Loke
Alvin L. Loke, Fort Collins, CO US
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20130162310 | CLOCK GENERATOR WITH INTEGRATED PHASE OFFSET PROGRAMMABILITY - A device may include first, second, and third buffer stages. The device may further include a selector circuit to selectively output one of an output of the second buffer stage or an output of the third buffer stage. The device may include an output to provide a first clock signal, where the first clock signal is an output of the first buffer stage, and the device further include an output to provide a second clock signal, where the second clock signal is an output of the selector circuit. | 06-27-2013 |
20130162357 | OSCILLATOR WITH HIGHLY-ADJUSTABLE BANG-BANG CONTROL - A device may include an oscillator to generate a clock signal based on first and second control signals. The oscillator may include a first buffer stage a second buffer stage. The first buffer stage may output a first signal that is based on an output of the second buffer stage and the first control signal. The second buffer stage may output the clock signal. The clock signal may be based on the first signal and the second control signal. | 06-27-2013 |
Alvin Leng Sun Loke, Ft. Collins, CO US
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20110304407 | AUTOMATIC AMPLITUDE CONTROL FOR VOLTAGE CONTROLLED OSCILLATOR - A circuit and method for calibrating a VCO (voltage controlled oscillator) is disclosed. In one embodiment, a circuit includes a VCO and a bias control circuit coupled to a tail node of the VCO. An amplitude control unit may also be coupled to the tail node, wherein the amplitude control unit is configured to determine the amplitude of a VCO output signal based on a voltage present on the tail node. The amplitude control unit may also be configured to generate a bias voltage based on the amplitude of the VCO output signal and a target voltage. The bias control circuit may be coupled to receive the bias voltage from the amplitude control unit and may be further configured to adjust the voltage on the tail node based on the received bias voltage. | 12-15-2011 |
Alvin Leng Sun Loke, Fort Collins, CO US
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20090108978 | Cross-coupled Inductor Pair Formed in an Integrated Circuit - Cross-coupled first and second helical inductors formed in an IC. The cross-coupled first and second helical inductors comprise a first helical conductor having a first portion and a second portion, and a second helical conductor having a first portion and a second portion. The second helical conductor is in close proximity to the first helical conductor. The first helical inductor is formed by the first portion of the first helical conductor and the second portion of the second helical conductor. The second helical inductor is formed by the second portion of the first helical conductor and the first portion of the second helical conductor. | 04-30-2009 |
20110133719 | Voltage reference circuit operable with a low voltage supply and method for implementing same - According to one embodiment, a voltage reference circuit operable with a low voltage supply comprises an op-amp powered by the low voltage supply and a feedback branch including a transistor driven by an output of the op-amp. The feedback branch couples the low voltage supply to ground through the transistor and at least a rectifying device situated between a reference node of the feedback branch and ground. An input of the op-amp is coupled to the reference node by a voltage divider. In one embodiment, the voltage reference circuit further comprises a reference branch coupling a second reference node to ground through at least a second rectifying device, and wherein a second input of the op-amp is coupled to the second reference node by a second voltage divider. | 06-09-2011 |
20120091558 | SHIELD-MODULATED TUNABLE INDUCTOR DEVICE - A semiconductor device is presented here. The semiconductor device includes an integrated inductor formed on a semiconductor substrate, a transistor arrangement formed on the semiconductor substrate to modulate loop current induced by the integrated inductor, dielectric material to insulate the integrated inductor from the transistor arrangement, and a controller coupled to the transistor arrangement. The controller is used to select conductive and nonconductive operating states of the transistor arrangement. A conductive operating state of the transistor arrangement allows formation of induced loop current in the transistor arrangement, and a nonconductive operating state of the transistor arrangement inhibits formation of induced loop current in the transistor arrangement. | 04-19-2012 |
