Liu, Chupei City
Ah Liu, Chupei City TW
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20120018768 | LED-BASED LIGHT EMITTING DEVICES - An LED-based light emitting device comprises: a substrate; at least one LED die mounted to the substrate; at least one bond wire that electrically connects the LED die; and a light transmissive material (silicone) encapsulating the at least one LED die and at least one bond wire. The at least one bond wire has a hook-shaped portion that loops back on itself. | 01-26-2012 |
Cheng Ping Liu, Chupei City TW
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20120279769 | RESIN COMPOSITION, AND PREPREG AND PRINTED CIRCUIT BOARD PREPARED USING THE SAME - A resin composition is provided. The resin composition comprises an epoxy resin, a hardener, and a modifier, wherein the modifier is a polymer solution obtainable from the following steps: | 11-08-2012 |
20120329912 | FUSED FILLER AND ITS MANUFACTURING METHOD AND USE - A fused filler and method for manufacturing the same are provided. The fused filler comprises about 50 wt % to about 60 wt % SiO | 12-27-2012 |
Hsing-Tang Liu, Chupei City TW
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20100155021 | Heat exchange cooling structure - A heat exchange cooling structure includes a LED module, a heat spreader plate bonded to the bottom surface of the substrate of the LED module, and an electronic ceramic cooling plate made of a nano-scale inorganic semiconductor material through a sintering process and bonded to the bottom side of the heat spreader plate for dissipating heat from the heat spreader plate by means of a thermoelectric effect produced in millions of parallel-connected and series-connected N-P interfaces in the nano-scale inorganic semiconductor material. | 06-24-2010 |
Kai-Lun Liu, Chupei City TW
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20140044973 | RESIN COMPOSITION AND USES OF THE SAME - A resin composition is provided. The resin composition comprises an epoxy resin, a zinc oxide powder and a hardener, wherein the zinc oxide powder has a Mohs hardness ranging from about 4 to about 5 and a diameter ranging from about 0.1 μm to about 50 μm, and the amount of the zinc oxide powder is more than 0.5 parts by weight and less than 10 parts by weight per 100 parts by weight of the epoxy resin. | 02-13-2014 |
Shur-Fen Liu, Chupei City TW
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20130252003 | RESIN COMPOSITION AND USES OF THE SAME - A resin composition is provided. The resin composition comprises: | 09-26-2013 |
20140255711 | RESIN COMPOSITION AND USES OF THE SAME - A resin composition is provided. The resin composition comprises: | 09-11-2014 |
Wei-Chung Liu, Chupei City TW
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20140339921 | Light Load Current Detection System - A light load current detection system including a detection process module and a control circuit is provided for detecting a current value of a light load current of a load in a light load mode; the detection process module including a power save unit and a voltage detection module. The power save unit sends a power save signal, wherein a cycle of the power save signal corresponds to a switch state. The voltage detection module detects an input voltage value to generate and output a detection signal. The control circuit includes a data table and a threshold, the data table showing a relation among the cycle, the current value and the input voltage value. The control circuit determines if the current value reaching the threshold, the switch is turned off in the light load module. | 11-20-2014 |
Wen Dar Liu, Chupei City TW
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20110212866 | WATER-RICH STRIPPING AND CLEANING FORMULATION AND METHOD FOR USING SAME - The present invention relates to water-rich formulations and the method using same, to remove bulk photoresists, post-etched and post-ashed residues, residues from Al back-end-of-the-line interconnect structures, as well as contaminations. The formulation comprises: hydroxylamine; corrosion inhibitor containing a mixture of alkyl dihydroxybenzene and hydroxyquinoline; an alkanolamine, a water-soluble solvent or the combination of the two; and at least 50% by weight of water. | 09-01-2011 |
20130296215 | WATER-RICH STRIPPING AND CLEANING FORMULATION AND METHOD FOR USING SAME - The present invention relates to water-rich formulations and the method using same, to remove bulk photoresists, post-etched and post-ashed residues, residues from Al back-end-of-the-line interconnect structures, as well as contaminations. The formulation comprises: hydroxylamine; corrosion inhibitor containing a mixture of alkyl dihydroxybenzene and hydroxyquinoline; an alkanolamine, a water-soluble solvent or the combination of the two; and at least 50% by weight of water. | 11-07-2013 |
20140109931 | Cleaning Formulations - A composition and method for removing copper-containing post-etch and/or post-ash residue from patterned microelectronic devices is described. The removal composition includes water, a water-miscible organic solvent, an amine compound, an organic acid, and a fluoride ion source. The compositions effectively remove the copper-containing post-etch residue from the microelectronic device without damaging exposed low-k dielectric and metal interconnect materials. | 04-24-2014 |