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| 20090212353 | NON-VOLATILE MEMORY - A non-volatile memory includes a substrate having two openings, a stacked gate structure disposed on the substrate between the two openings, a liner disposed on a bottom of each of the two openings and parts of a sidewall of each of the two openings, a second conductive layer disposed on the liner at the bottom of each of the two openings, and a third conductive layer on the second conductive layer and the liner. The stacked gate structure includes a first dielectric layer, a charge storage layer, a second dielectric layer, and a first conductive layer. The liner has a top surface lower than that of the substrate. The second conductive layer has a top surface co-planar with that of the liner. The third conductive layer has a top surface at least co-planar with that of the substrate and lower than that of the first dielectric layer. | 08-27-2009 |
| 20090246925 | NITRIDE READ ONLY MEMORY DEVICE WITH BURIED DIFFUSION SPACERS AND METHOD FOR MAKING THE SAME - A method for making a nitride read only memory device with buried diffusion spacers is disclosed. An oxide-nitride-oxide (ONO) layer is formed on top of a silicon substrate, and a polysilicon gate is formed over the ONO layer. The polysilicon gate is formed less than a length of the ONO layer. Two buried diffusion spacers are formed beside two sidewalls of the polysilicon gate and over the ONO layer. Two buried diffusion regions are implanted on the silicon substrate next to the two buried diffusion spacers. The two buried diffusion regions are then annealed such that the approximate interfaces of the buried diffusion regions are under the sidewalls of the polysilicon gate. The structure of a nitride read only memory device with buried diffusion spacers is also described. | 10-01-2009 |
| 20110109863 | COMMON REPAIR STRUCTURES FOR CLOSE BUS IN A LIQUID CRYSTAL DISPLAY - One aspect of the present disclosure relates to a common repair structure for repairing scanning and/or data line defects in a liquid crystal display panel. In one embodiment, the common repair structure includes a plurality of “H” shaped structures, where each “H” shaped structure is placed over a corresponding segment of two neighboring scanning lines located between and associated with two neighboring pixels along the second direction or a corresponding segment of two neighboring data lines located between and associated with two neighboring pixels along the first direction. | 05-12-2011 |
| 20110198686 | NITRIDE READ ONLY MEMORY DEVICE WITH BURIED DIFFUSION SPACERS AND METHOD FOR MAKING THE SAME - A method for making a nitride read only memory device with buried diffusion spacers is disclosed. An oxide-nitride-oxide (ONO) layer is formed on top of a silicon substrate, and a polysilicon gate is formed over the ONO layer. The polysilicon gate is formed less than a length of the ONO layer. Two buried diffusion spacers are formed beside two sidewalls of the polysilicon gate and over the ONO layer. Two buried diffusion regions are implanted on the silicon substrate next to the two buried diffusion spacers. The two buried diffusion regions are then annealed such that the approximate interfaces of the buried diffusion regions are under the sidewalls of the polysilicon gate. The structure of a nitride read only memory device with buried diffusion spacers is also described. | 08-18-2011 |
| 20110198698 | BIT LINE STRUCTURE, SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME - A semiconductor device including a substrate, a plurality of stacked gate structures, a plurality of doped regions, a plurality of liner layers, a plurality of conductive layers, a plurality of dielectric layers and a plurality of word lines is provided. The substrate has a plurality of trenches therein. The stacked gate structures are on the substrate between the trenches. The doped regions are in the substrate at sidewalls or bottoms of the trenches. The liner layers are on at least a portion of sidewalls of the stacked gate structures and on sidewalls of the trenches. The conductive layers are in the trenches and electrically connected to the doped regions. The dielectric layers are on the conductive layers and between the stacked gate structures. The word lines are on the substrate and electrically connected to the stacked gate structures. | 08-18-2011 |
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| 20090026562 | Package structure for optoelectronic device - A package structure for an optoelectronic device. The package structure comprises a device chip interposed between a lower transparent substrate and an upper transparent substrate. The device chip comprises a semiconductor substrate comprising a device region surrounded by a pad region, in which the pad region comprises a plurality of notches along the edges of the semiconductor substrate. A dielectric layer is between the semiconductor substrate and the upper transparent substrate, comprising a plurality of pads formed therein and substantially aligned with the plurality of notches, respectively. A plurality of metal lines is disposed under a bottom surface of the lower transparent substrate. A plurality of solder balls disposed under the plurality of metal lines, respectively. | 01-29-2009 |
