Liong
Andry Liong, Guangzhou CN
Patent application number | Description | Published |
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20140141169 | METHOD FOR PROVIDING ORGANIC RESIST ADHESION TO A COPPER OR COPPER ALLOY SURFACE - The present invention relates to a method for increasing the adhesion of organic resist materials on copper or copper alloy surfaces. The copper or copper alloy surface is contacted with an aqueous adhesion promoting solution comprising at least one organic acid, a peroxide compound and optionally one or more substances selected from the group consisting of urea, derivatives thereof and water-soluble polymers. | 05-22-2014 |
Dennis Liong, Ft. Lauderdale, FL US
Patent application number | Description | Published |
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20150112422 | Medical Device for Implantation into Luminal Structures Incorporating Corrugated Structural Elements - Expandable scaffolds or stents include circumferential elements having a corrugated pattern, which can include a plurality of linear or nonlinear segments. The corrugated pattern distributes stress more uniformly along the circumferential elements, improves radial strength of the scaffolds, reduces acute recoil after deployment, and reduces creep. The scaffolds can be made from a bioabsorbable material. | 04-23-2015 |
Jin Yoong Liong, Seremban MY
Patent application number | Description | Published |
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20160104662 | METHOD AND SYSTEM FOR EXTENDING DIE SIZE AND PACKAGED SEMICONDUCTOR DEVICES INCORPORATING THE SAME - A packaged semiconductor device includes a die flag and a plurality of lead frame fingers each having a proximate end spaced apart from the die flag. A first surface of a spacer mechanically and electrically couples to a first surface of the die flag, and a first surface of a die mechanically and electrically couples to a second surface of the spacer. At least one electrical connector electrically couples an electrical contact on a second surface of the die with a lead frame finger. A molding compound encapsulates the die, spacer, at least a portion of the at least one electrical connector, at least a portion of the die flag, and at least a portion of each lead frame finger. A width of the spacer along the second surface of the spacer is greater than a width of the die flag along the first surface of the die flag. | 04-14-2016 |
Weng Heng Liong, Singapore SG
Patent application number | Description | Published |
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20080305665 | Card connector - A card connector | 12-11-2008 |
20080305685 | Card connector - A card connector has: a connector housing | 12-11-2008 |
Yin Ling Liong, Sam Diego, CA US
Patent application number | Description | Published |
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20120311656 | APPARATUS AND METHOD OF LAYERED LICENSING - A methodology and apparatus for layered licensing is described. A licensable item is detected on a device. A legacy license associated with the licensable item is accessed, wherein the legacy license corresponds to a legacy licensing policy. A layered license associated with the licensable item is accessed, wherein the layered license corresponds to a layered licensing policy. The legacy licensing policy and the layered licensing policy are integrated into an integrated license, and the integrated license is enforced. | 12-06-2012 |