20140049292 | INTEGRATED CIRCUIT PACKAGE HAVING MEDIUM-INDEPENDENT SIGNALING INTERFACE COUPLED TO CONNECTOR ASSEMBLY - An integrated circuit (IC) package includes electrical contacts disposed at a first surface of the IC package, an integrated circuit implementing an electrical signaling interface, and a connector assembly accessible at a second surface of the IC package. The connector assembly is to mechanically attach to another connector assembly and includes contact terminals electrically coupled to the electrical signaling interface. The connector assembly can be configured to provide friction coupling with the other connector assembly to permit the other connector assembly to be removably attached. A system includes the IC package and an external transceiver module having a connector assembly mechanically attached to the connector assembly of the IC package. The electrical signaling interface conducts signaling with the external transceiver module in accordance with one signal format and the external transceiver module conducts signaling over a transmission medium in accordance with another signal format. | 02-20-2014 |
20140159200 | HIGH-DENSITY STACKED PLANAR METAL-INSULATOR-METAL CAPACITOR STRUCTURE AND METHOD FOR MANUFACTURING SAME - An embodiment of a high-density, stacked, planar metal-insulator-metal (MIM) capacitor structure includes a stack of planar electrodes and interposing dielectric layers. Vertically-alternating electrodes are horizontally-staggered, and vias are formed through the multiple electrodes, so that electrical connection is made circumferentially through the via sidewalls to multiple electrodes through which a given via passes. An MIM capacitor incorporating a multiple-level capacitor stack may be fabricated by repeated usage of the same mask operation for each incremental capacitor stack level, and without requiring additional masks beyond those utilized for the first such level. | 06-12-2014 |
20140176098 | FEED-FORWARD COMPENSATION FOR LOW-DROPOUT VOLTAGE REGULATOR - A voltage regulator includes a pass element having a control input coupled to a control node and operable to generate an output voltage at an output node, a negative feedback amplifier operable to receive a reference voltage and the output voltage and generate a signal at the control node based on a difference between the reference voltage and the output voltage, and a noise cancellation circuit coupled to the control node and the output node and operable to generate a bias current at the control node based on the output voltage. | 06-26-2014 |
Alvin Leng Sun Loke, San Diego, CA US
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20150237709 | THERMAL METAL GROUND FOR INTEGRATED CIRCUIT RESISTORS - Metal thermal grounds are used for dissipating heat from integrated-circuit resistors. The resistors may be formed using a front end of line layer, for example, a titanium-nitride layer. A metal region (e.g., in a first metal layer) is located over the resistors to form a heat sink. An area of thermal posts connected to the metal region is also located over the resistor. The metal region can be connected to the substrate of the integrated circuit to provide a low impedance thermal path out of the integrated circuit. | 08-20-2015 |
20160025807 | SYSTEMS AND METHODS FOR WAFER-LEVEL LOOPBACK TEST - Circuits and methods for loopback testing are provided. A die incorporates a receiver (RX) to each transmitter (TX) as well as a TX to each RX. This architecture is applied to each bit so, e.g., a die that transmits or receives 32 data bits during operation would have 32 transceivers (one for each bit). Focusing on one of the transceivers, a loopback architecture includes a TX data path and an RX data path that are coupled to each other through an external contact, such as a via at the transceiver. The die further includes a transmit clock tree feeding the TX data path and a receive clock tree feeding the RX data path. The transmit clock tree feeds the receive clock tree through a conductive clock node that is exposed on a surface of the die. Some systems further include a variable delay in the clock path. | 01-28-2016 |
Aravind Loke, Irvine, CA US
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20120189040 | MULTI-MODE RECEIVER - A multi-mode receiver system for processing signals based on a plurality of systems is disclosed. Embodiments of the invention provide for a shared architecture for processing baseband signals corresponding to a plurality of systems. | 07-26-2012 |