| 20090186449 | METHOD FOR FABRICATING PACKAGE STRUCTURES FOR OPTOELECTRONIC DEVICES - A package structure for an optoelectronic device. The package structure comprises a device chip reversely disposed on a first substrate, which comprises a second substrate and a first dielectric layer between the first and second substrates. The first dielectric layer comprises a pad formed in a corner of the first dielectric layer non-overlapping the second substrate, such that the surface and sidewall of the pad are exposed. A metal layer is formed directly on the exposed surface of the pad and covers the second substrate. A protective layer covers the metal layer, having an opening to expose a portion of the metal layer on the second substrate. A solder ball is disposed in the opening, electrically connecting to the metal layer. The invention also discloses a method for fabricating the same. | 07-23-2009 |
| 20090263927 | ISOLATION STRUCTURES FOR CMOS IMAGE SENSOR CHIP SCALE PACKAGES - Isolation structure for CMOS image sensor device chip scale packages and fabrication methods thereof. A CMOS image sensor chip scale package includes a transparent substrate configured as a support structure for the package. The transparent substrate includes a first cutting edge and a second cutting edge. A CMOS image sensor die with a die circuitry is mounted on the transparent substrate. An encapsulant is disposed on the substrate encapsulating the CMOS image sensor die. A connection extends from the die circuitry to a plurality of terminal contacts for the package on the encapsulant, wherein the connection is exposed by the first cutting edge. An isolation structure is disposed on the first cutting edge passivating the exposed connection and co-planed with the second cutting edge. | 10-22-2009 |
| 20100127408 | BONDING PAD STRUCTURE FOR BACK ILLUMINATED OPTOELECTRONIC DEVICE AND FABRICATING METHOD THEREOF - A bonding pad structure for an optoelectronic device. The bonding pad structure comprises a carrier substrate having a bonding pad region and an optoelectronic device region. An insulating layer is disposed on the carrier substrate, having an opening corresponding to the bonding pad region. A bonding pad is embedded in the insulating layer under the opening to expose the top surface thereof. A device substrate is disposed on the insulating layer corresponding to the optoelectronic device region. A cap layer covers the device substrate and the insulating layer excluding the opening. A conductive buffer layer is disposed in the opening to directly contact the bonding pad. The invention also discloses a method for fabricating the same. | 05-27-2010 |
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| 20100067646 | SHIFT REGISTER WITH EMBEDDED BIDIRECTIONAL SCANNING FUNCTION - A shift register comprises a plurality of stages, {S | 03-18-2010 |
| 20110141073 | PIXEL ARRAY - A pixel array which comprises a display area, a plurality of scan lines and a plurality of drivers is provided. The display area has a first side, a second side in opposition to the first side and a plurality of pixels. The scan lines are electrically connected to the pixels, respectively. The drivers are electrically connected to the scan lines, respectively. The pixels are arranged along the first direction in sequence. The drivers are located on the first side and the second side of the display area, and are arranged along the second direction in sequence. The first direction is orthogonal to the second direction. | 06-16-2011 |
| 20110170656 | BIDRECTIONAL SHIFTER REGISTER AND METHOD OF DRIVING SAME - A bidirectional shift register includes first, second, third and four control signal bus lines for providing first, second, third and fourth control signals, Bi | 07-14-2011 |
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| 20090001655 | PAPER FEED APPARATUS FOR DUPLEX PRINTING APPARATUS - A paper feed apparatus includes a gate, an actuator, a transmission, a pickup device, a reversing device, a paper feed device. The gate has a rack defined at one end of the gate and a resilient arm connecting to the outer portion of the rack. The resilient arm has a plurality of external teeth. The actuator has a pickup gear with a disc-shaped body, an external wheel connecting to the outside of the body and an external gear connecting to the outside of the external wheel. A receiving passage is defined through the pickup gear along the axis thereof. The receiving passage includes a holding hole at one side of the receiving passage that is near to the rack. The resilient arm is inserted into the receiving passage with the external teeth abutting against the inner surface of the holding hole. | 01-01-2009 |
| 20090040265 | INK STORING BOX - An ink-storing box includes a container, a cover covering on the container and a lock gate. The cover defines at least one communicating hole therein. The lock gate includes a base board movable arranged between the cover and the container and a drive portion located on the base board, the base board defining a cooperation hole therein. The lock gate is set between the cover and the container for allowing the hole of the cover communicating with the interior of the container or shielding the interior of the container from being exposed through the hole of the cover. Thereby the ink-storing box of the present invention can receive the ink jetted from the ink box and prevent the evaporation of the ink. | 02-12-2009 |
