| Patent application number | Description | Published |
| 20090120670 | BENDABLE AREA DESIGN FOR FLEXIBLE PRINTED CIRCUITBOARD - A bendable area design for flexible printed circuitboard is disclosed. The flexible printed circuitboard (FPC) is comprised of: a flexible substrate; at least a circuit pattern; and a bendable area, being formed intersecting with the at least one circuit pattern and having at least a groove formed therein at a position corresponding to the intersection with the at least one circuit pattern; wherein the depth of the at least one groove is no larger than the thickness of the corresponding circuit pattern for preventing the circuit pattern from being cut off by the groove. By configuring the aforesaid bendable area in the FPC, stress generated by the bending of the FPC is restricted inside the bendable area effectively so that accurate control of the bending angle for bending FPC can be realized. | 05-14-2009 |
| 20090277669 | FLEXIBLE PRINTED CIRCUITBOARD WITH ANTI-SOLDER CRACK STRUCTURE - A flexible printed circuitboards (FPC) with anti-solder crack structure, adapted for a plurality of circuit components to mount thereon, is disclosed, which comprises: a vacant area, being a region of high aspect ratio formed on the FPC at a location where the FPC is more likely to be bended and is enclosed by the plural circuit components; a layout area, being a region formed on the FPC at a location beyond that of the vacant area so as to be provided for the plural circuit components to mount thereon. By the formation of the vacant area on the FPC at its stress concentration region when it is bended by an external force, stresses in solder bumps bonding the plural circuit components with the FPC can be prevented from happening so that the reliability of circuit component against solder crack is improved. | 11-12-2009 |
| 20100021680 | ANTI-DUST APPARATUS FOR LIQUID CRYSTAL DISPLAY (LCD) PANEL - An anti-dust apparatus for a liquid crystal display (LCD) panel, comprising: a protective film comprising a main portion, a foldable portion extending from the main portion, and a fold line between the main portion and the foldable portion, wherein the main portion has a first attachment surface and an exposed surface on both sides, the foldable portion has a second attachment surface adjacent to the first attachment surface, and the foldable portion is folded along the fold line to be parallel with the LCD panel; an adhesive layer disposed on the first attachment surface and the second attachment surface of the protective film, wherein the adhesive layer on the first attachment surface is attached onto the LCD panel; a twin adhesive layer disposed on the other surface different from the second attachment surface of the foldable portion, wherein the twin adhesive layer is attached onto the exposed surface of the protective film; and an anti-dust portion disposed on the adhesive layer on the second attachment surface of the foldable portion. Thereby, the present invention prevents the protective film from being mal-functional due to exposure of the adhesive layer when the foldable portion is folded. | 01-28-2010 |
| 20100032191 | FLEXIBLE PRINTED CIRCUITBOARD STRUCTURE - A flexible printed circuitboard structure is disclosed, which comprises: a flexible printed circuitboard (FPC), having at least a soldering pad and at least a solder pasted pad area formed thereon; wherein, by using the extending of a side of the at least one solder pasted pad area as the base line, a bending line is formed on the FPC in a manner that it is prevented from passing through the at least one soldering pad and is disposed at a specific distance away from the periphery of the same. By the configuration of the solder pasted pad area to defined the bending line on the FPC, the bending stress problems caused when the FPC is being bended, such as solder crack and broken circuit, etc., can be prevented. | 02-11-2010 |
| 20100035446 | PIN LAYOUT OF A GOLDEN FINGER FOR FLEXIBLE PRINTED CIRCUITBOARD - A pin layout of a golden finger for FPC is disclosed, which comprises: a substrate; a first conductive layer, having a plurality of first routings; a second conductive layer, having a plurality of second routings; and a plurality of conductive members; wherein the first and the second conductive layers are formed respectively on the two opposite sides of the substrate in a manner that each first routing is electrically connected to its corresponding first pin, while disposing a plurality of second pins, without contacting to the first pins and the first routings, on the side of the substrate where the first conductive layer is disposed for corresponding each of the second pins to the extensions of the plural second routings; and the plural conductive members are disposed forming electric connections between the second routings and the second pins in respective. | 02-11-2010 |
