Patent application number | Description | Published |
20110239219 | PROTECTING SHARED RESOURCES USING SHARED MEMORY AND SOCKETS - Shared memory and sockets are used to protect shared resources in an environment where multiple operating systems execute concurrently on the same hardware. Rather than using spinlocks for serializing access to the shared resources, when a thread is unable to acquire a shared resource because that resource is already held by another thread, the thread that was unable to acquire the resource creates a socket with which it will wait to be notified that the shared resource has been released. The sockets may be network sockets or in-memory sockets that are accessible across the multiple operating systems; if sockets are not available in a particular implementation, communication technology that provides analogous services between operating systems may be used instead. In an optional aspect, fault tolerance is provided to address socket failures, in which case one or more threads may fall back (at least temporarily) to using spinlocks. As another option, a locking service may execute on each operating system to provide a programming interface through which threads can invoke operations for holding and releasing the lock. | 09-29-2011 |
20110264841 | SHARING OF CLASS DATA AMONG VIRTUAL MACHINE APPLICATIONS RUNNING ON GUESTS IN VIRTUALIZED ENVIRONMENT USING MEMORY MANAGEMENT FACILITY - A method, system and computer program product for sharing class data among virtual machine applications running on one or more guests in a virtualized environment. A control program in a virtual operating system is used to manage the user portions of the virtual operating system, each commonly referred to as a guest. A guest operating system runs on each guest and applications can run on each guest operating system. A memory management facility manages shared memory which includes a class cache configured to store class data. The shared memory may be mounted onto each guest using a cluster file system or accessed via an API interface thereby allowing the class cache to be shared across the guests. By sharing the class cache among the guests, multiple copies of the same class data are no longer necessary thereby optimally using the physical memory on the host. | 10-27-2011 |
20120117553 | PROGRAMMATIC DISPATCH TO FUNCTIONS WITH MATCHING LINKAGE - An enhanced function-descriptor-based dispatch in a multi-linkage environment receives user code containing a function compiled in a supplementary linkage convention of a caller to form an invoked function and determines whether the supplementary linkage convention of the caller for the invoked function matches a supplementary linkage implementation provided by a library. Responsive to a determination that the supplementary linkage convention of the caller for the invoked function matches a supplementary linkage implementation provided by the library, an embodiment selects the supplementary linkage implementation provided by the library and dispatches the invoked function in the selected supplementary linkage implementation provided by the library. | 05-10-2012 |
20120166498 | GARBAGE COLLECTION IN A MULTIPLE VIRTUAL MACHINE ENVIRONMENT - Garbage collection processes are automatically tuned on a system comprising a plurality of virtual machines running on a physical processing device with multiple physical processors. Tuning is implemented for each garbage collection process, by updating a load variable to reflect that a new garbage collection process has started, the load variable having a value that is based at least in part on a number of garbage collection processes that are currently running on the system. Tuning further comprises creating a number of garbage collection threads based at least in part on the current value of the load variable and/or number of processors, where the garbage collection threads are used to perform at least a portion of at least one phase of the new garbage collection process. Tuning further comprises re-updating the load variable to reflect completion of the new garbage collection process. | 06-28-2012 |
20120167067 | BATCH DISPATCH OF JAVA NATIVE INTERFACE CALLS - A batching mechanism is provided that batches multiple Java Native Interface calls together such that the batch crosses the Java Native Interface boundary in a single transition. The batching mechanism operates by identifying a sequence of Java Native Interface calls to be made by native code, by encapsulating the identified sequence of Java Native Interface calls into a batch, and by communicating the batch as a single transition across the Java Native Interface boundary. In this manner, each call of the batch is encapsulated by iteratively performing for each call to be made, processes including identifying the Java Native Interface function to call, identifying the arguments to pass into the Java Native Interface function, dispatching to the Java Native Interface function and capturing the return value. | 06-28-2012 |
20120272239 | SHARING CLASS DATA - This docucment descirbes techniques for sharing Java class information in virtualized computing environments. In some embodimetns, an apparatus includes hardware components including one or more central processing units and main memory, wherein a portion of the main memory is configured to store shared Java classes. The apparatus can also include a hypervisor configured to control access to the hardware components, and to host a plurality of operating systems. Each of the operating systems can include a character device driver configured to write directly to the portion of main memory configured to store the shared Java classes. The apparatus can also include one or more Java virtual machines configured to execute the shared Java classes and modify the shared Java classes using the character device driver. | 10-25-2012 |
