Patent application number | Description | Published |
20090061125 | THERMALLY AND ELECTRICALLY CONDUCTIVE STRUCTURE, METHOD OF APPLYING A CARBON COATING TO SAME, AND METHOD OF REDUCING A CONTACT RESISTANCE OF SAME - A thermally and electrically conductive structure comprises a carbon nanotube ( | 03-05-2009 |
20090076220 | UNDERFILL FORMULATION AND METHOD OF INCREASING AN ADHESION PROPERTY OF SAME - An underfill formulation includes a solvent ( | 03-19-2009 |
20090087644 | METHODS TO FABRICATE FUNCTIONALLY GRADIENT MATERIALS AND STRUCTURES FORMED THEREBY - Methods and associated structures of forming microelectronic devices are described. Those methods may include forming a first layer of functionalized nanoparticles on a substrate by immersing the substrate in at least one of a solvent and a polymer matrix, wherein at least one of the solvent and the polymer matrix comprises a plurality of functionalized nanoparticles; and forming a second layer of functionalized nanoparticles on the first layer of functionalized particles, wherein there is a gradient in a property between the first layer and the second layer. | 04-02-2009 |
20090169721 | AMPHIPHILIC BLOCK COPOLYMERS FOR IMPROVED FLUX APPLICATION - Embodiments include materials which may be used during electronic device fabrication, including a flux material. The flux material comprises a solution including a plurality of micellar structures in a solvent, the micellar structures each including a plurality of amphiphilic block copolymer elements. The amphiphilic block copolymer elements each include at least one non-polar region and at least one polar region. A fluxing agent is contained within the micellar structures. Other embodiments are described and claimed. | 07-02-2009 |
20090170247 | MAGNETIC PARTICLES FOR LOW TEMPERATURE CURE OF UNDERFILL - Electronic devices and methods for fabricating electronic devices are described. One embodiment includes a method comprising providing a first body and a second body, and electrically coupling the first body to the second body using a plurality of solder bumps, wherein a gap remains between the first body and the second body. The method also includes placing an underfill material into the gap between the first body and the second body, the underfill material comprising magnetic particles in a polymer composition. The method also includes curing the underfill material in the gap by applying a magnetic field powered by alternating current, to induce heat in the magnetic particles, wherein the heat in the magnetic particles heats the polymer composition, and the magnetic field is applied for a sufficient time to cure the polymer composition. Other embodiments are described and claimed. | 07-02-2009 |
20100035063 | Thermally and electrically conductive structure, method of applying a carbon coating to same, and method of reducing a contact resistance of same - A thermally and electrically conductive structure comprises a carbon nanotube ( | 02-11-2010 |
20110136941 | UNDERFILL FORMULATION AND METHOD OF INCREASING AN ADHESION PROPERTY OF SAME - An underfill formulation includes a solvent ( | 06-09-2011 |
20120141664 | THERMALLY AND ELECTRICALLY CONDUCTIVE STRUCTURE, METHOD OF APPLYING A CARBON COATING TO SAME, AND METHOD OF REDUCING A CONTACT RESISTANCE OF SAME - A thermally and electrically conductive structure comprises a carbon nanotube ( | 06-07-2012 |