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Lu, Kaohsiung
Chen-Yuan Lu, Kaohsiung TW
| Patent application number | Description | Published |
|---|---|---|
| 20110193274 | RESIDENT MEASUREMENT SYSTEM FOR CHARGE LEVEL OF BLAST FURNACE - A resident measurement system for a charge level of a blast furnace includes a chamber, a servo system, a distance measurement unit, and a cooling-cleaning unit. The chamber is combined with a lateral furnace wall of the blast-furnace, covers an opening of the furnace wall, and has a pivoting hole. A pivot of the distance measurement unit is pivotally disposed at the pivoting hole, and the distance measurement unit is driven by the servo system to perform a motion with the pivot as a movement center, so as to measure the charge level. The cooling-cleaning unit is used to supply a high-pressure gas, which flows through the distance measurement unit to perform cooling and cleansing operations. The measurement system is small in dimension, and capable of scanning the charge level in an environment with high temperature, high concentration of dust, and high corrosion in the blast furnace furnace, establishing charge level information into a two-dimensional charge level mode, and obtaining a charge level profile distribution situation in real time, thereby promptly modifying a burden distribution mode. | 08-11-2011 |
Chien-Yen Lu, Kaohsiung TW
| Patent application number | Description | Published |
|---|---|---|
| 20100027219 | FAN FRAME ASSEMBLY FOR A HEAT SINK - A fan frame assembly for a heat sink includes the fan frame, the fasteners and the heat sink. The fan frame has the plate-shaped holding members extending downward along the circumferential side thereof with a horizontal engaging end part respectively. The engaging end part has a piercing hole for being passed through by the respective fasteners. Due to the fasteners being surrounded with a spring, the spring exerts a pressing force to the fan frame in addition to the holding members locating the heat sink for the fan frame assembly being joined to the heat sink firmly. | 02-04-2010 |
Chih-Ming Lu, Kaohsiung TW
| Patent application number | Description | Published |
|---|---|---|
| 20090298846 | Indolo[3,2-c]quinoline Compounds - Indolo[3,2-c]quinoline compounds of formula (I) shown below. Each variable in this formula is defined herein. These compounds can be used to inhibit both growth of cancer cells and activity of telomerase. | 12-03-2009 |
Francisco Lu, Kaohsiung TW
| Patent application number | Description | Published |
|---|---|---|
| 20090159394 | COIN-OPERATED LOCKING DEVICE - A coin-operated locking device includes a locking unit, a retaining unit, a driving unit, a coin-actuated unit, a user input unit, and an actuating unit. The locking unit is movable between locking and unlocking positions. The retaining unit is movable between a retaining position, where the retaining unit prevents movement of the locking unit between the locking and unlocking positions, and a non-retaining position, where the retaining unit permits movement of the locking unit between the locking and unlocking positions. The driving unit drives movement of the retaining unit between the retaining and non-retaining positions when actuated. The actuating unit actuates the driving unit upon receipt of the coin-deposited signal from the coin-actuated unit and a user input signal from the user input unit. | 06-25-2009 |
Hsin-Chieh Lu, Kaohsiung TW
| Patent application number | Description | Published |
|---|---|---|
| 20090184405 | Package structure - A package structure is provided. The package structure includes a substrate, a semiconductor device, and a shielding cap. The substrate has at least an alignment recess located at a corner of the substrate. The semiconductor device is disposed on an upper surface of the substrate. The shielding cap having an alignment pin covers the semiconductor device. The alignment pin is inserted into the alignment recess. | 07-23-2009 |
| 20090190025 | Image-capturing module and manufacturing method thereof - An image-capturing module and a manufacturing method thereof are provided. The image-capturing module includes a circuit board, an electric element, a lens set and a carrier. The circuit board has at least a locking hole. The electric element is disposed on the circuit board. The carrier is disposed on the circuit board for carrying the lens set. The carrier has at least a hook locking at the locking hole of the circuit board. | 07-30-2009 |
| 20090194227 | TOOL AND METHOD FOR PACKAGING LENS MODULE - A tool and a method for packaging lens module are provided. The method for packaging lens module includes the following steps. Firstly, a carrier having at least one cavity is provided. Next, a holder is disposed in the cavity. Then, a die is disposed on a surface of a substrate. After that, the substrate is inversely placed on the carrier, wherein the surface where the die is disposed faces the carrier, and the die corresponds to the holder. Then, a cover plate covers the carrier and the substrate, such that the substrate is fixed on the holder. | 08-06-2009 |
Jian-An Lu, Kaohsiung TW
| Patent application number | Description | Published |
|---|---|---|
| 20090152568 | Method for packaging submount adhering light emitting diode and package structure thereof - A method for packaging submount adhering LED comprises providing a first substrate which has an upper surface, a lower surface forming a plurality of heat-dissipating cavities and a plurality of die-attaching regions defined on the upper surface. Each of the heat-dissipating cavities corresponds to the die-attaching region and has a bottom surface, wherein there is a carrier base located between the bottom surface and the die-attaching region. Next, a heat conductor is formed in the heat-dissipating cavity and a plurality of LEDs are disposed on the die-attaching regions of the first substrate. Then, a second substrate is provided which has a first surface facing to the upper surface of the first substrate, a second surface opposite to the first surface and a plurality of reflective slots communicating with the first and second surfaces. Each of the reflective slots corresponds to the LED and the die-attaching region and couples the first and second substrates thereby allowing each of the LEDs to be located in the reflective slot. | 06-18-2009 |
Ke-Wen Lu, Kaohsiung TW
| Patent application number | Description | Published |
|---|---|---|
