Patent application number | Description | Published |
20100059870 | CHIP PACKAGE STRUCTURE - A chip package structure including a substrate, at least one chip, a plurality of leads, a heat dissipation device, a molding compound, and at least one insulating sheet is provided. The chip is disposed on the substrate. The leads are electrically connected to the substrate. The molding compound having a top surface encapsulates the chip, the substrate, and a portion of the leads. The heat dissipation device is disposed on the top surface of the molding compound. The insulating sheet disposed between the heat dissipation device and at least one of the leads has a bending line dividing the insulating sheet into a main body disposed on the molding compound and a bending portion extending from the main body. | 03-11-2010 |
20100117216 | CHIP PACKAGE STRUCTURE - A chip package structure including a substrate, at least one chip, a heat dissipation device, at least one first conductive bar, a molding compound, and at least one second conductive bar is provided. The chip and the heat dissipation device are respectively disposed on a first and a second surface of the substrate. The first conductive bar has two opposite end surfaces, wherein one end surface is disposed on the first surface of the substrate, the other end surface is extended away from the substrate, and a fastening slot is disposed between the two end surfaces and passes through the other end surface. The molding compound encapsulates the substrate, the chip, part of the heat dissipation device, and the first conductive bar. The second conductive bar is disposed on one surface of the molding compound and has a protrusion portion fastened to the fastening slot of the first conductive bar. | 05-13-2010 |
20120236519 | ELECTRONIC PACKAGE STRUCTURE - The present invention discloses an electronic package structure. The body has a top surface with a cavity thereon, the first conductive element is disposed in the cavity, and the second conductive element is disposed in the body. The first external electrode electrically connected to the first conductive element and the second external electrode electrically connected to the second conductive element are both disposed on the top surface of the body or a first surface formed by the top surface of the encapsulation compound and the exposed portions of the top surface of the body which are not covered by the encapsulation compound. | 09-20-2012 |
20120262074 | DRIVING CIRCUIT OF LIGHT EMITTING DIODES HAVING AT LEAST ONE BYPASS CIRCUIT, AND DRIVING METHOD THEREOF - A driving circuit of light emitting diodes includes a power supply circuit, at least one bypass circuit, and a temperature control circuit. The power supply circuit is used for providing a driving voltage to at least one series of light emitting diodes. Each bypass circuit of the at least one bypass circuit is used for being turned on when an ambient temperature is lower than a predetermined temperature. The temperature control circuit is coupled to the at least one bypass circuit for detecting the ambient temperature, and sending a control signal to the at least one bypass circuit when the ambient temperature is lower than the predetermined temperature. Therefore, the driving voltage can still drive the at least one series of light emitting diodes when the ambient temperature is lower than the predetermined temperature. | 10-18-2012 |
20120268896 | METAL CORE PRINTED CIRCUIT BOARD AND ELECTRONIC PACKAGE STRUCTURE - An electronic package structure is provided which comprises a metal core PCB, an energy storage device and at least one electronic component. The at least one electronic component is disposed between the metal core PCB and the energy storage device. The metal core PCB defines at least a through hole. A thermal passage is disposed in the through hole. An insulating layer is disposed in the through hole and located between the metal layer of the metal core PCB and the thermal passage to prevent the electric coupling between the thermal passage and the metal layer. The energy storage device comprises at least a connecting pin in thermal contact with the thermal passage. | 10-25-2012 |
20120319258 | STACK FRAME FOR ELECTRICAL CONNECTIONS AND THE METHOD TO FABRICATE THEREOF - A method of forming a conductive pattern on a metallic frame for manufacturing a stack frame for electrical connections is disclosed. In one embodiment, a recess is formed in the metallic frame and a conductive element is bonded in the recess to make a stack frame for electrical connections. In another embodiment, the process can be performed on both top surface and bottom surface of metallic frame to make another stack frame for electrical connections. In yet another embodiment, a package structure and a manufacturing method of forming a conductive pattern on a lead frame for electrical connections are disclosed. | 12-20-2012 |
20130093069 | PACKAGE STRUCTURE AND THE METHOD TO FABRICATE THEREOF - The invention discloses a package structure made of the combination of a metallic substrate and a lead frame. In one embodiment, a recess is formed in the metallic substrate and a first conductive element having at least one first I/O terminal is bonded in the recess. A lead frame is formed on the metallic substrate and comprises a plurality of electrical connections to connect with said at least one first I/O terminal of the first conductive element. In another embodiment, another conductive element is disposed in the vacancy of the lead frame. The invention also discloses a method for manufacturing a package structure made of the combination of a metallic substrate and a lead frame. | 04-18-2013 |
