Liu, Kaohsiung County
Chao Cheng Liu, Kaohsiung County TW
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20090278242 | STACKED TYPE CHIP PACKAGE STRUCTURE - A stacked type chip package structure including a lead frame, a chip package, a second chip, and a second molding compound is provided. The lead frame includes a plurality of first leads and second leads insulated from one another. The first leads have a first upper surface, and the second leads have a second upper surface which is not co-planar with the first upper surface. The chip package is disposed on the first leads and includes a substrate, a first chip, and a first molding compound. The second chip is stacked on the chip package and electrically connected to the second leads. The second molding compound is disposed on the lead frame and filled among the first leads and the second leads for encapsulating the chip package and the second chip. | 11-12-2009 |
20090278243 | STACKED TYPE CHIP PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME - A stacked type chip package structure including a chip carrier, a first chip, a second chip, a third chip, and an insulating material is provided. The chip carrier includes two die pads and a plurality of leads surrounding the die pads. The first chip and the second chip are disposed on the die pads respectively, and are electrically connected to the leads by wire bonding. The third chip traverses the first chip and the second chip, and is electrically connected to the first chip and the second chip respectively. The insulating material is disposed on the chip carrier for encapsulating the first chip, the second chip and the third chip, and fills among the die pads and the leads. | 11-12-2009 |
20090289338 | SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME - A semiconductor package includes a carrier, a chip, a stiffener and an encapsulant. The chip is disposed on the carrier. The stiffener is disposed around the chip, directly contacts the carrier, and is mounted on the carrier. The encapsulant is adapted to seal the chip and the stiffener. | 11-26-2009 |
20090289339 | SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME - A semiconductor package includes a carrier, a chip, a stiffener and an encapsulant. The chip is disposed on the carrier. The stiffener is disposed around the chip, directly contacts the carrier, and is mounted on the carrier. The encapsulant is adapted to seal the chip and the stiffener. | 11-26-2009 |
Chin-Lung Liu, Kaohsiung County TW
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20100072244 | WEB TRANSPORTATION GUIDING APPARATUS AND METHOD - A guiding apparatus and method for a shift generated by a web during web transportation is provided, in which a coarse position guiding module and a fine position guiding module function to directly adjust the web so as to compensate the shift occurred during the process of transportation according to a position of the web. By means of monitoring a location of the fine position guiding module at any time, a reference of the coarse position guiding module will be adjusted when the location of the fine position guiding module satisfies the condition defined in the guiding method, so as to change a position where the web enters into the fine position guiding module. | 03-25-2010 |
20140116851 | CONVEYOR APPARATUS - A conveyor apparatus including a control module, an unwinding module, at least one tension sensing module, and a rewinding module is provided. The tension sensing module includes a load cell disposed between a set of rollers. An objet is conveyed along a conveying direction perpendicular to an axis of the roller. A wrap angle is formed by the object and the roller with a fulcrum of the loadi cell served as a center, and the wrap angle is less than 180°. The rewinding and unwinding modules have different actuating units electrically connected to the control module respectively, such that the object is wound or unwound by the rewinding and the unwinding modules. | 05-01-2014 |
Chun-Chen Liu, Kaohsiung County TW
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20100295160 | QUAD FLAT PACKAGE STRUCTURE HAVING EXPOSED HEAT SINK, ELECTRONIC ASSEMBLY AND MANUFACTURING METHODS THEREOF - A quad flat package (QDP) structure having an exposed heat sink is provided. The QDP structure includes a leadframe, a chip, a heat sink, an insulating layer and a molding compound. The leadframe includes a die pad and multiple leads surrounding the die pad. The chip is disposed on the die pad and electrically connected to the die pad and the leads. The heat sink has a top surface, a bottom surface opposite thereto, and a side surface connected to the top and the bottom surfaces. The die pad is disposed in a central area of the top surface of the heat sink and electrically connected to the heat sink. The molding compound encapsulates the chip, the die pad, an inner lead portion of each lead and heat sink, and exposes the bottom surface of the heat sink and an outer lead portion of each lead. | 11-25-2010 |
Hsien-Cheng Liu, Kaohsiung County TW