| 20090091076 | AUTO DOCUMENT FEEDER - An auto document feeder cooperated with an image processing machine defines a feeding path and has a base, a frame and a sensor device. The base has a background under the feeding path. The frame is mounted on the base. The sensor couples with the frame and has a sensor arm. The sensor arm has an optical sensor located in the feeding path and faced to the background of the base. The sensor device recognizes a sheet is present in the feeding path or not by that the optical sensor recognizes the energy of the light reflected from the background and the sheet. The sensor device also recognizes characteristic of the sheet by that the optical sensor recognizes the energy of the light reflected from the sheet. Therefore, the image processing machine executes different processes for the sheet according to the characteristic of the sheet. | 04-09-2009 |
| 20090110437 | DUPLEX DOCUMENT FEEDER - A duplex document feeder defines a feeding path. A charging means, a guiding plate equipped with elastic force and a feeding means are located along the feeding path. A driver means provides drive source to the charging means and the inverting means. The guiding plate blocks up the feeding path while the feeding path is empty. The charging means charges a document into the feeding path. The guiding plate is pressed out of the feeding path by the document conveyed via the charging means. Therefore, the document may be conveyed through the feeding path. While the document is conveyed to the feeding means, the guiding plate returns to block up the feeding path via elastic force thereof. | 04-30-2009 |
| 20090256883 | MAINTENANCE STATION OF AN INKJET PRINTER - A maintenance station of an inkjet printer mounted in a housing of the inkjet printer includes an ink cup rotationally and slidably coupled to the housing about/along an axis of rotation. The ink cup has a basic plate and a columnar rim around the basic plate. The columnar rim respectively defines a plurality of stopping ratchets and driving ratchets with the same gradient direction at a bottom and top thereof. A moving body is slidably disposed in the housing of the inkjet printer. An actuator movably disposed in the moving body moves together with the moving body, a tail of the actuator stretches out from the moving body for matching with the driving ratchets to rotate the ink cup. A plurality of housing ratchets are disposed in the housing of the inkjet printer and arranged into a ring for matching with the stopping ratchets to prevent the ink cup reversion. | 10-15-2009 |
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| 20100219463 | QUASI-VERTICAL STRUCTURE FOR HIGH VOLTAGE MOS DEVICE - A semiconductor device provides a high breakdown voltage and a low turn-on resistance. The device includes: a substrate; a buried n+ layer disposed in the substrate; an n-epi layer disposed over the buried n+ layer; a p-well disposed in the n-epi layer; a source n+ region disposed in the p-well and connected to a source contact on one side; a first insulation layer disposed on top of the p-well and the n-epi layer; a gate disposed on top of the first insulation layer; and a metal electrode extending from the buried n+ layer to a drain contact, wherein the metal electrode is insulated from the n-epi layer and the p-well using by a second insulation layer. | 09-02-2010 |
| 20110079846 | HIGH VOLTAGE DEVICES, SYSTEMS, AND METHODS FOR FORMING THE HIGH VOLTAGE DEVICES - A high voltage (HV) device includes a gate dielectric structure over a substrate. The gate dielectric structure has a first portion and a second portion. The first portion has a first thickness and is over a first well region of a first dopant type in the substrate. The second portion has a second thickness and is over a second well region of a second dopant type. The first thickness is larger than the second thickness. A gate electrode is disposed over the gate dielectric structure. A metallic layer is over and coupled with the gate electrode. The metallic layer extends along a direction of a channel under the gate dielectric structure. At least one source/drain (S/D) region is disposed within the first well region of the first dopant type. | 04-07-2011 |
| 20110241114 | HIGH VOLTAGE MOS TRANSISTOR - A high voltage metal-oxide-semiconductor laterally diffused device (HV LDMOS) and a method of making it are provided in this disclosure. The device includes a semiconductor substrate, a gate structure formed on the substrate, a source and a drain formed in the substrate on either side of the gate structure, a first doped well formed in the substrate, and a second doped well formed in the first well. One portion of the second well surrounds the source and the other portion of the second well extends laterally from the first portion in the first well. | 10-06-2011 |
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| 20090080062 | METHOD FOR PREPARING A POLED STRUCTURE BY USING DOUBLE-SIDED ELECTRODES - A method for preparing a poled structure by using double-sided electrodes to perform a poling process first provides a ferroelectric substrate with a first polarization direction having a top surface and a bottom surface. Fabrication processes are then performed to form an electrode structure including a first electrode and a second electrode on the top surface and a third electrode in a portion of the bottom surface between the first electrode and the second electrode. Subsequently, a poling process is performed on the electrode structure to form a plurality of inverted domains having a second polarization direction in the ferroelectric substrate, and the second polarization direction is substantially opposite to the first polarization direction. | 03-26-2009 |
