Patent application number | Description | Published |
20090175753 | METHOD AND SYSTEM FOR PRODUCING METALLIC IRON NUGGETS - Method and system for producing metallic nuggets includes providing reducible mixture of reducing material (such as carbonaceous material) and reducible iron bearing material (such as iron oxide) that may be arranged in discrete portions, such as mounds or briquettes, on at least a portion of a hearth material layer (such as carbonaceous material). A coarse overlayer of carbonaceous material may be provided over at least some of the discrete portions. Heating the reducible mixture to 1425° C. or 1400° C. or 1375° C. results in formation of an intermediate product of one or more metallic iron nuggets, which may have a sulfur content of less than 0.03%, and slag, which may have less than 5% mass MgO, which may have a ratio of percent by weight sulfur in the slag over percent by weight sulfur in the metallic nuggets of at least about 12 or at least about 15. | 07-09-2009 |
20100107818 | SYSTEM AND METHOD FOR PRODUCING METALLIC IRON NODULES - A method for producing metallic iron nodules by assembling a shielding entry system to introduce coarse carbonaceous material greater than 6 mesh in to the furnace atmosphere at location(s) where the temperature of the furnace atmosphere adjacent at least partially reduced reducible iron bearing material is between about 2200 and 2650° F. (1200 and 1450° C., the shielding entry system adapted to inhibit emission of infrared radiation from the furnace atmosphere and seal the furnace atmosphere from exterior atmosphere while introducing coarse carbonaceous material greater than 6 mesh into the furnace to be distributed over the at least partially reduced reducible iron bearing material, and heating the covered at least partially reduced reducible iron bearing material in a fusion atmosphere to assist in fusion and inhibit reoxidation of the reduced material during fusion to assist in fusion and inhibit reoxidation of the reduced material in forming metallic iron nodules. | 05-06-2010 |
20100164150 | METHOD AND SYSTEM FOR PRODUCING METALLIC IRON NUGGETS - Method and system for producing metallic nuggets includes providing reducible mixture (e.g., reducible micro-agglomerates; reducing material and reducible iron bearing material; reducible mixture including additives such as a fluxing agent; compacts, etc.) on at least a portion of a hearth material layer. In one embodiment, a plurality of channel openings extend at least partially through a layer of the reducible mixture to define a plurality of nugget forming reducible material regions. Such channel openings may be at least partially filled with nugget separation fill material (e.g., carbonaceous material). Thermally treating the layer of reducible mixture results in formation of one or more metallic iron nuggets. In other embodiments, various compositions of the reducible mixture and the formation of the reducible mixture provide one or more beneficial characteristics. | 07-01-2010 |
Patent application number | Description | Published |
20120258226 | Method and Device for Forming Cheese - An inventive solution directed to the production of pasta filata type cheese, such as mozzarella, provolone and blends thereof by concurrently and continuously pulling, stretching, cooling and molding cheese through a series of channels, preferably elongated in nature, having enclosed cavities of particular negative dimension for molding purposes. The cheese is cooled by indirect heat transfer through thermal conductive walls of the elongated channels. The cheese is allowed to set as it is formed within the cooling and molding channels. As the cheese is pulled through and out of the distal end of the elongated channels, the series of released cheese ribbons are combined and pulled through a second series of compression channels by which multiple ribbons are compressed together to form larger laminated strips ready for immediate packaging, storage or further processing. | 10-11-2012 |
20140137752 | Device For Forming Cheese - An inventive solution directed to the production of pasta filata type cheese, such as mozzarella, provolone and blends thereof by concurrently and continuously pulling, stretching, cooling and molding cheese through a series of channels, preferably elongated in nature, having enclosed cavities of particular negative dimension for molding purposes. The cheese is cooled by indirect heat transfer through thermal conductive walls of the elongated channels. The cheese is allowed to set as it is formed within the cooling and molding channels. As the cheese is pulled through and out of the distal end of the elongated channels, the series of released cheese ribbons are combined and pulled through a second series of compression channels by which multiple ribbons are compressed together to form larger laminated strips ready for immediate packaging, storage or further processing. | 05-22-2014 |
20150284180 | MODULAR INTERMODAL TRANSPORT CONTAINER, FRAME SUPPORT AND SYSTEM OF USE - The invention herein pertains to an adjustable modular intermodal container system having a size and shape that is adjustable to be adaptable to various different types of intermodal vehicles within regulatory parameters. The containers are stackable, whose shapes may be interchangeable and expandable. The containers provide multipurpose application to any variety of products contained therein. | 10-08-2015 |