| 20100096165 | GOLDEN FINGER FOR FLEXIBLE PRINTED CIRCUITBOARD - A golden finger for flexible printed circuitboard, comprises: a frame with a tail, being composed of a stiffening plate, a bottom substrate, a bottom copper layer, a cover layer, and a top copper layer while enabling the bottom copper layer to be formed with at least one first routing and at least one second routing, and enabling the top copper layer to be formed with at least one first pin and at least one second pin; at least one first via hole, each being filled with a conductive material and disposed at a position between its corresponding first pin and first routing for connecting the first pin to the first routing electrically; and at least one second via hole, each filled with a conductive material and being disposed at a position between the its corresponding second pin and second routing for connecting the second pin to the second routing electrically. | 04-22-2010 |
| 20100326704 | SOLDERING PAD LAYOUT FOR FLEXIBLE PRINTED CIRCUIT BOARD - A soldering pad layout for flexible printed circuit board (PCB) is disclosed, which comprises: a top substrate; a middle substrate; and a bottom substrate, being arranged by stacking one over the other successively in parallel. In an exemplary embodiment, there are at least a top routing layer, being sandwiched between the top substrate and the middle substrate, and at least a bottom routing layer, being sandwiched between the middle substrate and the bottom substrate. With the aforesaid soldering pad layout, not only circuit breakage caused by stress concentration on a bended flexible printed circuit board can be prevented, but also the routing path required on the PCB can be shortened and the amount of space for laying out parts on the PCB can be reduced. | 12-30-2010 |
| Patent application number | Description | Published |
| 20090264258 | Buffering Apparatus - A treadmill includes an external frame, an internal frame connected to the external frame, a belt in the form of a loop supported on the internal frame and a buffering apparatus for buffering the internal frame. The buffering apparatus includes a crossbar and two buffer sets. The crossbar is rotationally provided on the external frame between various positions. Each of the buffer sets includes a plurality of buffering blocks made with different elastic coefficients so that a selected one of the buffering blocks is brought into contact with the internal frame when the crossbar is in a related one of the positions. | 10-22-2009 |
| 20100029444 | FOLDABLE SUPPORT FRAME FOR TREADMILL - A foldable support frame for a treadmill includes a bottom bracket, two pivot seats mounted on the bottom bracket, two limit protrusions mounted on the bottom bracket, and two support arms mounted on the bottom bracket and each having a lower end which is pivotally mounted on a respective one of the pivot seats and is detachably mounted on a respective one of the limit protrusions. Thus, each of the support arms is pivotable relative to the respective pivot seat to be parallel with the bottom bracket, and the lower end of each of the two support arms is movable to detach from the respective limit protrusion to facilitate a user mounting electric wires from the lower end of each of the support arms. | 02-04-2010 |
| 20110201481 | Buffering Platform Unit of a Treadmill - An elastic platform is provided a treadmill. The elastic platform includes a frame and a piece of fabric. The frame is connected to the treadmill. The piece of fabric is supported on the frame. The piece of fabric supports a section of a belt wound around two rollers of the treadmill. | 08-18-2011 |
| 20120108398 | Treadmill - A treadmill includes a base, a supporting unit provided on the base, an upper controller located on the supporting unit, a lower controller located on the base and electrically connected to the upper controller, two rollers located on the base, a platform located between the rollers, a magnet attached to the platform, a belt made in the form of a loop wound around the rollers, a motor for driving one of the rollers; and a sensor attached to the base and electrically to both of the upper and lower controllers and for sensing movement of the magnet. | 05-03-2012 |
| Patent application number | Description | Published |
| 20110061774 | DEZINCIFICATION-RESISTANT COPPER ALLOY AND METHOD FOR PRODUCING PRODUCT COMPRISING THE SAME - A dezincification-resistant copper alloy and a method for producing a product comprising the same are proposed by the present invention. The dezincification-resistant alloy of the present invention comprises 59.5 to 64 wt % of copper (Cu); 0.1 to 0.5 wt % of bismuth (Bi); 0.08 to 0.16 wt % of arsenic (As); 5 to 15 ppm of boron (B); 0.3 to 1.5 wt % of tin (Sn); 0.1 to 0.7 wt % of zirconium (Zr); less than 0.05 wt % of lead (Pb); and zinc (Zn) in balance. The dezincification-resistant copper alloy of the present invention has excellent casting properties, good toughness and machinability, and can be corrosion-resistant. Thus, the alloy can reduce dezincification on the surfaces thereof. | 03-17-2011 |