| 20090294792 | CARD TYPE MEMORY PACKAGE - A card-type memory package is revealed, primarily comprising a substrate, a plurality of gold fingers, at least a memory chip, an LED chip, and an encapsulant. The memory chip and the LED chip are disposed on an encapsulated surface of the substrate with the LED chip adjacent to a rear side of the substrate. The gold fingers are attached to the substrate adjacent to a front side of the substrate. The encapsulant is formed on the encapsulated surface to encapsulate the memory chip and the LED chip with the gold fingers exposed. Therefore, the card-type memory package has the LED indication of reading and writing information with simplified assembling processes. | 12-03-2009 |
Shu-Wan Lu, Kaohsiung TW
| Patent application number | Description | Published |
|---|---|---|
| 20100297455 | PRECURSOR SOLUTION FOR POLYIMIDE/SILICA COMPOSITE MATERIAL, ITS MANUFACTURE METHOD, AND POLYIMIDE/SILICA COMPOSITE MATERIAL HAVING LOW VOLUME SHRINKAGE - The present invention relates to a process for preparing a precursor solution for polyimide/silica composite material and a process for forming a polyimide/silica composite material film on a substrate, comprising adding a monomer of a silane compound to allow a poly(amic acid) to carry a silica moiety; adding a monomer of formula (R | 11-25-2010 |
Tao-Cheng Lu, Kaohsiung TW
| Patent application number | Description | Published |
|---|---|---|
| 20110204447 | ESD TOLERANT I/O PAD CIRCUIT INCLUDING A SURROUNDING WELL - An electrostatic discharge tolerant device includes a semiconductor body having a first conductivity type, and a pad. A surrounding well having a second conductivity type is laid out in a ring to surround an area for an electrostatic discharge circuit in the semiconductor body. The surrounding well is relatively deep, and in addition to defining the area for the electrostatic discharge circuit, provides the first terminal of a diode formed with the semiconductor body. Within the area surrounded by the surrounding well, a diode coupled to the pad and a transistor coupled to the voltage reference are connected in series and form a parasitic device in the semiconductor body. | 08-25-2011 |
Wen-Feng Lu, Kaohsiung TW
| Patent application number | Description | Published |
|---|---|---|
| 20100300860 | ARMATURE WINDING SWITCH MODULE AND SWITCHING DEVICE THEREOF - An armature winding switch module has a first connection set, a second connection set and a third connection set. The first, the second and the third connection set are respectively connected between a neutral point and a corresponding phase line point and have terminals and contacts. Each two terminals of each connection set are respectively connected to two ends of a corresponding armature winding of a power supply device. The contacts of each connection set are connected among the corresponding terminals. Selectively turning on/off the contacts can connect the armature windings of each connection set in series or in parallel and thereby output required voltage without redoing wiring work. Therefore the present invention avoids second time complicated wiring work and possible connection faults. | 12-02-2010 |
Yen-Chao Lu, Kaohsiung TW
| Patent application number | Description | Published |
|---|---|---|
| 20100104679 | AUTOMATIC GATHERING PRE-SHAPE MACHINE - An automatic gathering pre-shape machine has a main body and a gathering device. The main body can make plastic films formed into a circular shape with an annular flange formed around a top edge of the film. The gathering device allows a pre-shaped plastic film be blown toward an outer end of the barrel to hit a block wall and drop and mount around a tip portion of corresponding shelf to be gathered. Consequently, the plastic film may easily and automatically be gathered from the main body. Therefore, the plastic films can be kept from being damaged and the pre-shaping process is accelerated. | 04-29-2010 |
Yi-Hung Lu, Kaohsiung TW
| Patent application number | Description | Published |
|---|---|---|
| 20100087195 | Adaptive Handover Apparatus And Method In A Heterogeneous Network Environment - Disclosed relates to an adaptive handover method in a heterogeneous network environment. Once a wireless device starts up, the invention collects estimation information for a channel environment and integrates with the wireless device's geographic information to decide two groups of recursive parameters and a channel theoretical signal model. The model and the first group of recursive parameters are used to execute recursive iteration for a signal strength decay theoretical value. The obtained actual signal strength decay value from channel estimation, second group of recursive parameters and the signal strength decay estimation value at previous iteration are used to execute channel-tracking recursive iteration for obtaining a signal strength decay tracking value. The current network status and the signal strength decay tracking value are used to predict and analyze system performance of heterogeneous networks. Based on the analyzed result, prediction time is also regulated. A decision is made based on each heterogeneous network's analyzed result, and an adaptive handover procedure is prepared by following the decision. | 04-08-2010 |
Yu-Yuan Lu, Kaohsiung TW
| Patent application number | Description | Published |
|---|---|---|
| 20090261672 | BEARING POSITIONING STRUCTURE FOR MOTOR - A bearing positioning structure for a motor includes an axial tube and a positioning member. The positioning member includes a pressing portion and a coupling portion. The coupling portion of the positioning member is engaged with a coupling section of the axial tube for securely mounting the positioning member to the axial tube, with the pressing portion of the positioning member pressing against a bearing to position the bearing in the axial tube. In another example, the coupling portion of the positioning member engages with a coupling section on a stator. | 10-22-2009 |
| 20090261674 | RETAINING STRUCTURE FOR MOTOR ELEMENTS - A retaining structure for motor elements includes an axial tube and a cap. The cap includes a stop and a coupling portion. At lease one motor element is received in the axial tube. The coupling portion of the cap is engaged with a coupling section of the axial tube for securely mounting the cap to the axial tube, with the stop of the cap covering an end of the axial tube to prevent the motor element from disengaging from the axial tube. In another example, the coupling portion of the cap engages with a coupling section on a stator. | 10-22-2009 |