Lopez, AZ
Chris Lopez, Phoenix, AZ US
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20090321901 | THERMALLY BALANCED HEAT SINKS - According to example embodiments, a device configured to dissipate heat from a first chip and a second chip on a multi-chip package includes a primary heat sink configured to contact an upper surface of the first chip, a secondary heat sink configured to contact an upper surface of the second chip, the secondary heat sink disposed within the primary heat sink and movable in relation to the primary heat sink, and a thermally conductive substance disposed in contact with the primary heat sink and the secondary heat sink. | 12-31-2009 |
Christopher Lopez, Phoenix, AZ US
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20150241478 | PACKAGE ON PACKAGE THERMAL FORCING DEVICE - Methods and apparatus for a package on package (POP) thermal forcing device. A thermal interposer includes a test probe guide and insulator top, a thermal conductor, the test probe guide and insulator top affixed to a top surface of the thermal conductor, a test probe, and a test probe guide and insulator bottom affixed to a bottom surface of the thermal conductor, the test probe guide and insulator bottom configured in a ring-like shape to enable the thermal conductor to pass through and make contact with a bottom of a package on package (PoP) integrated circuit (IC). | 08-27-2015 |
Christopher A. Lopez, Phoenix, AZ US
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20080238466 | TEMPERATURE SENSING AND PREDICTION IN IC SOCKETS - An apparatus is provided which preferably combines temperature sensing and prediction for more accurate temperature control of integrated circuits. An IC temperature sensing and prediction device includes a current sensing device that measures current passing through an IC, and a temperature control apparatus that measures a surface temperature of the IC. The device further includes an electronic controller that calculates the power consumed by the IC according to the measured current and adjusts the temperature of a heater or cooler responsive to the measured surface temperature and power consumption. | 10-02-2008 |
20140260333 | DIRECT INJECTION PHASE CHANGE TEMPERATURE CONTROL SYSEM - A thermal control unit (TCU) for controlling temperature of a device under test (DUT) includes a sealed evaporation chamber disposed therein, the evaporation chamber configured with a refrigerant inlet and a refrigerant outlet; and at least one surface for thermal engagement of the device under test and configured to conduct heat to the evaporation chamber. A test system and a computer program product are disclosed. | 09-18-2014 |
C.j. Lopez, Phoenix, AZ US
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20150209206 | SEAT CUSHION HAVING ADJUSTABLE PRESSURE ZONES - A seat cushion having adjustable pressure zones comprises a cushion body having a plurality of pressure control zones, each zone including one or more interconnected inflatable air bladders, each zone of the cushion body is connected to a control component that sends and receives signals to adjust the pressures within maximum and minimum pressure settings. | 07-30-2015 |
Crystal Lopez, Goodyear, AZ US
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20130296415 | Manufacturing and Packaging Room Temperature Stable Dronabinol Capsules - The invention provides a method of manufacturing and packaging a room temperature stable cannabinoid dosage in an oil-based carrier, wherein the method employs the use of blister packaging and an inert gas atmosphere during blister packaging. The invention also provides a room temperature stable cannabinoid dosage prepared by the methods of the invention. | 11-07-2013 |
Dan Lopez, Phoenix, AZ US
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20100039436 | METHOD FOR INTERMIXING GRAPHICS APPLICATIONS USING DISPLAY INTERMIX SERVER FOR COCKPIT DISPLAYS - Methods and apparatus are provided for intermixing graphics layers and graphics applications using a display intermix server. A method is provided for intermixing a first graphics application having a first graphics layer and a second graphics application having a second graphics layer. The method comprises streaming a first graphics command from the first graphics application to a first memory location, where the first graphics command corresponds to the first graphics layer. The method also comprises streaming a second graphics command from the second graphics application to a second memory location, where the second graphics command corresponds to the second graphics layer. The method further comprises ordering the first graphics command and the second graphics command based on a priority scheme for the first graphics layer and the second graphics layer. The method further comprises providing ordered graphics commands to a rendering interface. | 02-18-2010 |
David Andrew Lopez, Gilbert, AZ US
