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| 20120007784 | INVERTED-F ANTENNA AND WIRELESS COMMUNICATION APPARATUS USING THE SAME - An inverted-F antenna is disclosed including: a radiating body including a plurality of radiating portions, and some of the radiating portions located on a same plane; a shorting element extending outward from the radiating body and forming a first predetermined included angle with one of the radiating portions; a feeding element extending outward from the radiating body and forming a second predetermined included angle with one of the radiating portions; and a protrusion extending outward from the radiating body and forming a third predetermined included angle with one of the radiating portions; wherein at least one of the first, second, and third predetermined included angles is substantially a right angle. | 01-12-2012 |
| 20130069826 | SWITCHED BEAM SMART ANTENNA APPARATUS AND RELATED WIRELESS COMMUNICATION CIRCUIT - A switched beam smart antenna apparatus is disclosed including: a first, a second, a third, a fourth, a fifth, a sixth, a seventh, and an eighth beam adjusting elements; a first, a second, a third, and a fourth beam control modules; a first, a second, a third, and a fourth radiation strips positioned within an area surrounded by the first to eighth beam adjusting elements; and a radiation strip control module for selecting either the first and second radiation strips or the third and fourth radiation strips to transmit signals. When the first beam control module conducts the first and second beam adjusting elements, the third beam control module does not conduct the fifth and sixth beam adjusting elements. When the second beam control module conducts the third and fourth beam adjusting elements, the fourth beam control module does not conduct the seventh and eighth beam adjusting elements. | 03-21-2013 |
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| 20110159730 | SOFT HEAD STRUCTURE IN THE DECORATION LAMP STRING - The present invention is to provide an improvement of soft head structure in the decoration lamp string. It mainly is that the soft head is set with two groove rails on the upper and lower wall surfaces of accommodating grooves for laying the conductive wires, and the conductive copper plates in conductive wires are put in the accommodating grooves by a vertical way from the groove rails and snap-clip on the linking grooves of accommodating grooves. Therefore, the combining of conductive wires and soft head can be suitable to be operated through the automatic machinery. | 06-30-2011 |
| 20110159742 | STRUCTURE OF BULB SOCKET OF DECORATIVE LIGHT STRING - Disclosed is a structure of bulb socket of decorative light string. The socket forms an accommodation chamber for accommodating electrical wires. The accommodation chamber has top and bottom walls respectively forming opposing channels. The electrical wires have conductive plates mounted thereto and the conductive plates are insertable, in a vertical condition, through the channels into the accommodation chamber for being subsequently received and retained in retention slots formed inside the accommodation chamber. This allows the operation of assembling the socket and the electrical wires to be performed automatically with machines. | 06-30-2011 |
| 20110318954 | SOCKET STRUCTURE OF MINIATURE LIGHT BULB SET - A socket assembly is provided for a miniature light bulb set, including a socket body, a base member that receives power cords set thereon, and a holder that receives and holds a light bulb. The socket body has a bottom portion having front and rear sides forming cord cavities each of which forms a rim to form the structure for positioning and retaining the cord. The base member has left and right sidewalls each forming a retention block that projects outwards and has an increased thickness of material for forming the structure for coupling with the socket body. | 12-29-2011 |
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| 20110031594 | CONDUCTOR PACKAGE STRUCTURE AND METHOD OF THE SAME - The present invention provides a conductor package structure that comprises a conductive base. An adhesive layer is formed on the conductive base. An electronic element is formed on the adhesive layer. Conductors form a signal connection between the surface of a filling material and the bottom of the filling material, wherein the filling material is filled in the space between the electronic element and the conductors. | 02-10-2011 |
| 20110031607 | CONDUCTOR PACKAGE STRUCTURE AND METHOD OF THE SAME - The present invention provides a conductor package structure comprising a conductive base. An adhesive layer is formed on the conductive base. An electronic element is formed on the adhesive layer. Conductors are forming signal connection between the surface of a filling material and the bottom of the filling material, wherein the filling material is filled in the space between the electronic element and the conductors. | 02-10-2011 |
| 20110108977 | PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF - The present invention discloses a semiconductor device package structure with redistribution layer (RDL) and through silicon via (TSV) techniques. The package structure comprises an electronic element which includes a dielectric layer on a backside surface of the electronic element, a plurality of first conductive through vias across through the electronic element and the dielectric layer, and a plurality of conductive pads accompanying the first conductive through vias on an active surface of the electronic element; a filler material disposed adjacent to the electronic element; a first redistribution layer disposed over the dielectric layer and the filler material, and connected to the first conductive through vias; a first protective layer disposed over the active surface of the electronic element, the conductive pads, and the filler material; and a second protective layer disposed over the redistribution layer, the dielectric layer, and the filler material. | 05-12-2011 |