20150296824 | METHOD AND DEVICE FOR PREPARING CHEESE BY OHMIC HEAT TREATMENT - An invention directed to a process and device for electrically heating and preparing pasta filata type cheeses. The ohmic heating process of this invention is introduced after separation of initial curd from whey, as heated stretching is initiated to create nascent pasta filata cheese fibers. An apparatus is devised to receive the newly formed curd mass and to provide contact of the mass with an electric coupler that channels electric current through the conductive cheese mass as it is concurrently stretched. The features of this device include an electrically charged element, a grounding element and a texturizing tool. | 10-22-2015 |
Patent application number | Description | Published |
20090172891 | METHOD AND APPARATUS FOR CLEANING OBJECTS IN AN AUTOMATIC CLEANING APPLIANCE USING AN OXIDIZING AGENT - A method and apparatus for cleaning objects in an automatic cleaning appliance is provided that includes the steps of introducing a load of objects into a wash zone of the automatic cleaning appliance, applying a wash liquor and at least one of electromagnetic, chemical and mechanical energy to the load of objects in the wash zone to remove soil from the load of objects, and subsequently applying an oxidizing agent to the load of objects through the medium of a fluid applied to the load of objects. The oxidizing agent may be generated in association with the automatic cleaning appliance. | 07-09-2009 |
20100116759 | ADJUSTABLE DISHWASHER RACK - A dishwasher includes an adjustable dishwasher rack that accommodates certain types of dishes (e.g., bowls) of varying sizes and shapes. The dishwasher rack includes a pair of parallel guide rails. A plurality of retainer assemblies ride along the guide rails. Each of the retainer assemblies has (i) a first clip positioned on the first guide rail, (ii) a second clip positioned on the second guide rail, and (iii) a retaining wire having a first end that is secured to the first clip and a second end that is secured to the second clip. | 05-13-2010 |
20160095495 | DISHWASHER - A dishwasher for treating dishes according to at least one automatic cycle of operation comprises a tub at least partially defining a treating chamber, a chassis supporting the tub and defining a space below the tub a junction box located within the space. The junction box includes a base and a cover configured to receive an electrical connection for the dishwasher. | 04-07-2016 |
Patent application number | Description | Published |
20090085209 | SEMICONDUCTOR DEVICE WITH COPPER WIREBOND SITES AND METHODS OF MAKING SAME - Semiconductor devices with external wirebond sites that include copper and methods for fabricating such semiconductor devices are disclosed. One embodiment of a method for fabricating a semiconductor device comprises forming a dielectric layer on an active side of a semiconductor substrate. The dielectric layer has openings aligned with corresponding wirebond sites at the active side of the substrate. The method further includes forming a plurality of wirebond sites located at the openings in the dielectric layer. The wirebond sites are electrically coupled to an integrated circuit in the semiconductor substrate and electrically isolated from each other. Individual wirebond sites are formed by electrolessly depositing nickel into the openings and forming a wirebond film on the nickel without forming a seam between the nickel and the dielectric layer. | 04-02-2009 |
20110183514 | STABLE ELECTROLESS FINE PITCH INTERCONNECT PLATING - A method and apparatus for plating facilitates the plating of a small contact feature of a wafer die while providing a relatively stable plating bath. The method utilizes a supplemental plating structure that is larger than a die contact that is to be plated. The supplemental plating structure may be located on the wafer, and is conductively connected to the die contact. Conductive connection between the die contact and the supplemental plating structure facilitates the plating of the die contact. The supplemental plating structure also can be used to probe test the die prior to singulation. | 07-28-2011 |
20110212578 | SEMICONDUCTOR DEVICE WITH COPPER WIREBOND SITES AND METHODS OF MAKING SAME - Semiconductor devices with external wirebond sites that include copper and methods for fabricating such semiconductor devices are disclosed. One embodiment of a method for fabricating a semiconductor device comprises forming a dielectric layer on an active side of a semiconductor substrate. The dielectric layer has openings aligned with corresponding wirebond sites at the active side of the substrate. The method further includes forming a plurality of wirebond sites located at the openings in the dielectric layer. The wirebond sites are electrically coupled to an integrated circuit in the semiconductor substrate and electrically isolated from each other. Individual wirebond sites are formed by electrolessly depositing nickel into the openings and forming a wirebond film on the nickel without forming a seam between the nickel and the dielectric layer. | 09-01-2011 |