| 20090080063 | ARRAY WAVEGUIDE AND LIGHT SOURCE USING THE SAME - A light source comprises a light-emitting module configured to emit a first beam and an array waveguide configured to convert the first beam into a second beam. The light-emitting module includes a plurality of light-emitting units configured to emit the first beam, and the light-emitting units are positioned in an array manner. The array waveguide includes a ferroelectric crystal with a first polarization direction, a plurality of inverted domains positioned in the ferroelectric crystal and a plurality of wavelength-converting waveguides positioned in the ferroelectric crystal. The inverted domains have a second polarization direction substantially opposite to the first polarization direction, the wavelength-converting waveguides cross the inverted domains substantially in a perpendicular manner, and the inverted domains are configured to convert the first beam from the light-emitting module into second beam as the first beams propagate through the wavelength-converting waveguides. | 03-26-2009 |
| 20090154508 | LIGHT-GENERATING APPARATUS WITH BROADBAND PUMPING LASER AND QUASI-PHASE MATCHING WAVEGUIDE - A light-generating apparatus comprises a broadband pumping laser configured to emit a broadband pumping light having a bandwidth larger than 10 nanometers and a broadband wavelength-converting device. The broadband wavelength-converting device includes a domain-inverted structure configured to convert the broadband pumping light into at least one conversion light by using at least a sum frequency generation mechanism and at least one waveguide positioned in the domain-inverted structure, and the waveguide has an input end configured to receive the broadband pumping light and an output end configured to output the conversion light. Since the light-generating apparatus uses the broadband pumping laser and the broadband wavelength-converting device, it is temperature-insensitive and speckle-free. | 06-18-2009 |
| 20100141896 | WAVELENGTH CONVERTER AND GREEN LIGHT SOURCE AND PROJECTION APPARATUS USING THE SAME - A wavelength converter includes a supporting substrate and a ferroelectric substrate, the ferroelectric substrate includes at least one waveguide facing the supporting substrate and at least one wavelength-filtering pattern positioned between the waveguide and the supporting substrate, the waveguide includes a plurality of inverted domains and non-inverted domains configured to convert an infrared light into a green light, and the infrared light emitted from the semiconductor laser enters the waveguide of the wavelength converter. For example, the wavelength-filtering pattern includes a Bragg grating. | 06-10-2010 |
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| 20100134871 | Electro-Phoretic Display and Fabricating Method thereof - In an electro-phoretic display and a fabricating method thereof, the electro-phoretic display is fabricated by the steps: forming a plurality of pixel electrodes arranged in matrix form on a first substrate; disposing a plurality of electro-phoretic displaying units including a plurality of colored charged particles, wherein each pixel electrode is corresponding to at least one of the electro-phoretic displaying units having the colored charged particles with the same color; forming a transparent electrode on a second substrate; and disposing the second substrate on the electro-phoretic displaying units to positioning the transparent electrode between the second substrate and the electro-phoretic displaying units. The electro-phoretic display can select a part of the pixel electrodes for being driven according to the color of the image being displayed, so that the electro-phoretic display may have an improved chromatic performance. | 06-03-2010 |
| 20100178832 | Methods of Fabricating Display Panel and Flexible Color Filter thereof - A method of fabricating a display panel comprises the steps of: forming a controlling elements array substrate and a flexible color filter, respectively; forming a displaying medium on the controlling elements array substrate; and assembling the flexible color filter to the controlling elements array substrate for disposing it on the displaying medium layer. A method of fabricating a flexible color filter comprises the steps of: forming a flexible substrate on a rigidly substrate; forming a color filter film comprising a plurality of color filter patterns; and separating the flexible substrate from the rigidly substrate. Since the color filter film are formed before separating the flexible substrate from the rigid substrate, the flexible color filter may have good resolution and process yield. | 07-15-2010 |
| 20100202076 | Methods of Fabricating Display Device and Felxible Color Display Medium Module thereof - A method of fabricating the flexible color display medium module includes the steps of: forming a flexible substrate on a rigidly substrate; forming a color filter film comprising a plurality of color filter patterns; forming the display medium layer on the color filter film; and separating the flexible substrate from the rigidly substrate. Since the display medium layer is immediately disposed on the color filter film, the accuracy of aligning the display medium layer and the color filter film may be improved and the parallax resulted from the light passed through the display medium layer and the color filter film may be reduced. | 08-12-2010 |
