilayer structure, including a first circuit layer having bumps, a plastic film stacked on the first circuit layer to fill up the space among the bumps so as to form a co-plane, and a second circuit layer formed on the co-plane and connected to the first circuit layer. The plastic film includes a glass fiber layer which is embedded and not exposed. The adhesion between plastic film and the second circuit layer is greatly improved because the glass fiber layer of the plastic film filling up the space among the bumps is not deformed and exposed outwards. Therefore, the yield and reliability of the stacked multilayer structure is increased. | 10-02-2014 |
20140291853 | PACKAGE STRUCTURE OF A CHIP AND A SUBSTRATE - A package structure includes a thin chip substrate, a stabilizing material layer, a chip and a filling material. A first circuit metal layer of the substrate is inlaid into a dielectric layer and a co-plane is defined by the first circuit metal layer and the dielectric layer and is exposed from the dielectric layer. The bonding pads of the substrate are on the co-plane, have a height higher than the co-plane and connected to the first circuit metal layer. The stabilizing material layer is provided on two sides of the co-plane to define a receiving space for accommodating the chip. The filling material is injected into the receiving space to fasten the pins of the chip securely with bonding pads. Since no plastic molding is required, a total thickness of the package structure and the cost is reduced. The stabilizing material layer prevents the substrate from warping and distortion. | 10-02-2014 |
20140295623 | METHOD OF PACKAGING A CHIP AND A SUBSTRATE - Disclosed is a method of packaging a chip and a substrate, including the steps of forming a substrate with a thickness ranging from 70 to 150 μm, which comprises a dielectric layer, a circuit metal layer stacked on the dielectric layer and bonding pads higher than the dielectric layer by 10 to 15 μm; forming a stabilizing structure around the substrate to provide a receiving space; disposing the chip on the receiving space and bonding the pins of the chip with the bonding pads; and filling up the receiving space under the chip with a filling material to a total thickness ranging from 300 to 850 μm. Without the plastic molding process, the present invention reduces the cost and the total thickness, and further prevents the substrate from warping by use of the stabilizing fixing structure. | 10-02-2014 |