20130003303 | MICROELECTRONIC DEVICES WITH IMPROVED HEAT DISSIPATION AND METHODS FOR COOLING MICROELECTRONIC DEVICES - Microelectronic devices with improved heat dissipation, methods of making microelectronic devices, and methods of cooling microelectronic devices are disclosed herein. In one embodiment, the microelectronic device includes a microelectronic substrate having a first surface, a second surface facing opposite from the first surface, and a plurality of active devices at least proximate to the first surface. The second surface has a plurality of heat transfer surface features that increase the surface area of the second surface. In another embodiment, an enclosure having a heat sink and a single or multi-phase thermal conductor can be positioned adjacent to the second surface to transfer heat from the active devices. | 01-03-2013 |
20140054777 | SEMICONDUCTOR DEVICE WITH COPPER WIREBOND SITES AND METHODS OF MAKING SAME - Semiconductor devices with external wirebond sites that include copper and methods for fabricating such semiconductor devices are disclosed. One embodiment of a method for fabricating a semiconductor device comprises forming a dielectric layer on an active side of a semiconductor substrate. The dielectric layer has openings aligned with corresponding wirebond sites at the active side of the substrate. The method further includes forming a plurality of wirebond sites located at the openings in the dielectric layer. The wirebond sites are electrically coupled to an integrated circuit in the semiconductor substrate and electrically isolated from each other. Individual wirebond sites are formed by electrolessly depositing nickel into the openings and forming a wirebond film on the nickel without forming a seam between the nickel and the dielectric layer. | 02-27-2014 |
Patent application number | Description | Published |
20090189784 | Physical Finite Element Model - a plurality of RFIDs is installed on aircraft or other structure. The RFIDs can query one another upon original installation and in response to predetermined event detection, and determine their relative locations within a mesh. The determined location data and other information are stored within the respect memories of the RFIDs. The stored data can be later accessed and used in analyzing damage or structural failure of the aircraft. Corrective measures are thus expedited because before-and-after structural comparisons can be readily made, with or without reference to original engineering data for the aircraft. | 07-30-2009 |
20100161095 | Repairing Composite Structures - The design for a repair of an area of a composite structure is at least partially automated. Electronic data defining the boundaries of the area is used to calculate the boundaries of a cutout in the composite structure encompassing the area. Components used to repair the area are automatically designed based on the location of the cutout. Following removal of the cutout, the repair components are installed. | 06-24-2010 |
20100274545 | Bonded Rework Simulation Tool - A method and apparatus may be present for managing rework. A section in a location of a platform having a number of composite materials needing rework may be identified to form an identified section. A layup for the number of composite materials in the identified section of the platform may be determined. A patch for the identified section of the platform and the layup for the number of composite materials may be generated. A simulation may be performed of a selected rework process and the patch in the identified section. | 10-28-2010 |
20100314029 | USER-FACILITATED MATERIAL REMOVAL IN COMPOSITE STRUCTURES - A method of removing an out-of-tolerance area in a composite structure comprises determining the location of the out-of-tolerance area and selecting a volume of the composite structure to be removed based on the location of the out-of-tolerance area. The method may further include programming a machine tool to remove the volume and to pause after removal of each one of a quantity of layers of the volume. The method may additionally include removing one of the layers using the programmed machine tool. The method may further include restoring the volume removed using the programmed area removal digital definition. | 12-16-2010 |
20100316458 | Automated Material Removal in Composite Structures - A composite structure containing an out-of-tolerance area is restored using an automated material removal method. The location of an out-of-tolerance area within the structure is determined by non-destructive inspection and a volume of the structure to be removed is selected based on the location of the out-of-tolerance area. An automatic material removal tool is programmed and used to remove the selected volume of material. The volume of removed material may be is replaced by an integrated patch. | 12-16-2010 |
20130307174 | METHOD OF REMOVING AN OUT-OF-TOLERANCE AREA IN A COMPOSITE STRUCTURE - A method of removing an out-of-tolerance area in a composite structure may comprise determining a location of the out-of-tolerance area within the composite structure, and selecting a volume of the composite structure to be removed based on the location of the out-of-tolerance area. The method may further include programming a machine tool to remove the volume and to pause after removal of each one of a quantity of layers of the volume. The method may additionally include removing one of the layers using the machine tool. | 11-21-2013 |