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20100064656 | ENGINES AND METHODS OF OPERATING THE SAME - Engines and methods for operating the engines are provided. The engine includes a means for limiting overspeed in flow communication with a turbine section flowpath, wherein the means for limiting overspeed is adapted to block a first portion of an airflow received along a first direction vector from flowing into an exhaust section flowpath and to redirect a second portion of the airflow received along the first direction vector or a portion of the blocked first portion of the airflow to flow along another direction vector that is closer to parallel with a longitudinal axis than the first direction vector. | 03-18-2010 |
Juan Carlos Lopez, Yuma, AZ US
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20100270803 | POWER SUPPLY SYSTEM - An irrigation power system is provided for use with a conventional irrigation conduit having water flow therethrough as a source of hydro energy. In order to convert the hydro energy of the water flow to electrical energy, a power generation module is provided along the irrigation conduit. The electrical energy provided by the power generation module is then provided to a power conditioner to alter the electrical energy to produce a predetermined current. The predetermined current is then sent to a storage device for later use. An irrigation system component then communicates with the storage device to receive electrical power for selective operation of the component. | 10-28-2010 |
Marina V. Lopez, Tucson, AZ US
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20140304224 | REPLICATING A SOURCE STORAGE SYSTEM - For replicating a source storage system, a scan module generates a source storage server description for each source storage server of the source storage system from a scan of the source storage system. The source storage server description includes a replication type and a source volume record for each source logical volume of the source storage server. A provision module determines a number of replicated instances of each source logical volume for a target storage system from the replication type. In addition the provision module generates a target storage server description for each target storage server of the target storage system from each source storage server description in response to the target storage system satisfying a target storage requirement. | 10-09-2014 |
Martin E. Lopez, Bisbee, AZ US
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20110287643 | BONDING NIPPLE - In one embodiment, a bonding nipple for use in building electrical systems has a tubular-shaped body attached to a tubular-shaped head. The body and head share a common axis, and the outer diameter of the head is larger than the outer diameter of the body. The exterior of the body is threaded to form a male connector. The exterior of the head has a hole situated thereon to receive a grounding screw. In one exemplary installation, the body of the bonding nipple is fed through a punch-out of a service panel into one end of a female-threaded coupler, and the coupler is situated over a male-threaded conduit. The coupler is tightened over the conduit and the nipple until the wall of the panel is sandwiched between the coupler and the bonding nipple head. A wire is then connected between the grounding screw and a grounding bus bar in the panel. | 11-24-2011 |
Maximiliano A. Lopez, Phoenix, AZ US
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20110048986 | Methods, Apparatus, and Assemblies Associated with Spring Loaded Leg Cap Hinges - The examples provided describe a golf bag with a legged stand, and a golf bag collar assembly, each having a spring loaded leg cap hinge constructed to provide improved strength, reduced weight, strong holding force when the legs are closed, and a reduced retraction force when the legs are opened. | 03-03-2011 |
Noel Lopez, Chandler, AZ US
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20120229219 | MULTI-LEVEL POWER AMPLIFICATION SYSTEM - In general, in accordance with an exemplary aspect of the present invention, an electrical system configured to use power combining of microwave signals, such as those from monolithic microwave integrated circuits or MMICs is provided. In one exemplary embodiment, the system of the present invention further comprises a low loss interface that the circuits are directly connected to. In another exemplary embodiment, the circuits are connected to a pin which is connected to the low loss interface. In yet another exemplary embodiment of the present invention, a multi-layer power amplifier is provided that comprises two or more chassis and circuits attached to impedance matching interfaces according to the present invention. This multi-layered power amplifier is configured to amplify an energy signal and have a significantly reduced volume compared to existing power combiners. | 09-13-2012 |
Noel Lopez, Phoenix, AZ US
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20090066420 | SOLID STATE POWER AMPLIFIER WITH MULTI-PLANAR MMIC MODULES - A solid state power amplifier (SSPA) system may include a radio frequency (RF) input, an RF waveguide split block, multiple monolithic microwave integrated circuit (MMIC) power amplifier modules, and/or a heat spreader. An MMIC power amplifier module may include a backing, a board, at least one MMIC, and/or a cover. A method for dissipating heat within an SSPA may include receiving an RF signal, splitting the RF signal, amplifying multiple RF signals, combining the multiple RF signals, generating heat, and/or dissipating heat. | 03-12-2009 |
