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Low, MY
Andrew Wye Choong Low, Menglembu Perak MY
| Patent application number | Description | Published |
|---|---|---|
| 20080237857 | Semiconductor package - There is disclosed a method of making an electronic package ( | 10-02-2008 |
Andy Ly Low, Melaka MY
| Patent application number | Description | Published |
|---|---|---|
| 20100130206 | HANDOVER TECHNIQUE FOR WIRELESS COMMUNICATIONS ENABLED DEVICES - A method of triggering a network handover controlled by a communications device in a communications system comprising a plurality of networks with which the communications device can perform a handover operation to, the method comprising the steps of: determining a signal characteristic of each available candidate network in said communications system; forecasting a future value of said signal characteristic; determining a future handover margin for said signal characteristic of the network connection established by said communications device; determining if another available candidate network signal characteristic exceeds said handover margin at a future time, and if so, performing a handover operation to said other available candidate network, wherein said future handover margin for said signal characteristic is varied dynamically in dependence on said forecasted signal characteristic. | 05-27-2010 |
Bin Seng Low, Penang MY
| Patent application number | Description | Published |
|---|---|---|
| 20100221370 | POLAR ORGANIC EXTRACT OF EURYCOMA LONGIFOLIA - The present invention provides a composition including a polar organic extract of | 09-02-2010 |
Boon Yew Low, Petaling Jaya MY
| Patent application number | Description | Published |
|---|---|---|
| 20100117202 | MOLD AND SUBSTRATE FOR USE WITH MOLD | 05-13-2010 |
| 20110115125 | METHOD AND APPARATUS FOR MOLDING SUBSTRATE - A method for encapsulating a substrate includes placing a hardened encapsulant material in a container. The encapsulant material is then heated and stirred until it is in a liquid or gel state. The liquid encapsulant material is held in the container in a vacuum state and dispensed over semiconductor dies along a guide, which allows the liquid encapsulant material to cool slightly before it covers a die. | 05-19-2011 |
| 20110121468 | SEMICONDUCTOR PACKAGE AND METHOD OF MAKING SAME - An improved semiconductor package includes thermal tape placed over a top side of a die that is attached to a substrate with an underfill material. The tape extends to the substrate. The tape deforms with heat and entraps the die and underfill material. Air bubbles are trapped between the tape and the die and underfill material. The tape can be weighted and lined with an adhesive material. The tape aids in preventing the die from cracking due to mishandling. | 05-26-2011 |
| 20110244637 | MOLD AND SUBSTRATE FOR USE WITH MOLD | 10-06-2011 |
Boon Yew Low, Petalling Jaya MY
| Patent application number | Description | Published |
|---|---|---|
| 20120032167 | SEMICONDUCTOR PACKAGE AND METHOD OF TESTING SAME - A packaged integrated circuit includes a substrate having a wire layout pattern and a solder mask layer. An integrated circuit attached to a surface of the substrate is electrically connected to the wire layout pattern. An encapsulation material covers at least the integrated circuit and the solder mask layer. One or more crack seal rings are disposed on the solder mask surface. The crack seal rings are copper traces with terminals that allow current to be applied to the traces. A broken trace (open circuit condition) is indicative of a crack in the package. Thus, electrical testing is performed to detect physical defects. | 02-09-2012 |
Chii Yih Low, Bayan Lepas MY
| Patent application number | Description | Published |
|---|---|---|
| 20080306200 | Antistatic gloves and process for making same - The present invention is directed to antistatic elastomeric articles and methods of making the same. The articles can be single layered or multilayered. The single layered articles possess desirable antistatic properties and desirable properties of comfort and feel. The multilayered articles have an outermost layer/surface that possesses desirable antistatic properties and an innermost layer/surface that exhibits desirable properties of comfort and feel. In preferred embodiments, the elastomeric articles are made form a nitrile/natural rubber blend. Articles of the present invention have antistatic properties measured as having a surface resistivity below about 10 | 12-11-2008 |