Chee Wui Loke, Canyon Country, CA US
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20110281450 | Miniature Electrical Connectors - A miniature electrical connector comprising a floating and vertically orientable spring contact within but not physically secured to an electrically-conductive connector block of a female connector wherein the spring contact and connector block are designed such that the spring contact is vertically oriented and outwardly expanded when a male connector is inserted into the female connector to provide a conductive path between a male contact of the male connector and the connector block of the female connector. | 11-17-2011 |
Chee Wui Loke, Irvine, CA US
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20130204339 | SYSTEMS AND METHODS FOR LOADING A PRE-CURVED ELECTRODE ARRAY ONTO A STRAIGHTENING MEMBER - An exemplary system for loading a pre-curved electrode array onto a straightening member includes a loading tool and a straightening member. An exemplary loading tool may include a body and first and second flexible arms each having a fixed end connected to the body and a free end opposite the fixed end. The first and second flexible arms may define a straightening channel configured to constrain a pre-curved electrode array in a straightened configuration. The first and second flexible arms may be further configured to flex away from each other to receive the pre-curved electrode array into the straightening channel. The straightening member is configured to be inserted into the pre-curved electrode array while the pre-curved electrode array is in the straightened configuration and retain the pre-curved electrode array in the straightened configuration after the pre-curved electrode array is removed from the loading tool. Corresponding methods are also described. | 08-08-2013 |
Donald R. Loke, Danbury, CT US
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20090066177 | Micro Kinetic energy device for powering portable electronic devices - An energy conversion and storage device includes a winding bezel, having a winding bezel top plate, a bezel ring, and a central winding arbor, a winding pinion rotatingly positioned on the winding arbor, first and second barrels mounted for rotation on a barrel arbor, the barrels linked by teeth thereon so that the first barrel drives the second barrel, a ratchet wheel rotatingly connected to the winding bezel and to the barrel arbor and a drive wheel and drive pinion operably connected to the barrel arbor and an electric generator, such that turning the winding bezel turns the ratchet wheel to turn the first barrel which winds the second barrel and the drive wheel and drive pinion to rotate the electric generator. | 03-12-2009 |
Johnny C. Loke, Nanuet, NY US
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20140194315 | METHODS AND COMPOSITIONS FOR RAPID FUNCTIONAL ANALYSIS OF GENE VARIANTS - Methods and compositions are disclosed for rapid functional analysis of gene variants based on analysis of protein-protein and protein-nucleic acid interactions. | 07-10-2014 |
Jörg Loke, Brechen DE
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20120186246 | MASTER CYLINDER IN PARTICULAR FOR A CONTROLLED MOTOR VEHICLE BRAKE SYSTEM - The invention relates to a master cylinder, in particular for a controlled motor vehicle brake system, including a first and a second piston which is displaceable in a housing and has a captive spring, a first end of the spring bearing at least indirectly against the piston and a second end thereof against a sleeve which is displaceable with respect to the piston and the movement of which with respect to the piston is limited by a pin provided on the piston and by a stop washer, the stop washer being arranged on a free end of the pin. In order to avoid impact noise upon rapid release of the brake, the stop washer of the first piston has a device for the damped abutment of the sleeve. | 07-26-2012 |
Mun Leong Loke, Biekit Mertajam MY
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20150076692 | FLIP CHIP ASSEMBLY PROCESS FOR ULTRA THIN SUBSTRATE AND PACKAGE ON PACKAGE ASSEMBLY - In some embodiments, selective electroless plating for electronic substrates is presented. In this regard, a method is introduced including receiving a coreless substrate strip, attaching solder balls to a backside of the coreless substrate strip, and forming a backside stiffening mold amongst the solder balls. Other embodiments are also disclosed and claimed. | 03-19-2015 |