20090066441 | LOW-LOSS INTERFACE - In general, in accordance with an exemplary aspect of the present invention, a low-loss interface for connecting an integrated circuit such as a monolithic microwave integrated circuit to an energy transmission device such as a waveguide is disclosed. In one exemplary embodiment, the interface comprises a pin attached to a matching network that matches the impedance of the energy produced at the circuit to the impedance required by the waveguide without the use of a dielectric material. | 03-12-2009 |
20090212871 | MULTI-PLANAR SOLID STATE AMPLIFIER - A solid state power amplifier (SSPA) system may include a radio frequency (RF) input, an RF waveguide split block, multiple monolithic microwave integrated circuit (MMIC) power amplifier modules, and/or a heat spreader. The power amplifier modules and RF waveguide may be distributed about the heat spreader in different planes. Furthermore, the power amplifier modules may be located on opposite sides of the heat spreader and nonplanar to the waveguide split block. A method for dissipating heat within an SSPA may include receiving an RF signal in a first plane, amplifying the RF signal in another plane, and combining the RF signal in yet another plane. | 08-27-2009 |
20090219107 | ADJUSTABLE LOW-LOSS INTERFACE - In general, in accordance with an exemplary aspect of the present invention, a low-loss interface for connecting an integrated circuit such as a monolithic microwave integrated circuit to an energy transmission device such as a waveguide is disclosed. The interface comprises an isolation wall placed between an input and output region of an integrated circuit to reduce ripple and isolate the waveguide cavity from the monolithic microwave integrated circuit circuitry. The interface further comprises a turning screw or other similar member that is configured to closely match the impedance of integrated circuit | 09-03-2009 |
20090231055 | MULTI-LEVEL POWER AMPLIFICATION SYSTEM - In general, in accordance with an exemplary aspect of the present invention, an electrical system configured to use power combining of microwave signals, such as those from monolithic microwave integrated circuits or MMICs is provided. In one exemplary embodiment, the system of the present invention further comprises a low loss interface that the circuits are directly connected to. In another exemplary embodiment, the circuits are connected to a pin which is connected to the low loss interface. In yet another exemplary embodiment of the present invention, a multi-layer power amplifier is provided that comprises two or more chassis and circuits attached to impedance matching interfaces according to the present invention. This multi-layered power amplifier is configured to amplify an energy signal and have a significantly reduced volume compared to existing power combiners. | 09-17-2009 |
20090278762 | Antenna Modular Sub-array Super Component - In accordance with various aspects of the present invention, a method and system for an antenna modular sub-array super component is presented. The modular sub-array super component allows for multiple antenna product designs to utilize a common low cost aperture element assembly block, quantities of which may be scaled up or down to suit the physical, performance, and power requirements of a specific antenna system. More specifically, a method and system for connecting various components of an antenna modular sub-array using a bar with leads connector is discussed. The bar with leads may connect antenna subcomponents or subassemblies. | 11-12-2009 |
20100052994 | INCLINED ANTENNA SYSTEMS AND METHODS - In accordance with various aspects of the present invention, a method and system for designing an inclined antenna array with a hybrid mechanical-electronic steering system with improved radiation performances at low elevation angles is presented. In an exemplary embodiment, a radiating element structure is attached to a mounting surface and includes a patch antenna and a ground plane. The bottom edge of the patch antenna is farther from the mounting surface than the top edge of the patch antenna. If the radiating element structure is used in an inclined array antenna, then the patch antenna has an uncovered view of a low elevation angle. Furthermore, at least a portion of a patch antenna may be uncovered and have a clear view. A clear view of the low elevation angle results in increased directivity and increased polarization quality due to reduced signal scattering. | 03-04-2010 |
Noel A. Lopez, Phoenix, AZ US
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20090206473 | System and Method for Integrated Waveguide Packaging - A millimeter wave system or package may include at least one printed wiring board (PWB), at least one integrated waveguide interface, and at least one monolithic microwave integrated circuit (MMIC). The package may be assembled in panel form incorporating parallel manufacturing techniques. | 08-20-2009 |