20150039123 | MACHINE TOOL FOR REMOVING AN OUT-OF-TOLERANCE AREA IN A COMPOSITE STRUCTURE - An apparatus for removing for removing an out-of-tolerance area in a composite structure may include a machine tool having a machine head movable along at least one axis over the composite structure. The machine tool may include at least one of a video camera and a non-destructive inspection (NDI) scanner mounted to the machine head for scanning the composite structure and locating the out-of-tolerance area. The machine tool may also include a cutting tool movable along a tool path for removing a volume containing the out-of-tolerance area. The machine tool may additionally include a controller that may be programmable with a quantity of layers of the volume for which the cutting tool is paused following removal of each one of the layers. | 02-05-2015 |
Patent application number | Description | Published |
20090056718 | Underwater breathing apparatus - A breathing apparatus for providing pressurized air to a swimmer. The breathing apparatus is based on a geometrically shaped structure that provides superior floatation characteristics in all sea conditions. The breathing apparatus includes a spherical shaped buoyant housing that is mounted above a half spherical shaped submersible housing. The buoyant housing provides a reservoir for pressurized air that is delivered to one or more swimmers by use of flexible air hoses. A battery powered air compressor and motor to produce the pressurized air is positioned within the submersible housing. An air intake for the air compressor receives air by a snorkel, the snorkel stores in a second position suitable for use as a handle while towing the apparatus on wheels. A rechargeable battery is positioned within the submersible housing to power the air compressor with cycling provided by use of a pressure switch. The rechargeable battery and air compressor operate as ballast within the submersible housing. The housings include bracket assemblies to provide handholds above and below the surface of the water. | 03-05-2009 |
20090277070 | Deep water fishing rod and electric reel - A rod and reel assembly for deep water fishing. The rod employs a structure that eliminates the need for line guides along the length of the structure by use of a swivel guide that maintains the line between two rod members. The swivel roller is placed at the distal end of the structure allowing fishing line deployed from a mounted reel to the swivel roller to pass unobstructed through the structure. Also disclosed is an electric reel that includes a cantilever spool having an enlarged interior allowing hand control of free spooling. A two stage drag system employs a first set of springs to allow hands free spooling with minimal drag and a second set of springs for proper setting for the fish hauling. | 11-12-2009 |
20110277692 | Aquaculture cage screen - A fish cage formed from a molecularly oriented single strand filament that is crossed and welded at the intersections to make a net or screen configuration. The filament being molecularly oriented by stretching ratio of about 3:1 and has a cross section of the filament being at least 2 mm | 11-17-2011 |
20110315085 | Aquaculture geodesic fish cage - Disclosed is a geodesic aquaculture fish cage formed from an injection molded composite structure having adjustable buoyancy. The composition structure is component based made and constructed from standardized structural tube members that are coupled together to form independently sealable chambers. Junction nodes interconnect with the structural tube members and are constructed and arranged to provide a standardized support platform through hole that can be capped with an access port, harvester port, feeder port, tower support, or with individual tie-down brackets. A tower with a self contained power supply can be attached for use in navigation identification, communication, and automation. | 12-29-2011 |
20120260443 | Aquaculture cage screen and cleaning apparatus - The device includes a screen cleaning brush with multiple fibers or cleaning fingers made from a flexible material with a hook and barb shape. The hook is designed to trap the screen strand as it passes and rotates on a flexible arm to clean the adjacent and opposite side of the strand and then flexes to release the strand. The instant invention has a unique propulsion system and navigation system that enables automatic navigation of the cleaning apparatus on the screen of the aquaculture cage. Alternative the screen cleaning can be performed with a frame having fins to assist in the directional placement of the cleaning fingers against a submersed screen. | 10-18-2012 |
20120260558 | Deep water fishing rod and electric reel - A rod and reel assembly for deep water fishing. The rod employs a structure that eliminates the need for line guides along the length of the structure by use of a swivel guide that maintains the line between two rod members. The swivel roller is placed at the distal end of the structure allowing fishing line deployed from a mounted reel to the swivel roller to pass unobstructed through the structure. Also disclosed is an electric reel that includes a cantilever spool having an enlarged interior allowing hand control of free spooling. A two stage drag system employs a first set of springs to allow hands free spooling with minimal drag and a second set of springs for proper setting for the fish hauling. | 10-18-2012 |