| 20110064602 | DEZINCIFICATION-RESISTANT COPPER ALLOY - A dezincification-resistant copper alloy is provided. The copper alloy comprises less than 0.3 wt % of lead (Pb), 0.02 to 0.15 wt % of antimony (Sb), 0.02 to 0.25 wt % of arsenic (As), 0.4 to 0.8 wt % of aluminum (Al), 1 to 20 ppm of boron (B), and more than 97 wt % of copper (Cu) and zinc (Zn), wherein the copper is in an amount ranging from 58 to 70 wt %. The dezincification-resistant copper alloy of the present invention has excellent casting properties, good toughness and machinability, and can be corrosion-resistant, thereby reducing dezincification on the surfaces of the alloy. | 03-17-2011 |
| 20110081271 | LOW-LEAD COPPER ALLOY - The present invention provides a low-lead copper alloy, which includes 0.05 to 0.3 wt % of lead, 0.3 to 0.8 wt % of aluminum, 0.01 to 3 wt % of bismuth, 1 to 4 wt % of silicon, 0.1 to 1 wt % of tin, and more than 93.6% of copper and zinc, wherein copper is in an amount ranging from 61 to 78 wt %. The low-lead copper alloy of the present invention has excellent toughness and processability, and can provide increased resistance in an environment with a high concentration of chlorine ions. | 04-07-2011 |
| 20110081272 | LOW-LEAD COPPER ALLOY - The present invention provides a low-lead copper alloy, comprising 0.05 to 0.3 wt % of lead (Pb), 0.3 to 0.8 wt % of aluminum (Al), 0.01 to 0.4 wt % of bismuth (Bi), 0.1 to 2 wt % of nickel (Ni), and more than 96.5 wt % of copper (Cu) and zinc (Zn), wherein copper is in an amount ranging from 58 to 70 wt %. The low-lead copper alloy of the present invention has excellent material properties as well as good toughness and processability, thereby increasing the alloy strength and corrosion resistance thereof. | 04-07-2011 |
| 20110142715 | Brass alloy - The present invention provides an environmental friendly brass alloy, including 0.4 to 0.8 wt % of aluminum; 0.6 to 1.6 wt % of nickel; 0.8 to 2.0 wt % of tin; more than 95.6 wt % of copper and zinc; and less than 0.1 wt % of iron, lead, phosphorous and impurities, wherein the copper is present in an amount ranging from 60 to 68 wt %. | 06-16-2011 |
| 20110182768 | LEAD-FREE BRASS ALLOY - The present invention provides a lead-free brass alloy, including 0.3 to 0.8 wt % of aluminum, 0.01 to 0.4 wt % of bismuth, 0.05 to 1.5 wt % of iron and more than 96 wt % of copper and zinc, wherein the copper is present in an amount ranging from 58 to 75 wt %. The brass alloy of the present invention meets the standard of the environmental regulation, wherein the lead content is less than 0.25 wt % based on the weight of the alloy. Further, the brass alloy of the present invention has 0.05 to 1.5 wt % of iron and less than 0.4% of bismuth, so as to lower production cost, eliminate cracks and increase production yield. | 07-28-2011 |
| Patent application number | Description | Published |
| 20120212897 | PORTABLE STORAGE DEVICE - A portable storage device comprises a memory device, a housing and a locking mechanism. The memory device includes an upper and a lower covers, and a memory with one end clamped therebetween, and another end of the memory is an USB connector for connecting to computer. The housing is provided with two ears at both sides thereof, and each of the ears is formed with a through hole. The locking mechanism comprises a flexible member, and both ends of the flexible member being formed with a locking portion, each of the locking portions is inserted through the through holes of the ears and engaged with a locking members, respectively. The locking portions of the flexible member are formed with outer threads for meshing with inner threads of the locking member. The portable storage device can also be used to carry small objects in addition to being used as storage device. | 08-23-2012 |
| 20120268883 | EXTENSION POSITIONING STRUCTURE FOR A PORTABLE MEMORY DEVICE - An extension positioning structure for a portable memory device comprises a main body in a shell. A first end of the main body is disposed a drive element, and a spring is mounted outside a second end of the main body. A positioning element is pivotally disposed between the shell and the drive element. The positioning element includes a pivot shaft and an engaging portion. The engaging portion is helically formed with multiple cutting surfaces, and the positioning block is formed with a positioning block and a limiting block. By pushing the drive element, the cutting surface of the engaging portion of the positioning element cooperates with the positioning block and the limiting block to make the connecting terminal extend out of and retract into the shell, facilitating the operation and storage of the memory device while reducing both the production cost and increasing the yield rate. | 10-25-2012 |