| 20100214647 | Reflective Display Apparatus - A reflective display apparatus includes a first substrate, a second substrate, a display layer and a light shielding layer. The first substrate has a driving circuit layer and the second substrate has a transparent electrode layer opposite to the driving circuit layer. The display layer is disposed between the driving circuit layer and the transparent electrode layer. The light shielding layer has a first adhering surface and a second adhering surface, wherein the first adhering surface is adhered to the display layer and the second adhering surface is adhered to the driving circuit layer. The light shielding layer can prevent the driving circuit layer from being illuminated by external light rays, and thus display quality of the reflective display apparatus is improved. | 08-26-2010 |
| 20100309136 | Wireless Operating Device and Electronic Apparatus having the same - A wireless operating device includes a display panel, a touch panel and a control module. The display panel has a display area. The touch panel corresponds to the display area. The control module includes a substrate, a processing unit and a wireless transmission unit. The substrate is electrically connected to the display panel and the touch panel. The processing unit and the wireless transmission unit are disposed on and electrically connected to the substrate. The processing unit is configured for controlling the display panel to display an operating image in the display area, and controlling the wireless transmission unit to send an operating signal according to an operation applied on the operating image. The wireless operating device utilizes the display area to display various operating images to control various electronic devices, thereby improving the compatibility of the wireless operating device. | 12-09-2010 |
| 20110050561 | Color Electrophoretic Display and Display Method Thereof - A color electrophoretic display and a display method thereof are provided. First, three primary color display data is generated according to a color image data, and whether or not to display a color image is determined. When it is determined not to display the color image, the three primary color display data is converted into gray display data according to a gray gamut look up table to display a gray picture on the electrophoretic display. When it is determined to display the color image, the color gamut of the three primary color display data is adjusted according to a color gamut look up table to display a color picture on the electrophoretic display. | 03-03-2011 |
| 20110317251 | REFLECTIVE DISPLAY APPARATUS - A reflective display apparatus includes a first substrate, a second substrate, a display layer and a light shielding layer. The first substrate has a driving circuit layer and the second substrate has a transparent electrode layer opposite to the driving circuit layer. The display layer is disposed between the driving circuit layer and the transparent electrode layer. The light shielding layer has a first adhering surface and a second adhering surface, wherein the first adhering surface is adhered to the display layer and the second adhering surface is adhered to the driving circuit layer. The light shielding layer can prevent the driving circuit layer from being illuminated by external light rays, and thus display quality of the reflective display apparatus is improved. | 12-29-2011 |
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| 20080237594 | PIXEL STRUCTURE AND MANUFACTURING METHOD THEREOF - A method of manufacturing a pixel structure is provided. A first patterned conductive layer including a gate and a data line is formed on a substrate. A gate insulating layer is formed to cover the first patterned conductive layer and a semiconductor channel layer is formed on the gate insulating layer above the gate. A second patterned conductive layer including a scan line, a common line, a source and a drain is formed on the gate insulating layer and the semiconductor channel layer. The scan line is connected to the gate and the common line is located above the data line. The source and drain are located on the semiconductor channel layer, and the source is connected to the data line. A passivation layer is formed on the substrate to cover the second patterned conductive layer. A pixel electrode connected to the drain is formed on the passivation layer. | 10-02-2008 |
| 20090168003 | PIXEL STRUCTURE AND LIQUID CRYSTAL DISPLAY HAVING THE SAME - A pixel structure including an active device and a pixel electrode is provided. The pixel electrode is electrically connected with the active device and has a plurality of alignment domains. Each of the alignment domains of the pixel electrode has one group of alignment slits parallel with one another, wherein each group of the alignment slits includes a plurality of first alignment slits with a first length and the first alignment slits are majority of each group of the alignment slits. At least one group of the alignment slits includes at least a second alignment slit with a second length longer than the first length of the first alignment slits. | 07-02-2009 |