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20120196123 | Compositions for Preparing Plant Fiber Composites and Plant Fiber Composites Prepared from the Same - Provided is a composition for preparing plant fiber composite has, by weight based on the whole composition: a plant fiber raw material in an amount ranging from 60% to 80%; a starch auxiliary in an amount ranging from 10% to 30%; and a biological polymer additive in amount ranging from 10% to 20%, wherein the biological polymer additive includes a plant hormone, an enzyme, a vinegar and an ester of lactic acid. Plant fiber composite prepared from the composition is also provided. The plant fiber composite is derived from recycled material for extrusion and modeling, as a non-toxic and harmless raw material with high utilizing rate of recycled material and substitutes for plastic materials. The plant fiber composite is applied to food container, packing materials for electronic device and agricultural products, seedling trays, or substitutes for timber in the field of building, decoration and furniture. | 08-02-2012 |
Jian-Hong Liu, Kaohsiung County TW
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20080215545 | Data file management and search method and system based on file attributes - A data file management and search method based on file attributes is disclosed. At least one data file, externally imported or generated by a user, is retrieved. Attributes of the data file are edited, a virtual catalog corresponding to the data file is generated, and a catalog tree is built according to the data file and the virtual catalog. The virtual catalog and the data file are displayed by a user interface. A search operation is performed based on a search command to locate at least one required virtual catalog or data file among multiple data files and virtual catalogs. A basic operation is implemented on the located virtual catalog or data file. | 09-04-2008 |
20090150332 | VIRTUAL FILE MANAGING SYSTEM AND METHOD FOR BUILDING SYSTEM CONFIGURATION AND ACCESSING FILE THEREOF - A virtual file managing system including a file request managing unit, an information repository, a file namespace managing unit, and a file access managing unit is provided. The file request managing unit receives a file access request issued by a client, and returns a processing result of the file access request. The information repository stores a data structure of the virtual file managing system. The file namespace managing unit looks up address and path content of the file from the information repository according to the file access request. The file access managing unit performs an operation of accessing a file according to the address and path content of the file. | 06-11-2009 |
20090287652 | DISTRIBUTED AUDIO VISUAL SYSTEM AND CONTENT DIRECTORY MANAGEMENT SYSTEM AND METHOD THEREOF - A distributed audio visual (AV) system including a plurality of media servers, a media renderer, and a control point which are connected to each other via a peer-to-peer network is provided. Each of the media servers includes a content directory management unit (CDMU) and a query content information (QCI) module, wherein the CDMU includes a synchronizer module and a content information maintainer (CIM) module. The synchronizer module synchronizes content information of AV contents stored in all the media servers. The CIM module records the content information and establishes an integrated content directory list according to the content information. The QCI module queries the content information. The control point obtains the integrated content directory list from one of the media servers and queries the content information related to all the AV contents, so as to control the media renderer to play the AV contents. | 11-19-2009 |
Keng-Jen Liu, Kaohsiung County TW
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20090298294 | METHOD FOR CLEARING NATIVE OXIDE - A method for clearing native oxide is described. A substrate is provided, including an exposed portion whereon a native oxide layer has been formed. A clearing process is performed to the substrate using nitrogen trifluoride (NF | 12-03-2009 |
Lo-Ying Liu, Kaohsiung County TW
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20090283241 | Equipment for continuous casting operation - Equipment for a continuous casting operation includes a closed chamber having first and second connecting holes, a furnace unit disposed in the chamber, a horizontal casting apparatus connected to the first connecting hole and including at least one first die having a first passage connected to the melting furnace, a first drawing unit disposed downstream of the horizontal casting apparatus, an upcast casting apparatus disposed above the chamber and connected to the second connecting hole, and a second drawing unit disposed downstream of the upcast casting apparatus. The upcast casting apparatus includes at least one second die having a second passage connected to the melting furnace. With the equipment, either horizontal casting or upcasting may be performed. | 11-19-2009 |
Nai-Wei Liu, Kaohsiung County TW
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20150108634 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - A semiconductor device includes a die, a pad disposed on the die and configured to be electrically coupled with a bump through a conductive trace attached on the pad, a polymer disposed over the die and patterned to provide a path for the conductive trace passing through, and a molding surrounding the die and the polymer. A top surface of the molding is substantially in a same level as a top surface of the polymer. Further, a method of manufacturing a semiconductor device includes providing a die, forming a pad on the die, disposing a first polymer over the die, patterning the first polymer with an opening over the pad, disposing a sacrificial layer over the patterned first polymer, disposing a molding surrounding the die, removing a portion of the molding thereby exposing the sacrificial layer, removing the sacrificial layer thereby exposing the pad and the first polymer, disposing a second polymer on the first polymer, patterning the second polymer with the opening over the pad, and disposing a conductive material on the pad within the opening. | 04-23-2015 |