Noel A. Lopez, Chandler, AZ US
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20120139099 | SYSTEM AND METHOD FOR INTEGRATED WAVEGUIDE PACKAGING - A millimeter wave integrated waveguide interface package device may comprise: (1) a package comprising a printed wiring board (PWB) and a monolithic microwave integrate circuit (MMIC), wherein the MMIC is in communication with the PWB; and (2) a waveguide interface integrated with the package. The package may be adapted to operate at high frequency and high power, where high frequency includes frequencies greater than about 5 GHz, and high power includes power greater than about 0.5 W. | 06-07-2012 |
20140152397 | MULTI-LEVEL POWER AMPLIFICATION SYSTEM - In general, in accordance with an exemplary aspect of the present invention, an electrical system configured to use power combining of microwave signals, such as those from monolithic microwave integrated circuits or MMICs is provided. In one exemplary embodiment, the system of the present invention further comprises a low loss interface that the circuits are directly connected to. In another exemplary embodiment, the circuits are connected to a pin which is connected to the low loss interface. In yet another exemplary embodiment of the present invention, a multi-layer power amplifier is provided that comprises two or more chassis and circuits attached to impedance matching interfaces according to the present invention. This multi-layered power amplifier is configured to amplify an energy signal and have a significantly reduced volume compared to existing power combiners. | 06-05-2014 |
20140183710 | LEADFRAME PACKAGE WITH INTEGRATED PARTIAL WAVEGUIDE INTERFACE - A MMIC package is disclosed comprising: a leadframe based overmolded package, a die positioned within the overmolded package; and a partial waveguide interface, wherein the partial waveguide interface is integral with the overmolded package facilitating low cost and reliable assembly. Also disclosed is an overmolded package where the die sits on a metal portion exposed on the bottom of the package and the package is configured for attachment to a chassis of a transceiver such that heat from the die is easily dissipated to the chassis with a direct thermal path. The disclosure facilitates parallel assembly of MMIC packages and use of pick and place/surface mounting technology for attaching the MMIC packages to the chassis of transceivers. This facilitates reliable and low cost transceivers. | 07-03-2014 |
Robert Lopez, Scottsdale, AZ US
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20110165973 | HOCKEY NET CARRIER APPARATUS - A sports net carrier apparatus that includes a carrier having a vertical frame supported by at least two wheels, and a hook member connected to the vertical frame at a substantially top section of the vertical frame. The hook member rotatably engages with a horizontal top portion of a sports goal to connect the vertical frame of the carrier to permit a movement of the sports goal by moving the carrier via the at least two wheels. The hook member includes a curved portion for engaging the top portion of the sports goal. The hook member can be locked to the vertical frame of the carrier by a cross bar connected to the vertical frame at the substantially top section of the vertical frame. | 07-07-2011 |
Seema Lopez, Gilbert, AZ US
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20100067973 | CASE IDENTIFICATION SYSTEM - A case system comprises a case and one or more identification plugs. The case comprises two or more surfaces, and at least one surface of the two or more surfaces comprises a plurality of holes disposed thereabout. The plurality of holes sized and shaped to accept and maintain in position one or more identification plugs. The one or more identification plugs comprise a post portion sized and shaped to selectively mate with at least one of the plurality of holes. | 03-18-2010 |
Thomas V. Lopez, Phoenix, AZ US
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20140101870 | Swimming Pool Cleaner Appendages - A pool cleaner for cleaning a pool surface includes a chassis, arms mounted to the chassis for oscillatory movement in response to water being drawn through the pool cleaner and rotating a drive assembly operatively coupled to the arms, a wing mounted to each of the arms for flapping movement in response to the oscillatory movement of the arms, and projections carried on an underside of the wings for disturbing material from the pool surface to be cleaned by the pool cleaner. | 04-17-2014 |
20150136678 | Quick Release Pool Skimmer Basket Apparatus - A quick release pool skimmer basket apparatus includes a basket having a sidewall, a filter element coupled to the sidewall to move between an open position and a closed position, and a handle extending upwardly from the basket. A trigger in the handle is operatively coupled to the filter element to hold the filter element in the closed position. Activation of the trigger releases the bottom from the closed position to the open position. | 05-21-2015 |