20130213704 | PACKAGE STRUCTURE AND THE METHOD TO FABRICATE THEREOF - The invention discloses a package structure made of the combination of a device carrier and a modifiable substrate. In one embodiment, a recess is formed in the device carrier and a conductive element is disposed on the substrate, wherein the substrate is disposed on the device carrier and the conductive element is located in the recess of the device carrier. The conductive pattern in the substrate is electrically connected to the device carrier and I/O terminals of the first conductive element. The invention also discloses a method for manufacturing a package structure made of the combination of a device carrier and a modifiable substrate. In one embodiment, a portion of the conductive pattern in the substrate can be modified. | 08-22-2013 |
20140042610 | PACKAGE STRUCTURE AND THE METHOD TO FABRICATE THEREOF - The invention discloses a package structure with at least one portion of a first conductive element disposed in a through-opening of a first substrate. A conductive structure is disposed on the first substrate and the first conductive element, wherein the conductive structure is electrically connected to the first substrate and said at least one first I/O terminal of the first conductive element. The conductive structure comprises at least one of a second conductive element, a second substrate or a conductive pattern. | 02-13-2014 |
20150029678 | SUBSTRATELESS DEVICE AND THE METHOD TO FABRICATE THEREOF - A substrateless device comprises a plurality of first conductive elements and an encapsulant. The encapsulant encapsulates the plurality of first conductive elements, wherein the locations of the plurality of first conductive elements are fixed by the encapsulant; and a plurality of terminals of the plurality of first conductive elements are exposed outside the encapsulant, wherein the plurality of first conductive elements are not supported by a substrate. | 01-29-2015 |
Patent application number | Description | Published |
20100033507 | Driving Method and Driving Apparatus for Displaying Apparatus - A driving method for driving a display apparatus is provided. The driving method includes: configuring a plurality of driving voltages corresponding to a plurality of gray scales, where the gray scales include a first gray scale and a second gray scale smaller than the first gray scale, and a first driving voltage corresponding to the first gray scale is lower than a second driving voltage corresponding to the second gray scale; and controlling the display apparatus to display a gray scale merely up to the second gray scale. In this way, the driving method hence reduces the response time of the display apparatus, which may be an LCD display panel. | 02-11-2010 |
20100045579 | METHOD FOR ADJUSTING WHITE BALANCE IN A FIELD SEQUENTIAL DISPLAY AND DEVICE THEREOF - A method for adjusting white balance includes generating a first matrix according to values in axes of a color gamut corresponding to optical characteristics of a plurality of first LEDs; generating a second matrix according to values in the axes of the color gamut corresponding to optical characteristics of the plurality of first LEDs while in white balance; generating a third matrix according to values in the axes of the color gamut corresponding to optical characteristics of a plurality of second LEDs; storing the first matrix, second matrix, and third matrix; generating a calibration matrix by multiplying the second matrix with an inverse of the first matrix; generating a fourth matrix by multiplying the third matrix with the calibration matrix. As a result, the optical characteristics of the plurality of second LEDs can be effectively and rapidly adjusted simply referring to the differences between the second and fourth matrices. | 02-25-2010 |
20100238093 | Method for Driving Electrophoretic Display Device - An EPD device includes a plurality of pixels, wherein a first pixel is written by a first grey level, a second pixel is written by a second grey level. When the EPD device refreshes the displayed frame, the first pixel and the second pixel are erased individually. After the erasing of first pixel is completed, a third grey level is written to the first pixel immediately. After erasing of the second pixel is completed, a fourth grey level is written to the second pixel immediately. Thus, each pixel is written by their next grey levels immediately after the erasing step so the writing time is reduced and the motion blur of the EPD device when refreshing the displayed frame can be improved. | 09-23-2010 |
20100277509 | METHOD OF UPDATING THE DISPLAY OF ELECTROPHORETIC DISPLAY MECHANISM AND THE DEVICE THEREOF - A method for driving an electrophoretic display device for reducing the time required to update the display image. The electrophoretic display device comprises a frame buffer, a lookup table, a controller and an electrophoretic display panel. The frame buffer stores a first display frame data. The controller accesses a transition data of transforming the first display frame data to a second display frame data according to the lookup table, for outputting a control data. The electrophoretic display panel displays the second display frame data according to the control data. Therefore, the position the charged particle in a pixel to be moved to during the erasing step can be adjusted by utilizing the lookup table, consequently reducing the time required to update the pixel. | 11-04-2010 |