Sai-Chang Liu, Kaohsiung County TW
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20090093093 | METHOD OF FABRICATING THIN FILM TRANSISTOR - A method for fabricating a thin film transistor (TFT) is provided. A substrate having a gate, a dielectric layer, a channel layer and an ohmic contact layer formed thereon is provided. Next, a metal layer is formed over the substrate covering the ohmic contact layer. Next, the metal layer and the ohmic contact layer are simultaneously etched by a wet etching process to form a source/drain and expose the channel layer. Because the wet etching process can be used to selectively etch the ohmic contact layer, damage to the underlying channel layer may be negligible. Thus, the reliability of the device may be promoted. Furthermore, the process may be simplified, the production yield and the throughput of TFT may be increased. | 04-09-2009 |
Shih-Chang Liu, Kaohsiung County TW
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20090039452 | EMBEDDED BONDING PAD FOR IMAGE SENSORS - A semiconductor device includes a semiconductor substrate having a front surface and a back surface, elements formed on the substrate, interconnect metal layers formed over the front surface of the substrate, including a topmost interconnect metal layer, an inter-metal dielectric for insulating each of the plurality of interconnect metal layers, and a bonding pad disposed within the inter-metal dielectric, the bonding pad in contact with one of the interconnect metal layers other than the topmost interconnect metal layer. | 02-12-2009 |
20140273424 | Method of Conducting a Direction-Specific Trimming Process for Contact Patterning - The present disclosure discloses a method of fabricating a semiconductor device. A first layer is formed over a substrate. A patterned second layer is then formed over the first layer. The patterned second layer includes an opening. A spacer material is then deposited in the opening, thereby reducing the opening in a plurality of directions. A direction-specific trimming process is performed to the spacer material and the second layer. Thereafter, the first layer is patterned with the second layer. | 09-18-2014 |
Shin-Jr Liu, Kaohsiung County TW
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20120046445 | GLUTATHIONE-BASED DELIVERY SYSTEM - A delivery system is provided. The delivery system includes a carrier or an active compound and a glutathione or a glutathione derivative grafted thereon. The invention also provides a compound including a moiety comprising a vitamin E derivative or a phospholipid derivative, a polyethylene glycol (PEG) or a polyethylene glycol derivative bonded thereto, and a glutathione (GSH) or a glutathione derivative bonded to the polyethylene glycol or the polyethylene glycol derivative. | 02-23-2012 |
Wen Cheng Liu, Kaohsiung County TW
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20120270401 | CHEMICAL MECHANICAL POLISHING SLURRY, ITS PREPARATION METHOD AND USE FOR THE SAME - A chemical mechanical polishing slurry for polishing a copper layer without excessively or destructively polishing a barrier layer beneath the copper layer is disclosed and includes an acid, a surfactant, and a silica sol having silica polishing particles that are surface modified with a surface charge modifier and that have potassium ions attached thereto. A method for preparing the chemical mechanical polishing slurry and a chemical mechanical polishing method using the chemical mechanical polishing slurry are also disclosed. | 10-25-2012 |
Wen-Fung Liu, Kaohsiung County TW
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20110135313 | OPTICAL FIBER COMMUNICATION METHOD AND TRANSMITTING DEVICE - An optical fiber communication method for communication between a transmitting terminal and a receiving terminal includes the steps of: providing an optical fiber to be coupled to the transmitting terminal and including a core that is provided with at least one second-order Bragg grating structure and a cladding that surrounds the core; configuring the transmitting terminal to output a data-carrying optical signal to one end of the core of the optical fiber for subsequent wireless transmission of the data-carrying optical signal via radiation through the second-order Bragg grating structure of the optical fiber; and configuring the receiving terminal to receive the signal radiated by the second-order Bragg grating structure of the optical fiber. A transmitting device is also disclosed. | 06-09-2011 |
Yuan Wei Liu, Kaohsiung County TW
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20120038839 | MICRO PROJECTOR MODULE - A micro projector module according to the present invention is provided. The micro projector module includes a substrate, a controller chip, a LCOS chip, a glass and a liquid crystal layer. The controller chip is positioned on the upper surface of the substrate and electrically connected to the substrate. The LCOS chip is positioned on the controller chip and electrically connected to the substrate. The glass is positioned on the LCOS chip and the liquid crystal layer is disposed between the LCOS chip and glass. | 02-16-2012 |