Mun Leong Loke, Penang MY
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20090321928 | FLIP CHIP ASSEMBLY PROCESS FOR ULTRA THIN SUBSTRATE AND PACKAGE ON PACKAGE ASSEMBLY - In some embodiments, selective electroless plating for electronic substrates is presented. In this regard, a method is introduced including receiving a coreless substrate strip, attaching solder balls to a backside of the coreless substrate strip, and forming a backside stiffening mold amongst the solder balls. Other embodiments are also disclosed and claimed. | 12-31-2009 |
Mun Leong Loke, Bukit Mertajam MY
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20090309238 | Molded flip chip package with enhanced mold-die adhesion - A molded flip chip package with enhanced adhesion between mold and die backside interface and the method of fabricating the package are described. The package is less prone to mold-die delamination. In an embodiment of the invention, the package has a die with a die frontside (die bottom side) attached to a substrate and a die backside (die top side). A first material is disposed on a portion of the die backside. A second material encapsulates the first material and the die backside. | 12-17-2009 |
20120319276 | FLIP CHIP ASSEMBLY PROCESS FOR ULTRA THIN SUBSTRATE AND PACKAGE ON PACKAGE ASSEMBLY - In some embodiments, selective electroless plating for electronic substrates is presented. In this regard, a method is introduced including receiving a coreless substrate strip, attaching solder balls to a backside of the coreless substrate strip, and forming a backside stiffening mold amongst the solder balls. Other embodiments are also disclosed and claimed. | 12-20-2012 |
Paxton Loke, Victoria AU
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20100120092 | RECOMBINANT PROTEINS AND VIRUS LIKE PARTICLES COMPRISING L AND S POLYPEPTIDES OF AVIAN HEPADNAVIRIDAE AND METHODS, NUCLEIC ACID CONSTRUCTS, VECTORS AND HOST CELLS FOR PRODUCING SAME - The specification discloses chimeric or recombinant virus-like particles comprising (i) S polypeptide of an avian hepadnavirus and (ii) a chimeric fusion protein comprising a polypeptide of interest covalently attached to a particle-associating portion of L polypeptide of an avian hepadnavirus, wherein the polypeptide of interest comprises a transmembrane domain or a protein binding domain or motif and wherein the chimeric fusion protein further comprises a second or further polypeptide of interest comprising a transmembrane domain and/or a protein binding domain or motif, wherein the second or further polypeptide is associated with the virus-like particle via non-peptide bonds. It is proposed that such VLPs more closely resemble the naturally occurring configuration of antigenic complexes or pathogens. The chimeric virus-like particles are illustrated using viral envelope proteins from measles, hepatitis C virus, influenza A and HIV and by polyproteins from | 05-13-2010 |
Praneet Loke, Westfield, IN US
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20130326209 | Automatic Alert Mode Selection - Automatic Alert Mode Selection may put a device into vibrate, silent, or ringer mode, or take the device out of such modes. It may automatically adjust volume settings, as applicable. It may perform these functions based on a location, a calendar entry, or an event. One embodiment may comprise a software application that communicates with network data or location sensors, such as GPS, to collect location information. It may also sync with a user's calendar to retrieve data for appointments and events. Automatic Alert Mode Selection may also interact with a plurality of application programming interfaces (APIs). In one embodiment, Automatic Alert Mode Selection may be programmed to collect data at a predetermined time interval, and in yet another embodiment, the software's functionalities may be overridden by the user. | 12-05-2013 |
Pui Leng Loke, Abingdon GB
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20110269742 | Serotonin 5-HT2B Receptor Inhibitors - Disclosed are Serotonin 5-HT2B receptor inhibitors of the formula I. Also disclosed are methods of making and methods of using these compounds. | 11-03-2011 |
20120214762 | 6,5-HETEROCYCLIC PROPARGYLIC ALCOHOL COMPOUNDS AND USES THEREFOR - The invention relates to novel compounds of Formula I: | 08-23-2012 |