| 20090213307 | PIXEL UNIT, LIQUID CRYSTAL DISPLAY PANEL, ELECTRO-OPTICAL APPARATUS, AND METHODS FOR MANUFACTURING THE SAME - A pixel unit having a display area is provided. The pixel unit includes a first substrate, a second substrate, a liquid crystal layer, and at least one ultraviolet light (UV) absorption pattern. The second substrate is disposed in parallel to the first substrate, and the liquid crystal layer is disposed between the first substrate and the second substrate. The UV absorption pattern is disposed between the first substrate and the second substrate. A part of the display area overlaps the UV absorption pattern to define at least one first alignment area, while the part of the display area which does not overlap the UV absorption pattern defines at least one second alignment area. The liquid crystal molecules of the liquid crystal layer present different pre-tilt angles in the first alignment area and the second alignment area. | 08-27-2009 |
| 20100133542 | PIXEL STRUCTURE AND MANUFACTURING METHOD THEREOF - A method of manufacturing a pixel structure is provided. A first patterned conductive layer including a gate and a data line is formed on a substrate. A gate insulating layer is formed to cover the first patterned conductive layer and a semiconductor channel layer is formed on the gate insulating layer above the gate. A second patterned conductive layer including a scan line, a common line, a source and a drain is formed on the gate insulating layer and the semiconductor channel layer. The scan line is connected to the gate and the common line is located above the data line. The source and drain are located on the semiconductor channel layer, and the source is connected to the data line. A passivation layer is formed on the substrate to cover the second patterned conductive layer. A pixel electrode connected to the drain is formed on the passivation layer. | 06-03-2010 |
| 20100144071 | PIXEL STRUCTURE AND MANUFACTURING METHOD THEREOF - A method of manufacturing a pixel structure is provided. A first patterned conductive layer including a gate and a data line is formed on a substrate. A gate insulating layer is formed to cover the first patterned conductive layer and a semiconductor channel layer is formed on the gate insulating layer above the gate. A second patterned conductive layer including a scan line, a common line, a source and a drain is formed on the gate insulating layer and the semiconductor channel layer. The scan line is connected to the gate and the common line is located above the data line. The source and drain are located on the semiconductor channel layer, and the source is connected to the data line. A passivation layer is formed on the substrate to cover the second patterned conductive layer. A pixel electrode connected to the drain is formed on the passivation layer. | 06-10-2010 |
| 20110212393 | METHODS FOR MANUFACTURING PIXEL UNIT, LIQUID CRYSTAL DISPLAY PANEL, AND ELECTRO-OPTICAL APPARATUS - A pixel unit having a display area is provided. The pixel unit includes a first substrate, a second substrate, a liquid crystal layer, and at least one ultraviolet light (UV) absorption pattern. The second substrate is disposed in parallel to the first substrate, and the liquid crystal layer is disposed between the first substrate and the second substrate. The UV absorption pattern is disposed between the first substrate and the second substrate. A part of the display area overlaps the UV absorption pattern to define at least one first alignment area, while the part of the display area which does not overlap the UV absorption pattern defines at least one second alignment area. The liquid crystal molecules of the liquid crystal layer present different pre-tilt angles in the first alignment area and the second alignment area. | 09-01-2011 |
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| 20090190301 | Server device - The present invention relates to a server device which comprises a case having two symmetric slots disposed on the top and a first handle disposed in each of the slots to make it easier to lift up the server device, a horizontal partition disposed in the case and dividing the inner space of the case into upper and lower parts, wherein the upper part is a first holding space capable of holding at least an electronic device, a first heat dissipation unit is disposed at the front of the electronic, the lower part of the case is a second holding space capable of holding at least a server, and a second heat dissipation unit may be disposed at one side of the second holding space, such that a plurality of servers, electronic devices and heat dissipation units may be integrated into the server device for easily and conveniently being moved. | 07-30-2009 |
| 20100085704 | Network device fixture - This invention discloses a network device including at least one rail element disposed at both sides of the network device at positions adjacent to the rear of the network device respectively to form a slide rail on each side, and two fixing elements each having a locking portion and a support portion, wherein the locking portion has at least one locking hole and is coupled perpendicularly to the support portion, such that when the network device is installed in a rack and the front of the network device is fixed to the front of the rack, each support portion can be extended into each corresponding slide rail, and each locking portion can be secured to the rear of the rack through each corresponding locking hole. | 04-08-2010 |