| 20120021155 | VULCANIZATION COMPOSITION HAVING REDUCED ALLERGENIC POTENTIAL, AND ELASTOMERIC ARTICLES FORMED THEREWITH - The present invention generally relates to vulcanization compositions used to vulcanize elastomeric articles, where the vulcanization compositions have reduced allergenic potential as compared to elastomeric articles formed using vulcanization compositions having non-fugitive accelerators. The present invention also relates to elastomeric articles formed using the vulcanization compositions. The invention further relates to methods for making a reduced-allergenicity vulcanization composition, and to methods for using the vulcanization compositions to vulcanize elastomeric articles. | 01-26-2012 |
Chun How Low, Tanjong Bunghah MY
| Patent application number | Description | Published |
|---|---|---|
| 20110233878 | Hand-held power tool - In a hand-held power tool having a tool holder equipped with a multisided internal socket for connecting to a first insert bit and with a multisided external socket for connecting to a second insert bit, the tool holder being associated with a locking device for locking the first insert bit in the multisided internal socket, the locking device has an actuating element that it is possible to slide from a locking position into an unlocking position in an axial direction oriented away from the first insert tool in order to unlock the first insert tool. | 09-29-2011 |
Chun Hui Low, Johor MY
| Patent application number | Description | Published |
|---|---|---|
| 20090250818 | VIA ELECTROMIGRATION IMPROVEMENT BY CHANGING THE VIA BOTTOM GEOMETRIC PROFILE - An integration approach to improve electromigration resistance in a semiconductor device is described. A via hole is formed in a stack that includes an upper dielectric layer, a middle TiN ARC, and a lower first metal layer and is filled with a conformal diffusion barrier layer and a second metal layer. A key feature is that the etch process can be selected to vary the shape and location of the via bottom. A round or partially rounded bottom is formed in the first metal layer to reduce mechanical stress near the diffusion barrier layer. On the other hand, a flat bottom which stops on or in the TiN ARC is selected when exposure of the first metal layer to subsequent processing steps is a primary concern. Electromigration resistance is found to be lower than for a via structure with a flat bottom formed in a first metal layer. | 10-08-2009 |
Han Sin Low, Sungei Buloh MY
| Patent application number | Description | Published |
|---|---|---|
| 20110308632 | Closing and Sealing Means for Air Admittance Valves in Sanitary Waste Water Pipe Systems - The closing and sealing device for use in air admittance valves includes a valve housing ( | 12-22-2011 |
| 20120025123 | High Capacity Air Admittance Valve for Sanitary Waste Pipe System - The valve is designed to be connected to a sanitary waste pipe system for admitting atomospheric air into the waste pipe towards the valve function elements in response to a pressure reduction in the system in order to protect the water traps in the system and to prevent discharge of contaminated air from the system to the atmosphere. It includes an oblong bowl-shaped valve housing ( | 02-02-2012 |
Jeffrey Khai Huat Low, Melaka MY
| Patent application number | Description | Published |
|---|---|---|
| 20080290484 | Leadframe Strip and Mold Apparatus for an Electronic Component and Method of Encapsulating an Electronic Component - A leadframe strip comprises a plurality of units arranged in a line. Each unit provides two component positions, each having a chip support substrate. The chip support substrates of the two component positions are mechanically linked by at least one support bar. The two component positions of a unit are molded at essentially the same time to produce a plastic housing for a package in each component position. The central portion of the first support bars remains outside of the plastic housing of the two packages. | 11-27-2008 |
Kin Onn Low, Petaling Jaya MY
| Patent application number | Description | Published |
|---|---|---|
| 20120100034 | PROCESS FOR PRODUCING SPONGE IRON - The present invention relates to a process for producing sponge iron with in-situ carbon removal. The process for producing the sponge iron includes the steps of preparing a sandwich of at least two layers wherein the at least two layers includes a first layer ( | 04-26-2012 |
Leslie Eng Ti Low, Kajang MY
| Patent application number | Description | Published |
|---|---|---|
| 20100218274 | CONSTITUTIVE PROMOTER FROM OIL PALM - The present disclosure relates generally to gene promoters including promoters from oil palm plants, and to plants (including plants having genetic modifications) that include such promoters. The gene promoters of the present disclosure may be useful in facilitating expression of beneficial and/or desired phenotypic characteristics in plants and plant products. | 08-26-2010 |