20120214787 | OXADIAZOLE INHIBITORS OF LEUKOTRIENE PRODUCTION - The present invention relates to compounds of formula (I): | 08-23-2012 |
20120220561 | OXADIAZOLE INHIBITORS OF LEUKOTRIENE PRODUCTION - The present invention relates to compound of formula (I): | 08-30-2012 |
20120245162 | OXADIAZOLE INHIBITORS OF LEUKOTRIENE PRODUCTION - The present invention relates to compounds of formula (I): | 09-27-2012 |
20120277226 | BENZIMIDAZOLE INHIBITORS OF LEUKOTRIENE PRODUCTION - The present invention relates to compounds of formula (IA) and (IB): | 11-01-2012 |
20120295896 | OXADIAZOLE INHIBITORS OF LEUKOTRIENE PRODUCTION - The present invention relates to compounds of formula (I) and (IA): | 11-22-2012 |
20120322795 | BIARYLAMIDE INHIBITORS OF LEUKOTRIENE PRODUCTION - The present invention relates to compounds of formula (I): | 12-20-2012 |
20130196967 | HETEROCYCLIC COMPOUNDS AS INHIBITORS OF LEUKOTRIENE PRODUCTION - The present invention relates to compound of formula (I): | 08-01-2013 |
Pui Leng Loke, Oxfordshire GB
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20110301161 | BENZIMIDAZOLE INHIBITORS OF LEUKOTRIENE PRODUCTION - The present invention relates to compounds of formula (I): | 12-08-2011 |
20150038460 | 6,5-Heterocyclic Propargylic Alcohol Compounds and Uses Therefor - The invention relates to novel compounds of Formula I: | 02-05-2015 |
Robert Loke, Memphis, TN US
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20130079825 | TEMPLATE FOR MULTIPLE LENGTH SPINAL RODS - A spinal rod template has a rod and a plurality of size identifiers. The rod has a first end separated by a length from a second end. The first end may be shaped generally like a spinal rod and configured to be received within a first bone anchor assembly. The size identifiers are oriented along the length of the rod at the second end of the rod. Each of the plurality of size identifiers identifies a specific length for a spinal rod implant. The second end of the rod is configured to be received in a second bone anchor assembly such that the plurality of size identifiers specify specific length for a spinal rod implant based upon the relationship of the second bone anchor assembly to the plurality of size identifiers. | 03-28-2013 |
20140207236 | EXPANDABLE SPINAL IMPLANT SYSTEM AND METHOD - A spinal implant includes a first member having a wall that defines an axial cavity. A second member extends between a first end and a second end and defines a longitudinal axis. The second member is configured for disposal with the axial cavity and translation relative to the first member. A third member has an outer surface engageable with tissue and an inner surface disposed to dynamically engage the first end in response to the engagement of the outer surface with the tissue. Systems and methods are disclosed. | 07-24-2014 |
Robert Loke, Sunnyvale, CA US
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20120169131 | PHASE SHIFT POWER TRANSFER - In a wireless energy transfer system, an apparatus includes a coil and an adjustable alternating current power supply electrically connected to the coil. When a device is in the vicinity of the apparatus, the apparatus determines an operating parameter of the device and adjusts a power supply operating parameter based on the determined device operating parameter. The apparatus may be a transmitter wirelessly transmitting power to the device or a receiver wirelessly receiving power from the device. | 07-05-2012 |
20120169132 | RESONANCE TUNING - One heuristic for tuning a wireless power transfer device includes monitoring a circuit parameter while sweeping a power source frequency; identifying two frequencies related to local maxima of the circuit parameter values; estimating self-resonant frequency of an electromagnetically coupled device based on the two frequencies; determining a value for a tuning component of the wireless power transfer device such that the device self-resonant frequency equals the estimated coupled device self-resonant frequency; and adjusting the tuning component to the determined value. | 07-05-2012 |