20130047152 | Preserving, From Resource Management Adjustment, Portions Of An Overcommitted Resource Managed By A Hypervisor - Methods, apparatuses, and computer program products for preserving, from resource management adjustment, portions of an overcommitted resource managed by a hypervisor are provided. Embodiments include identifying, by the hypervisor, a privileged guest from among a plurality of guests of the hypervisor; identifying, by the hypervisor, portions of the overcommitted resource that are allocated to the privileged guest; and preventing, by the hypervisor, resource management adjustment to the identified portions of the overcommitted resource that are allocated to the privileged guest. | 02-21-2013 |
20130047159 | Preserving, From Resource Management Adjustment, Portions Of An Overcommitted Resource Managed By A Hypervisor - Methods, apparatuses, and computer program products for preserving, from resource management adjustment, portions of an overcommitted resource managed by a hypervisor are provided. Embodiments include identifying, by the hypervisor, a privileged guest from among a plurality of guests of the hypervisor; identifying, by the hypervisor, portions of the overcommitted resource that are allocated to the privileged guest; and preventing, by the hypervisor, resource management adjustment to the identified portions of the overcommitted resource that are allocated to the privileged guest. | 02-21-2013 |
20130275965 | CONTROL OF JAVA RESOURCE RUNTIME USAGE - A method for providing control of Java resource runtime usage may include establishing communication with one or more Java virtual machines (JVMs) forming a hive via a hive communication channel where the hive comprises a plurality of JVMs configured to enable utilization of at least one shared resource, receiving, via the hive communication channel, environmental information indicative of hive activity relative to the at least one shared resource from at least one of the one or more JVMs, and adapting, via processing circuitry, operations associated with use of the at least one shared resource based on the environmental information. | 10-17-2013 |
20140150108 | PREVENTION OF ACCIDENTAL PASSWORD DISCLOSURE IN APPLICATION WINDOWS - Text entry context information associated with text entry within an inter-user communication application is evaluated. A determination is made as to whether the evaluated text entry context information identifies a text string entered by a user as a potential password inadvertently entered into the inter-user communication application by the user. In response to determining that the text string is identified as the potential password, the user is prompted to confirm that the user intends to send the text string using the inter-user communication application. The text string is transmitted using the inter-user communication application in response to a confirmation from the user to send the text string. | 05-29-2014 |
20140298487 | MULTI-USER UNIVERSAL SERIAL BUS (USB) KEY WITH CUSTOMIZABLE FILE SHARING PERMISSIONS - A method, data storage device and computer program product for having multiple users share a single data storage device securely. A data storage device, such as a Universal Serial Bus (USB) key, is plugged into a computing device. A USB controller of the USB key recognizes the computing device and creates an account for the user. The created account is associated with the user as well as associated with the computing device. Data uploaded to the USB key by the user is then associated with the created account. Only that user will be able to view that data on his/her computing device (computing device associated with the created account) unless the user indicates to share that data with other users. Such a process may be repeated each time the USB key is plugged into a different computing device thereby creating multiple accounts associated with multiple computing devices and users. | 10-02-2014 |
20140298489 | MULTI-USER UNIVERSAL SERIAL BUS (USB) KEY WITH CUSTOMIZABLE FILE SHARING PERMISSIONS - A method, data storage device and computer program product for having multiple users share a single data storage device securely. A data storage device, such as a Universal Serial Bus (USB) key, is plugged into a computing device. A USB controller of the USB key recognizes the computing device and creates an account for the user. The created account is associated with the user as well as associated with the computing device. Data uploaded to the USB key by the user is then associated with the created account. Only that user will be able to view that data on his/her computing device (computing device associated with the created account) unless the user indicates to share that data with other users. Such a process may be repeated each time the USB key is plugged into a different computing device thereby creating multiple accounts associated with multiple computing devices and users. | 10-02-2014 |
20150052326 | USER-CONTROLLED PAGING - A request is received to load a first page into main memory with the main memory containing a plurality of page frames. It is determined that none of the plurality of page frames is an empty page frame. User input is referenced to determine a target memory resource consumer. A second page is selected which is loaded in a first page frame. The second page is associated with the target memory resource consumer. The second page is moved from the main memory to a secondary storage device. The first page is loaded into the first page frame. | 02-19-2015 |