| 20110173719 | CONSTITUTIVE PROMOTER FROM OIL PALM TYPE 2 - The present invention relates generally to a gene promoter from an oil palm plant and to a genetically modified plant comprising same. The gene promoter of the present invention is useful in facilitating expression of beneficial and/or desired phenotypic characteristics in plants and in particular oil palm plant products from such plants also form part of the present invention. | 07-14-2011 |
Poh Haut Low, Bukit Mertajam MY
| Patent application number | Description | Published |
|---|---|---|
| 20110045323 | CURRENT LIMITING APPARATUS AND METHOD - A battery pack ( | 02-24-2011 |
Poh Huat Low, Penang MY
| Patent application number | Description | Published |
|---|---|---|
| 20080297104 | BATTERY CHARGER AND METHOD FOR COMMUNICATING BATTERY PACK CHARGING STATUS INFORMATION - A battery charger ( | 12-04-2008 |
Tek Beng Low, Melaka MY
| Patent application number | Description | Published |
|---|---|---|
| 20100187703 | SURFACE MOUNT OPTOELECTRONIC COMPONENT WITH LENS HAVING PROTRUDING STRUCTURE - The invention relates to a surface mount optoelectronic component with a lens attachment, the method for precising the lens position and the method to manufacture the whole component. | 07-29-2010 |
| 20110156296 | Surface Mount Optoelectronic Component with Lens Having Protruding Structure - The invention relates to a surface mount optoelectronic component with a lens attachment, the method for precising the lens position and the method to manufacture the whole component. | 06-30-2011 |
| 20120025217 | LED LIGHTING MODULE - The invention relates to a light emitting diode (LED) module that is characterized by a thermally conductive substrate which is used as the base of the module; a plurality of cavities positioned on the module; each cavity is filled with a transparent or diffused encapsulant material and a plurality of LED semiconductors chips are mounted within each cavity. | 02-02-2012 |
| 20120025223 | LED LIGHTING DEVICE WITH HIGH COLOUR RE-PRODUCIBILITY - The invention relates to a light emitting diode (LED) lighting device that is comprised of a plurality of LED components and is characterized by the mixture of; a first group of light source provided by blue LEDs mixed with luminescence conversion element and the blue light has a dominant wavelength in the range from 430 nm to 460 nm and the luminescence conversion element absorbs a portion of this blue light and converts to a secondary light have a peak wavelength in the range of 520 nm to 545 nm; a second group of light source provided by LEDs with dominant wavelength in the range of 600 nm to 610 nm and a third group of light source provided by LEDs with dominant wavelength in the range of 615 nm to 625 nm to produce mixture of light that has good color re-producibility. | 02-02-2012 |
| 20120026731 | LED LIGHTING DEVICE WITH UNIFORM COLOR MIXING - The invention relates to a light emitting diode (LED) lighting device that is comprised of a plurality of LED components and is characterized by the mixture of a primary light provided by the first and majority group of components and a secondary light provided by a second minority group of components and the components emitting the secondary light source have a viewing angle in the range of 130° to 160° and is greater than that of the primary light source. This wide angle of emission ensures that the secondary light is uniformly mixed into the primary light. | 02-02-2012 |
Weng Onn Low, Negeri Sembilan MY
| Patent application number | Description | Published |
|---|---|---|
| 20110298115 | SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURE - A semiconductor component and a method for manufacturing the semiconductor component, wherein the semiconductor component is configured to permit the determination of circuit parameters. A high side FET has a gate terminal coupled to an output terminal of a high side gate drive circuit, a drain terminal coupled for receiving an input voltage, and a source terminal coupled to the drain terminal of a low side FET. The gate terminal of the low side FET is coupled to the output terminal of low side drive circuit and the source terminal of the low side FET is coupled for receiving a source of operating potential. The high side gate drive circuit has a bias terminal coupled for receiving a floating potential where the bias terminal is electrically isolated or decoupled from the commonly connected source and drain terminals of the high side FET and the low side FET, respectively. | 12-08-2011 |
Yoke Thye Low, Kuala Lampur MY
| Patent application number | Description | Published |
|---|---|---|
| 20110254185 | MOULD SEGMENTS WITH INDEXING MEANS AND METHOD OF ALIGNING MOULD SEGMENTS - This invention relates generally to a mould segment used in the production of premoulded and precured tyre thread in a flat moulding process wherein the mould segment ( | 10-20-2011 |