20120169134 | ELECTRICALLY TUNABLE INDUCTOR - An electrically tunable inductor with an equivalent inductance includes a main winding and a tuning winding magnetically coupled to the main winding. The current through the tuning winding is controlled to adjust the equivalent inductance of the electrically tunable inductor. A device may include an electrically tunable inductor. A system may include multiple devices, one or more of the devices including an electrically tunable inductor. A tuning controller within the system may control the current in tuning windings of one or more of the multiple devices in the system. When an electrically tunable inductor is part of a resonant circuit, the resonant frequency may be controlled by adjusting the equivalent inductance of the electrically tunable inductor through controlling the current in the tuning winding. Controlling the current in the tuning winding includes one or more of controlling the peak, direction, frequency, duty cycle, or phase of the current. | 07-05-2012 |
Robert M. Loke, Memphis, TN US
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20110106162 | Composite Connecting Elements for Spinal Stabilization Systems - Elongated connecting elements include bodies having composite cross-sections defined by a center core that is surrounded by an outer portion. The center core includes a first material and the outer portion includes a second material that is distinct from the first material. In one particular form, a connecting element includes a maximum dimension across an outer cross-sectional shape of the outer portion that is less than a minimum dimension across an oblong or round outer cross-sectional shape of a polyetheretherketone (PEEK) connecting element, and the connecting element exhibits mechanical properties that are at least equivalent to the mechanical properties of the polyetheretherketone (PEEK) connecting element. In another form, the center core has a non-circular cross-sectional shape and the first material is defined by a reinforcing material randomly dispersed throughout a polymer, and the outer portion includes a circular, outer cross-sectional shape. However, other embodiments, forms and applications are also envisioned. | 05-05-2011 |
20110270321 | Engaging Member With a Cavity-Base for Engaging a Connecting Element to a Bone Anchor - Devices and methods include an anchor assembly engageable to a vertebra and a connecting element positionable through a receiver of the anchor assembly. The assembly includes an engaging member for engaging the connecting element in the receiver. The engaging member includes a base with a cavity that receives a deformed portion the connecting element when the engaging member is securely engaged to the connecting element. | 11-03-2011 |
20120203286 | Bone Fastener and Methods of Use - A bone fastener includes a shaft extending from a first end to a second end and defines a longitudinal axis. The shaft includes an inner surface that defines an axially extending cavity. The bone fastener further includes a body disposed within the cavity and in fixed engagement with the inner surface. The body includes a rigid element positioned within only a subregion of the cavity to form a stiffened zone exclusively in an adjacent portion of the shaft. Methods of use are disclosed. | 08-09-2012 |
20120277809 | TEMPLATES AND METHODS - Embodiments of the invention include templates and methods for evaluating the appropriate size and shape for a medical implant. In particular, some embodiments include expandable templates and methods for evaluating appropriate size and shape for implantation of a spinal rod. | 11-01-2012 |
20150032210 | INTERBODY IMPLANT AND METHOD - An interbody endcap includes a wall having a first surface connected to an interbody implant and a second surface including an arcuate portion configured for engagement with a vertebral endplate surface. The second surface extends outwardly from the interbody implant to at least adjacent a perimeter of the vertebral endplate surface. Systems and methods are disclosed. | 01-29-2015 |
Slew Hon Loke, Eindhoven NL
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20160053430 | A HAND-HELD STEAMER HEAD - The present application relates to a hand-held steamer head. The steamer head ( | 02-25-2016 |
Wing Fai Loke, San Jose, CA US
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20160079918 | SYSTEM AND METHOD USING TEMPERATURE TRACKING FOR A CONTROLLED OSCILLATOR - A system using temperature tracking for a controlled oscillator (CO) is provided. The system includes at least one coarse tuning capacitor circuit including a plurality of selectable coarse tuning capacitors operable in at least three modes of operation, thereby allowing switching between each coarse capacitor of the plurality of selectable coarse capacitors when a selected coarse tuning capacitor has reached one of its high tuning range and low tuning range. | 03-17-2016 |