20150052328 | USER-CONTROLLED PAGING - A request is received to load a first page into main memory with the main memory containing a plurality of page frames. It is determined that none of the plurality of page frames is an empty page frame. User input is referenced to determine a target memory resource consumer. A second page is selected which is loaded in a first page frame. The second page is associated with the target memory resource consumer. The second page is moved from the main memory to a secondary storage device. The first page is loaded into the first page frame. | 02-19-2015 |
Patent application number | Description | Published |
20120017204 | STRING CACHE FILE FOR OPTIMIZING MEMORY USAGE IN A JAVA VIRTUAL MACHINE - A method, system and computer program product for optimizing memory usage associated with duplicate string objects in a Java virtual machine. The method comprises scanning a heap of the Java virtual machine at the end of the start-up process of the virtual machine to identify duplicate strings associated with the virtual machine, storing the identified strings in a string cache file, and determining whether a new string that needs to be created during start-up already exists in the string cache file. The duplicate strings are added to an interned strings table. A reference to a duplicate string is returned if a string to be created is already in the string cache file. | 01-19-2012 |
20130275976 | CONTROL OF JAVA RESOURCE RUNTIME USAGE - A method for providing control of Java resource runtime usage may include establishing communication with one or more Java virtual machines (JVMs) forming a hive via a hive communication channel where the hive comprises a plurality of JVMs configured to enable utilization of at least one shared resource, receiving, via the hive communication channel, environmental information indicative of hive activity relative to the at least one shared resource from at least one of the one or more JVMs, and adapting, via processing circuitry, operations associated with use of the at least one shared resource based on the environmental information. | 10-17-2013 |
20140115585 | STRING CACHE FILE FOR OPTIMIZING MEMORY USAGE IN A JAVA VIRTUAL MACHINE - A method, system and computer program product for optimizing memory usage associated with duplicate string objects in a Java virtual machine. The method comprises scanning a heap of the Java virtual machine at the end of the start-up process of the virtual machine to identify duplicate strings associated with the virtual machine, storing the identified strings in a string cache file, and determining whether a new string that needs to be created during start-up already exists in the string cache file. The duplicate strings are added to an interned strings table. A reference to a duplicate string is returned if a string to be created is already in the string cache file. | 04-24-2014 |
Patent application number | Description | Published |
20090032940 | Conductor Bump Method and Apparatus - Various semiconductor die conductor structures and methods of fabricating the same are provided. In one aspect, a method of manufacturing is provided that includes forming a conductor structure on a conductor pad of a semiconductor die. The conductor layer has a surface. A polymeric layer is formed on the surface of the conductor layer while a portion of the surface is left exposed. A solder structure is formed on the exposed portion of the surface and a portion of the polymeric layer. | 02-05-2009 |
20100102457 | Hybrid Semiconductor Chip Package - Various apparatus and method of packaging semiconductor chips are disclosed. In one aspect, a method of manufacturing is provided that includes placing a semiconductor chip package into a mold. The semiconductor chip package includes a substrate that has a side and a first semiconductor chip coupled to the side in spaced apart relation to define a space between the first semiconductor chip and the side. A second semiconductor chip is mounted on the first semiconductor chip. At least one conductor wire is electrically coupled to the second semiconductor chip and the substrate. A molding material is introduced into the mold to flow into the space and establish an underfill and encapsulate the first semiconductor chip and the second semiconductor chip. | 04-29-2010 |
20100155938 | FACE-TO-FACE (F2F) HYBRID STRUCTURE FOR AN INTEGRATED CIRCUIT - An integrated circuit (IC) product includes a redistribution layer (RDL) having at least one conductive layer configured to distribute electrical information from one location to another location in the IC. The RDL also includes a plurality of wire bond pads and a plurality of solder pads. The plurality of solder pads each includes a solder wettable material that is in direct electrical communication with the RDL. | 06-24-2010 |
20110024898 | METHOD OF MANUFACTURING SUBSTRATES HAVING ASYMMETRIC BUILDUP LAYERS - A method of manufacturing a substrate for use in electronic packaging having a core, m buildup layers on a first surface of the core and n buildup layers on a second surface of the core, where m≠n is disclosed. The method includes forming (m−n) of the m buildup layers on the first surface, and then forming n pairs of buildup layers, with each one of the pairs including one of the n buildup layers formed on the second surface and one of the remaining n of the m buildup layers formed on the first surface. Each buildup layer includes a dielectric layer and a conductive layer formed thereon. The disclosed method protects the dielectric layer in each of buildup layers from becoming overdesmeared during substrate manufacturing by avoiding repeated desmearing of dielectric materials. | 02-03-2011 |