| 20110180891 | CONDUCTOR PACKAGE STRUCTURE AND METHOD OF THE SAME - The present invention provides a conductor package structure comprising an optical sensor element. A filling material is filled around the optical sensor element. At least one conductor element is formed through the filling material from top side to the back side for signal connection. A redistribution layer is formed on the at least one conductor element and coupled to die pad of the optical sensor element. A transparent material is formed on the redistribution layer. | 07-28-2011 |
| 20110193216 | PACKAGE STRUCTURE - The present invention discloses a semiconductor device package structure with redistribution layer (RDL) and through silicon via (TSV) techniques. The package structure comprises an electronic element which includes an dielectric layer on a backside surface of the electronic element, a plurality of first conductive through vias across through the electronic element and the dielectric layer, and a plurality of conductive pads accompanying with the first conductive through vias on an active surface of the electronic element; a filler material disposed adjacent to the electronic element; a first redistribution layer disposed over the dielectric layer and the filler material, and connected to the first conductive through vias; a first protective layer disposed over the active surface of the electronic element, the conductive pads, and the filler material; and a second protective layer disposed over the redistribution layer, the dielectric layer, and the filler material. | 08-11-2011 |
| 20110209908 | CONDUCTOR PACKAGE STRUCTURE AND METHOD OF THE SAME - The present invention provides a conductor package structure comprising a redistribution layer. An adhesive layer is formed on the redistribution layer. An electronic element is formed on the adhesive layer. Conductors are forming signal connection between the surface of a filling material and the bottom of the filling material, wherein the filling material is filled in the space between the electronic element and the conductors. | 09-01-2011 |
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| 20120178251 | METHOD OF FORMING METAL PILLAR - The disclosure relates to fabrication of to a metal pillar. An exemplary method of fabricating a semiconductor device comprises the steps of providing a substrate having a contact pad; forming a passivation layer extending over the substrate having an opening over the contact pad; forming a metal pillar over the contact pad and a portion of the passivation layer; forming a solder layer over the metal pillar; and causing sidewalls of the metal pillar to react with an organic compound to form a self-assembled monolayer or self-assembled multi-layers of the organic compound on the sidewalls of the metal pillar. | 07-12-2012 |
| 20120299181 | Package-on-Package Process for Applying Molding Compound - A method of packaging includes placing a package component over a release film, wherein solder balls on a surface of the package component are in physical contact with the release film. Next, A molding compound filled between the release film and the package component is cured, wherein during the step of curing, the solder balls remain in physical contact with the release film. | 11-29-2012 |
| 20130009307 | Forming Wafer-Level Chip Scale Package Structures with Reduced number of Seed Layers - A method includes forming a passivation layer over a metal pad, which is overlying a semiconductor substrate. A first opening is formed in the passivation layer, with a portion of the metal pad exposed through the first opening. A seed layer is formed over the passivation layer and to electrically coupled to the metal pad. The seed layer further includes a portion over the passivation layer. A first mask is formed over the seed layer, wherein the first mask has a second opening directly over at least a portion of the metal pad. A PPI is formed over the seed layer and in the second opening. A second mask is formed over the first mask, with a third opening formed in the second mask. A portion of a metal bump is formed in the third opening. After the step of forming the portion of the metal bump, the first and the second masks are removed. | 01-10-2013 |
| 20130062761 | Packaging Methods and Structures for Semiconductor Devices - Packaging methods and structures for semiconductor devices are disclosed. In one embodiment, a packaged semiconductor device includes a redistribution layer (RDL) having a first surface and a second surface opposite the first surface. At least one integrated circuit is coupled to the first surface of the RDL, and a plurality of metal bumps is coupled to the second surface of the RDL. A molding compound is disposed over the at least one integrated circuit and the first surface of the RDL. | 03-14-2013 |
| 20130099371 | SEMICONDUCTOR PACKAGE HAVING SOLDER JOINTED REGION WITH CONTROLLED AG CONTENT - A semiconductor package includes a workpiece with a conductive trace and a chip with a conductive pillar. The chip is attached to the workpiece and a solder joint region is formed between the conductive pillar and the conductive trace. The silver (Ag) content in the solder layer is between 0.5 and 1.8 weight percent. | 04-25-2013 |
| 20130099385 | Packages and Methods for Forming the Same - A device includes a package component having conductive features on a top surface, and a polymer region molded over the top surface of the first package component. A plurality of openings extends from a top surface of the polymer region into the polymer region, wherein each of the conductive features is exposed through one of the plurality of openings. The plurality of openings includes a first opening having a first horizontal size, and a second opening having a second horizontal size different from the first horizontal size. | 04-25-2013 |
