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Lu, Chu-Nan

Chien-Ting Lu, Chu-Nan TW

Patent application numberDescriptionPublished
20100271823HEAT DISSIPATION DEVICE AND ILLUMINATION DEVICE USING SAME - An exemplary heat dissipation device includes an elongated main body, a number of heat sinks, and a number of airflow channels. The main body has a central axis, and includes a first portion and a second portion. The second portion has an end distant from the first portion which is configured for supporting at least one item selected from the group consisting of a solid-state light source and a circuit board having a solid-state light source mounted thereon. The heat sinks are arranged around the first portion in sequence along the central axis of the main body, and spaced from one another. Each heat sink includes a number of fins extending out from the first portion radially. The airflow channel is defined between each two neighboring heat sinks.10-28-2010

Shiao-Wen Lu, Chu-Nan TW

Patent application numberDescriptionPublished
20090080205LED LAMP HAVING HEAT DISSIPATION STRUCTURE - An LED lamp for lighting purpose includes a lamp base, a heat sink, a plurality of LED modules and a blower. The lamp base encloses an inner space and defines a plurality of vents therein. The vents communicate the inner space with a surrounding atmosphere. The heat sink comprises a cylinder at a centre thereof. The cylinder has a through hole therein, which communicates with the inner space and vents of the lamp base and cooperates therewith to form an air passage. The LED modules are attached to a periphery of the heat sink. The blower generates an airflow circulating through the air passage to thereby dissipate heat generated by the LED modules.03-26-2009

Wen-Lung Lu, Chu-Nan TW

Patent application numberDescriptionPublished
20110290547ELECTRODE STRUCTURE OF MULTIPLE DIELECTRIC ISLAND LAYER AND MANUFACTURING METHOD THEREOF - An electrode structure of multiple dielectric island layer and manufacturing method thereof are described. The electrode structure includes a substrate, an electrode bridge structure, a dielectric layer and a conducting pattern. The dielectric layer is formed on the substrate and the electrode bridge structure and has a plurality of dielectric island patterns. The dielectric island patterns cover a portion of the electrode bridge structure for forming a plurality of bridge patterns of the electrode bridge structure wherein the dielectric island patterns are alternately arranged with the bridge patterns. The conducting pattern has a first electrode, a second electrode, a third electrode and a fourth electrode. The first electrode is electrically connected to the second electrode. The third and fourth electrodes cover the bridge patterns of the electrode bridge structure for reducing the contact resistance between the third and fourth electrodes by the electrode bridge structure.12-01-2011

Ying-Chieh Lu, Chu-Nan TW

Patent application numberDescriptionPublished
20090080205LED LAMP HAVING HEAT DISSIPATION STRUCTURE - An LED lamp for lighting purpose includes a lamp base, a heat sink, a plurality of LED modules and a blower. The lamp base encloses an inner space and defines a plurality of vents therein. The vents communicate the inner space with a surrounding atmosphere. The heat sink comprises a cylinder at a centre thereof. The cylinder has a through hole therein, which communicates with the inner space and vents of the lamp base and cooperates therewith to form an air passage. The LED modules are attached to a periphery of the heat sink. The blower generates an airflow circulating through the air passage to thereby dissipate heat generated by the LED modules.03-26-2009
20100014287ILLUMINATING DEVICE WITH HEAT DISSIPATING ELEMENT - An exemplary illuminating device includes a circuit board, a plurality of light sources, a thermal interface material, and a plurality of stretched resilient elements. The circuit board has a first surface and a second surface at an opposite side of the circuit board to the first surface. The plurality of light sources is electrically mounted on the first surface of the circuit board. The heat dissipating device is attached on the second surface of the circuit board. The thermal interface material is applied between the second surface of the circuit board and the heat dissipating device. The plurality of resilient elements are configured for connecting the circuit board with the heat dissipating device and providing a pulling force therebetween.01-21-2010
20100117113LIGHT EMITTING DIODE AND LIGHT SOURCE MODULE HAVING SAME - An exemplary light emitting diode includes a substrate, a metal material and a light emitting diode chip. The substrate has a first surface and a first through hole defined in the first surface. The first through hole is filled with the metal material. The light emitting diode chip is mounted on the first surface contacting the metal material in the first through hole.05-13-2010
20100151122METHOD FOR FORMING PHOSPHOR COATING - An exemplary method for forming phosphor coating includes: providing a substrate; forming a first hydrophilic film on the substrate, the first film being soluble in water; forming a second lipophilic film on the first film, the second film comprised of a phosphor material; submerging the substrate having the first film and the second film formed thereon into water, so that the first film is dissolved in water and the second film is floated on surface of the water; and dipping a light source into the second film to forming a phosphor coating on the light source.06-17-2010
20100163097SOLAR CELL MODULE WITH CONCAVITY SURFACE - An exemplary solar cell module includes a main body, a number of solar cells, and a reflective layer. The main body defines a concavity surface defined thereon. The solar cells are positioned at the concavity surface and generally symmetrically arranged with respect to a central axis of the concavity surface, configured for converting sunlight to electricity. The reflective layer is positioned on the concavity surface, with the solar cells exposed to an exterior of the main body corresponding to the concavity surface.07-01-2010
20100290223LIGHT SOURCE HOLDER AND BULB USING SAME - A light source holder includes a spherical surface and a number of recessed portions. The recessed portions are defined in the spherical surface and arranged substantially evenly over the spherical surface. Each of the recessed portions comprises a plurality of inner surfaces. The inner surface of each recessed portion comprises a bottom surface and a lateral reflective surface. The bottom surface is capable of having a solid-state light source arranged thereon. The lateral reflective surface is adjacent to the bottom surface and configured for reflecting light emitted from the solid-state light source and outputting the light from the recessed portion.11-18-2010
20100327750LED ILLUMINATING APPARATUS - An LED illuminating apparatus includes a lampshade, a cover engaged with the lampshade, a heat dissipation module received in a hollow tube cooperatively formed by the engaged lampshade and cover, a light source engaged on the heat dissipation module, and two connectors secured at opposite ends of the lampshade and the cover. The lampshade defines a plurality of vents therein. The light source faces the cover and light emitted from the light source radiates out of the LED illuminating apparatus through the cover.12-30-2010
20110291542LED BULB - An LED bulb includes a connector for electrically connecting with a power supply, a heat sink disposed on the connector, and a plurality of LEDs mounted the heat sink. The heat sink includes a base, a tube extending downwardly from a first face of the base, and a plurality of fins extending outwardly from an outer circumference of the tube. The LEDs are attached on a second face of the base. The base defines a plurality of through tunnels extending through the base from the first face to the second face of the base.12-01-2011

Patent applications by Ying-Chieh Lu, Chu-Nan TW