20110057307 | Semiconductor Chip with Stair Arrangement Bump Structures - Various semiconductor chip input/output structures and methods of making the same are disclosed. In one aspect, a method of manufacturing is provided that includes forming a first conductor structure on a first side of a semiconductor chip and forming a second conductor structure in electrical contact with the first conductor structure. The second conductor structure is adapted to be coupled to a solder structure and includes a stair arrangement that has at least two treads. | 03-10-2011 |
20110133338 | CONDUCTOR BUMP METHOD AND APPARATUS - Various semiconductor die conductor structures and methods of fabricating the same are provided. In one aspect, a method of manufacturing is provided that includes forming a conductor structure on a conductor pad of a semiconductor die. The conductor layer has a surface. A polymeric layer is formed on the surface of the conductor layer while a portion of the surface is left exposed. A solder structure is formed on the exposed portion of the surface and a portion of the polymeric layer. | 06-09-2011 |
20110147061 | Circuit Board with Via Trace Connection and Method of Making the Same - Various circuit boards and methods of manufacturing the same are disclosed. In one aspect, a method of manufacturing is provided that includes forming a first interconnect layer of a circuit board. The first interconnect layer includes a first conductor trace with a first segment that does not include a via land. A first via is formed on the first segment. | 06-23-2011 |
20110225813 | METHOD OF MANUFACTURING SUBSTRATES HAVING ASYMMETRIC BUILDUP LAYERS - A method of manufacturing a substrate for use in electronic packaging having a core, m buildup layers on a first surface of the core and n buildup layers on a second surface of the core, where m≠n is disclosed. The method includes forming (m−n) of the m buildup layers on the first surface, and then forming n pairs of buildup layers, with each one of the pairs including one of the n buildup layers formed on the second surface and one of the remaining n of the m buildup layers formed on the first surface. Each buildup layer includes a dielectric layer and a conductive layer formed thereon. The disclosed method protects the dielectric layer in each of buildup layers from becoming overdesmeared during substrate manufacturing by avoiding repeated desmearing of dielectric materials. | 09-22-2011 |
20120120615 | CIRCUIT BOARD WITH VIA TRACE CONNECTION AND METHOD OF MAKING THE SAME - Various circuit boards and methods of manufacturing the same are disclosed. In one aspect, a method of manufacturing is provided that includes forming a first interconnect layer of a circuit board. The first interconnect layer includes a first conductor trace with a first segment that does not include a via land. A first via is formed on the first segment. | 05-17-2012 |
20130062786 | SOLDER MASK WITH ANCHOR STRUCTURES - Various substrates or circuit boards for receiving a semiconductor chip and methods of processing the same are disclosed. In one aspect, a method of manufacturing is provided that includes forming a first opening in a solder mask positioned on a side of a substrate. The first opening does not extend to the side. A second opening is formed in the solder mask that extends to the side. The first opening may serve as an underfill anchor site. | 03-14-2013 |
20130113084 | SEMICONDUCTOR SUBSTRATE WITH MOLDED SUPPORT LAYER - Various semiconductor substrates and methods of processing the same are disclosed. In one aspect, a method of manufacturing is provided that includes mounting a first semiconductor chip on a side of a first substrate. The first substrate has at least one thru-silicon-via. An insulating layer is molded on the side of the first substrate. The insulating layer provides a support structure to enable handling of the first substrate. | 05-09-2013 |
20130147012 | CIRCUIT BOARD COMPONENT SHIM STRUCTURE - Various circuit boards and methods of fabricating the same are disclosed. In one aspect, a method of manufacturing is provided that includes coupling an electrically non-functional component to a surface of a first circuit board. The electrically non-functional component has a first elevation. The surface of the circuit board is adapted to have a semiconductor chip mounted thereon. An electrically functional component is mounted to the surface inward from the electrically non-functional component. The electrically functional component has a second elevation less than the first elevation. | 06-13-2013 |
20130147026 | HEATSINK INTERPOSER - According an embodiment, a package-on-package heatsink interposer for use between a top package and a bottom package of a package-on-package device, may include a top heatsink below the top package; an interposer substrate below the top heatsink; a bottom heatsink below the interposer substrate; a first interposer substrate metal layer between the interposer substrate and the top heatsink; a second interposer substrate metal layer between the interposer substrate and the bottom heatsink; and interposer solder balls between the second interposer substrate metal layer and the bottom package. | 06-13-2013 |
20130258610 | SEMICONDUCTOR CHIP DEVICE WITH VENTED LID - Various circuit board lids and methods and using the same are disclosed. In one aspect, an apparatus is provided that includes a lid adapted to cover a semiconductor chip mounted on a circuit board. The lid has a top plate, a first support leg and a second support leg opposite the first support leg adapted to support the lid. The first and second support legs and the top plate define a recess to accommodate the semiconductor chip. The recess has a first opening and a second opening. At least one of the first and second openings extends from the first support leg to the second support leg. | 10-03-2013 |