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| 20080239717 | LIGHT SOURCE MODULE - A light source module including a light source assembly and a light converging element is provided. The light source assembly provides an illumination beam and the light converging element is disposed on a transmission path of the illumination beam. The light converging element has a top end and a bottom end opposite to the top end. The light converging element is gradually reduced from the bottom end to the top end. The top end is opposite to the light source assembly and has a cavity. The illumination beam is incident into the light converging element from the cavity and exits the light converging element from the bottom end. The illumination beam is converged by the light converging element, so the diverging angle of the illumination beam provided by the light source module is relatively small. | 10-02-2008 |
| 20090195504 | Optical Pointing Device - An optical pointing device includes a light source, a light beam splitter, an image sensor and a lens. The light source provides an illumination light beam. The light beam splitter is disposed on a transmission path of the illumination light beam and configured for splitting the illumination light beam into a first light beam and a second light beam. The image sensor is for sensing the first and the second light beams. The lens is disposed before the image sensor. When the optical pointing device is put on a reflective surface, the first light beam is reflected to the lens by the reflective surface and then is focused on the image sensor. When the optical pointing device is put on a transparent body disposed on the reflective surface, the second light beam is reflected to the lens by the reflective surface and then is focused on the image sensor. | 08-06-2009 |
| 20090244008 | Lens Module And Optical Mouse Using The Same - In a lens module and an optical mouse using the lens module, the lens module includes a substrate, a light guide rod and a carrying base. The light guide rod is extended from the substrate along a predetermined direction and has a light incident surface. The carrying base is connected with the light incident surface and has a carrying surface for carrying a light source of the optical mouse. The substrate, the light guide rod and the carrying base are integrated into one piece. The lens module has lower cost. | 10-01-2009 |
| 20090250642 | Image Detecting Apparatus - An image detecting apparatus includes an illumination system and a sensing system. The illumination system is for providing a light beam to a working surface to generate a reflected light beam by the working surface. The sensing system includes a sensing unit and a condensing unit. The sensing unit is disposed on a transmission path of the reflected light beam reflected by the working surface for receiving the reflected light beam. The condensing unit is disposed between the sensing unit and the working surface, wherein an optical axis of the condensing unit is deviated from a main optical axis of the reflected light beam. | 10-08-2009 |
| 20090251414 | Optical Scrolling Module and Optical Control Module - An optical scrolling module includes a prism, a light source, an image sensor and a first condenser. The prism is disposed at an opening of an upper shell of a mouse and has a light incident surface, a reflective surface, a contact surface and a light emitting surface. The contact and light incident surfaces are respectively connected between the reflective and light emitting surfaces. The contact surface is exposed by the opening. A light beam from the light source is transmitted to the contact surface via the light incident and reflective surfaces. When an object with a pattern structure puts on the contact surface, the light beam is scattered and a portion of the light beam is transmitted to the image sensor via the first condenser. When the object is removed from the contact surface, the light beam is reflected to the light emitting surface by the contact surface. | 10-08-2009 |
| 20090251415 | Optical Pointing Device - An optical pointing device includes an illumination system, an imaging system and at least one diffraction element. The illumination system includes a light source for providing a light beam to a reflective surface outside the optical pointing device. The imaging system includes an image sensor disposed on a transmission path of the light beam after being reflected by the reflective surface. The at least one diffraction element is disposed in the illumination system and/or the imaging system and disposed on the transmission path of the light beam to change the transmission path of the light beam. The present optical pointing device can achieve the advantage of small volume. | 10-08-2009 |
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| 20080248142 | Method for preparing and using pest repellent on harvested plants - A method of preparing pest repellent for harvesting plants, a method of processing agricultural harvested products, a method of treating vegetable waste, a method for producing a cleansing composition for pest repellent and a cleansing composition for pest repellent are provided. The method of preparing pest repellant comprises providing plants, collecting parts of the plants, obtaining an extract from the parts of the plants, and applying the extract to the harvested plants. The method for processing agricultural harvested products comprises providing harvested agricultural products, collecting parts of the harvested agricultural products, obtaining an extract from the parts of the harvested agricultural products and applying the extract to clean the harvested agricultural products. | 10-09-2008 |