20160079919 | FINE TUNING CONTROL FOR A DIGITALLY CONTROLLED OSCILLATOR - Methods, apparatuses, and systems for providing a variable capacitance using an array of capacitor cells are discussed. In the fine tuning bank of an inductor/capacitor (LC)-tank of a digitally controlled oscillator (DCO), control is implemented by selecting a boundary cell from the array of capacitor cells and having every cell before the boundary cell in a circuit path be grounded and having the boundary cell and every cell after the boundary cell in the circuit path be connected to a voltage source. The circuit path may be the one formed by using thermometer coding in the fine tuning bank. | 03-17-2016 |
Yan Loke, Edmonton CA
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20120119311 | SEMI-CONDUCTOR SENSOR FABRICATION - Methods of fabricating semiconductor sensor devices include steps of fabricating a hermetically sealed MEMS cavity enclosing a MEMS sensor, while forming conductive vias through the device. The devices include a first semi-conductor layer defining at least one conductive via lined with an insulator and having a lower insulating surface; a central dielectric layer above the first semiconductor layer; a second semiconductor layer in contact with the at least one conductive via, and which defines a MEMS cavity; a third semiconductor layer disposed above the second semiconductor layer, and which includes a sensor element aligned with the MEMS cavity; a cap bonded to the third semiconductor to enclose and hermetically seal the MEMS cavity; wherein the third semiconductor layer separates the cap and the second semiconductor layer. | 05-17-2012 |
20140252506 | SEMI-CONDUCTOR SENSOR FABRICATION - Methods of fabricating semiconductor sensor devices include steps of fabricating a hermetically sealed MEMS cavity enclosing a MEMS sensor, while forming conductive vias through the device. The devices include a first semi-conductor layer defining at least one conductive via lined with an insulator and having a lower insulating surface; a central dielectric layer above the first semiconductor layer; a second semiconductor layer in contact with the at least one conductive via, and which defines a MEMS cavity; a third semiconductor layer disposed above the second semiconductor layer, and which includes a sensor element aligned with the MEMS cavity; a cap bonded to the third semiconductor to enclose and hermetically seal the MEMS cavity; wherein the third semiconductor layer separates the cap and the second semiconductor layer. | 09-11-2014 |
Yee Chong Loke US
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20130048502 | SYSTEMS AND PROCESSES FOR FORMING MOLDS SUCH AS NICKEL MOLDS - For forming a nickel mold, a metal and a corresponding etchant are selected such that the etchant selectively etches the metal over nickel. The metal is sputtered onto a surface of a template having nano-structures to form a sacrificial layer covering the nano-structures. Nickel is electroplated onto the sacrificial layer to form a nickel mold, but leaving a portion of the sacrificial layer exposed. The sacrificial layer is contacted with the etchant through the exposed portion of the sacrificial layer to etch away the sacrificial layer until the nickel mold is separated from the template. Subsequently, the nickel mold may be replicated or scaled-up to produce a replicate mold by electroplating, where the replicate mold has nano-structures that match the nano-structures on the template. The metal may be copper. | 02-28-2013 |
Yue-Hin Loke, Washington, DC US
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20150025666 | THREE DIMENSIONAL PRINTED REPLICAS OF PATIENT'S ANATOMY FOR MEDICAL APPLICATIONS - A system and method of creating a 3-dimensional (3D) replica of a patient's anatomy. The method includes acquiring 3D echo images of the patient's anatomy using ultrasound waves, selecting a filter that reduces noise in the 3D echo images, selecting a segmentation algorithm to segment the filtered 3D echo images, selecting at least one additional segmentation algorithm to subsequently segment the segmented 3D echo images, creating a 3D digital model, and outputting the 3D digital model as the 3D replica of the patient's anatomy. The method also includes acquiring other 3D images using MRI/CT scans, creating another 3D digital model, determining a scaling factor to scale the other 3D digital model to correspond to a size of the 3D digital model created using ultrasound waves, combining the 3D digital model and the other 3D digital model, and outputting the combined 3D digital models. | 01-22-2015 |