20120260861 | Fish cage screen and cleaning apparatus - The device includes a screen cleaning brush with multiple fibers or cleaning fingers made from a flexible material with a hook and barb shape. The hook is designed to trap the screen strand as it passes and rotates on a flexible arm to clean the adjacent and opposite side of the strand and then flexes to release the strand. The instant invention has a unique propulsion system and navigation system that enables automatic navigation of the cleaning apparatus on the screen of the aquaculture cage. Alternative the screen cleaning can be performed with a frame having fins to assist in the directional placement of the cleaning fingers against a submersed screen. | 10-18-2012 |
20130284104 | Aquaculture cage screen - A fish cage formed from a molecularly oriented single strand filament that is crossed and welded at the intersections to make a net or screen configuration. The filament being molecularly oriented by stretching ratio of about 3:1 and has a cross section of the filament being at least 2 mm | 10-31-2013 |
20140234573 | Molded and drawn screen - A plastic barrier screen that is molded and drawn; the screen is formed from a process that uses the speed of injection molding to form a part that can be mechanically oriented in a second operation that is equally fast. The plastic barrier screen is first formed from injection molding a part with multiple square or hexagonal holes ½ to ⅙ opening size in a uniform pattern, including longitudinal dividers between such holes of 2 to 6 times the final desired screen barrier cross sectional area of the longitudinals respectively. The molded part is then stretched along the longitudinal elements of the mold to molecularly orient at elevated temperature to produce a larger planar dimension of 2 to 6 times the original plastic screen with high strength molecularly oriented monofilament longitudinal elements. | 08-21-2014 |
Patent application number | Description | Published |
20090206488 | THROUGH SUBSTRATE ANNULAR VIA INCLUDING PLUG FILLER - A through substrate via includes an annular conductor layer at a periphery of a through substrate aperture, and a plug layer surrounded by the annular conductor layer. A method for fabricating the through substrate via includes forming a blind aperture within a substrate and successively forming and subsequently planarizing within the blind aperture a conformal conductor layer that does not fill the aperture and plug layer that does fill the aperture. The backside of the substrate may then be planarized to expose at least the planarized conformal conductor layer. | 08-20-2009 |
20090278237 | THROUGH SUBSTRATE VIA INCLUDING VARIABLE SIDEWALL PROFILE - A microelectronic structure, such as a semiconductor structure, and a method for fabricating the microelectronic structure, include an aperture within a substrate. Into the aperture is located and formed a via. The via may include a through substrate via. The aperture includes, progressing sequentially contiguously at least partially through the substrate: (1) a first comparatively wide region at a surface of the substrate; (2) a constricted region contiguous with the first comparatively wide region; (3) a second comparatively wide region contiguous with the constricted region; and (4) a tapered region contiguous with the second comparatively wide region. The structure of the aperture provides for ease in filling the aperture, as well as void isolation within the via that is filled into the aperture. | 11-12-2009 |
20100025825 | METAL ADHESION BY INDUCED SURFACE ROUGHNESS - Back side metal (BSM) delamination induced by chip dicing of silicon wafers is avoided by roughening the polished silicon surface at chip edges by etching. The Thru-Silicon-Via (TSV) structures used in 3D chip integration is masked at the back side from roughening to maintain the polished surface at the TSV structures and, thus, reliable conductivity to the BSM layer. | 02-04-2010 |
20110068477 | THROUGH SUBSTRATE VIA INCLUDING VARIABLE SIDEWALL PROFILE - A microelectronic structure, such as a semiconductor structure, and a method for fabricating the microelectronic structure, include an aperture within a substrate. Into the aperture is located and formed a via. The via may include a through substrate via. The aperture includes, progressing sequentially contiguously at least partially through the substrate: (1) a first comparatively wide region at a surface of the substrate; (2) a constricted region contiguous with the first comparatively wide region; (3) a second comparatively wide region contiguous with the constricted region; and (4) a tapered region contiguous with the second comparatively wide region. The structure of the aperture provides for ease in filling the aperture, as well as void isolation within the via that is filled into the aperture. | 03-24-2011 |
20110129996 | THROUGH SUBSTRATE ANNULAR VIA INCLUDING PLUG FILLER - A through substrate via includes an annular conductor layer at a periphery of a through substrate aperture, and a plug layer surrounded by the annular conductor layer. A method for fabricating the through substrate via includes forming a blind aperture within a substrate and successively forming and subsequently planarizing within the blind aperture a conformal conductor layer that does not fill the aperture and plug layer that does fill the aperture. The backside of the substrate may then be planarized to expose at least the planarized conformal conductor layer. | 06-02-2011 |