| 20090311352 | Method for removing pets from harvested vegetables - A method for removing pests from harvested vegetables has steps of extracting a first portion of harvested vegetables to obtain a vegetable cleanser, and cleaning a second portion of harvested vegetables with the vegetable cleanser, such that pests residing on the second portion of harvested vegetables are removed from the second portion of harvested vegetables, wherein the first portion of harvested vegetables and the second portion of harvested vegetables independently contain vegetables selected from the group consisting of vegetables belonging to the families of Cruciferae, Compositae, Chenopodiaceae and Amaranthaceae. The aforementioned method is effective at removing pests from harvested vegetables and satisfies urgent needs to reduce use of chemical pesticides. | 12-17-2009 |
| Patent application number | Description | Published |
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| 20110156074 | CHIP PACKAGE AND METHOD FOR FABRICATING THE SAME - The present invention provides a chip package, including: a chip having a semiconductor device thereon; a cap layer over the semiconductor device; a spacer layer between the chip and the cap layer, wherein the spacer layer surrounds the semiconductor device and forms a cavity between the chip and the cap layer; and an anti-reflective layer between the cap layer and the chip, wherein the anti-reflective layer has a overlapping region with the spacer layer and extends into the cavity. Furthermore, a method for fabricating a chip package is also provided. | 06-30-2011 |
| 20110156191 | PACKAGE STRUCTURE FOR A CHIP AND METHOD FOR FABRICATING THE SAME - The embodiment provides a package structure for a chip and a method for fabricating the same. The package structure for the chip includes a chip having a substrate and a bonding pad structure. The chip has an upper surface and a lower surface. An upper packaging layer covers the upper surface of the chip. A spacer layer is between the upper packaging layer and the chip. A conductive path is electrically connected to the bonding pad structure. An anti-reflective layer is disposed between the spacer layer and the upper packaging layer. An overlapping region is between the anti-reflective layer and the spacer layer. | 06-30-2011 |
| 20110170303 | CHIP PACKAGE AND FABRICATION METHOD THEREOF - A chip package includes a substrate having an upper, a lower, a first side, and a second side surfaces, a chip having a first and a second electrodes, a first trench extending from the upper surface toward the lower surface and from the first side surface toward an inner portion of the substrate, a first conducting layer overlying a sidewall of the first trench and electrically connecting the first electrode, which is not coplanar with the first side surface and separated from the first side surface by a first distance, a second trench extending from the upper surface toward the lower surface and from the second side surface toward the inner portion, and a second conducting layer overlying a sidewall of the second trench and electrically connecting the second electrode, which is not coplanar with the second side surface and separated from the second side surface by a second distance. | 07-14-2011 |
| Patent application number | Description | Published |
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| 20100003159 | Low-density high-toughness alloy and the fabrication method thereof - The present invention discloses a low-density high-toughness alloy and the fabrication method thereof. The alloy of the present invention consists essentially of: by weight percent, equal to or greater than 23% but lower than or equal to 33% manganese, equal to or greater than 8.1% but lower than or equal to 9.8% aluminum, equal to or greater than 3% but lower than or equal to 5.0% chromium, equal to or greater than 0.6% but lower than or equal to 1.2% carbon, equal to or greater than 0.1% but lower than or equal to 0.24% silicon and the balance of iron. The golf-club head made from the abovementioned alloy can obtain superior elongation, strength, damping capacity, and corrosion resistance even without any heat treatment, or any hot/cold working, such as forging and rolling; therefore, the fabrication cost thereof can be obviously reduced. | 01-07-2010 |
| 20110061772 | LOW-DENSITY HIGH-TOUGHNESS ALLOY AND THE FABRICATION METHOD THEREOF - The present invention discloses a low-density high-toughness alloy and the fabrication method thereof. The alloy of the present invention consists essentially of: by weight percent, equal to or greater than 23% but lower than or equal to 33% manganese, equal to or greater than 8.1% but lower than or equal to 9.8% aluminum, equal to or greater than 3% but lower than or equal to 5.0% chromium, equal to or greater than 0.6% but lower than or equal to 1.2% carbon, equal to or greater than 0.1% but lower than or equal to 0.24% silicon and the balance of iron. The golf-club head made from the abovementioned alloy can obtain superior elongation, strength, damping capacity, and corrosion resistance even without any heat treatment, or any hot/cold working, such as forging and rolling; therefore, the fabrication cost thereof can be obviously reduced. | 03-17-2011 |