| 20130115735 | Apparatus and Methods for Molded Underfills in Flip Chip Packaging - Methods and apparatus for a forming molded underfills. A method is disclosed including loading a flip chip substrate into a selected one of the upper mold chase and lower mold chase of a mold press at a first temperature; positioning a molded underfill material in the at least one of the upper and lower mold chases while maintaining the first temperature which is lower than a melting temperature of the molded underfill material; forming a sealed mold cavity and creating a vacuum in the mold cavity; raising the temperature of the molded underfill material to a second temperature greater than the melting point to cause the molded underfill material to flow over the flip chip substrate forming an underfill layer and forming an overmolded layer; and cooling the flip chip substrate to a third temperature substantially lower than the melting temperature of the molded underfill material. An apparatus is disclosed. | 05-09-2013 |
| 20130122652 | Methods for Performing Reflow in Bonding Processes - A method includes placing a cover over a lower package component, wherein the cover comprises an opening aligned to the lower package component. An upper package component is placed over the lower package component. The upper package component is aligned to the opening, and a solder region is dispose between the upper package component and the lower package component. The cover and the upper package component are exposed to a radiation to reflow the solder region. | 05-16-2013 |
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| 20110009926 | Nerve-Stimulating And Signal-Monitoring Device And Method Of Manufacturing The Same And Nerve-Stimulating And Signal-Monitoring System - A nerve-stimulating and signal-monitoring device includes a flexible substrate, a modulation/demodulation module, a SOC unit and a plurality of stimulation probes. The modulation/demodulation module demodulates coded nerve-stimulating radio-frequency signals or modulates sending coded epidermal nerve response signals. The SOC unit and the modulation/demodulation module can be integrally packaged and bonded on the flexible substrate. The SOC unit decodes and transforms the coded nerve-stimulating radio-frequency signals to obtain nerve-stimulating electrical probe-driving signals. The stimulation probes protrude from the flexible substrate, are configured to transmit the nerve-stimulating electrical probe-driving signals to epidermal nerves, and are electrically coupled to the SOC unit. The SOC unit can receive, amplify, analyze, classify and encode epidermal nerve response signals sent to the modulation/demodulation module for modulating, and such coded epidermal nerve response signals are subsequently transmitted by an antenna to the monitor station for decoding, monitoring and analysis. | 01-13-2011 |
| 20110100123 | Thermal Bubble Type Angular Accelerometer - An RFID, Bluetooth as well as zigbee based thermal bubble type angular accelerometer includes a flexible substrate, a base layer, at least one cavity, and at least one sensing assembly. The base layer is formed on the flexible substrate. The at least one cavity is formed on the base layer. The at least one sensing assembly is suspended over the at least one cavity. The sensing assembly comprises a heater and two temperature sensing elements, wherein the two temperature sensing elements are substantially symmetrically disposed on opposite sides of the heater, and the heaters and the two temperature sensing elements extend in a radial direction. | 05-05-2011 |
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| 20130048941 | SOLID STATE LIGHT EMITTING SEMICONDUCTOR STRUCTURE AND EPITAXY GROWTH METHOD THEREOF - A solid state light emitting semiconductor structure and an epitaxy growth method thereof are provided. The method includes the following steps: A substrate is provided. A plurality of protrusions separated from each other are formed on the substrate. A buffer layer is formed on the protrusions, and fills or partially fills the gaps between the protrusions. A semiconductor epitaxy stacking layer is formed on the buffer layer, wherein the semiconductor epitaxy stacking layer is constituted by a first type semiconductor layer, an active layer and a second type semiconductor layer in sequence. | 02-28-2013 |
| 20130062634 | SOLID STATE LIGHT SOURCE MODULE AND ARRAY THEREOF - A solid state light source array including a transparent substrate and N rows of solid state light emitting element series is provided. Each row of the solid state light emitting element series includes M solid state light emitting elements connected in series, wherein N, M are integrals and N≧1, M≧2. Each of the solid state emitting elements includes a first type electrode pad and a second type electrode pad. The first and the M | 03-14-2013 |
| 20130095591 | MANUFACTURING METHOD OF SOLID STATE LIGHT EMITTING ELEMENT - A manufacturing method of a solid state light emitting element is provided. A plurality of protrusion structures separated to each other are formed on a first substrate. A buffer layer is formed on the protrusion structures and fills the gaps between protrusion structures. An epitaxial growth layer is formed on the buffer layer to form a first semiconductor stacking structure. The first semiconductor stacking structure is inverted to a second substrate, so that the first semiconductor epitaxial layer and the second substrate are connected to form a second semiconductor stacking structure. The buffer layer is etched by a first etchant solution to form a third semiconductor stacking structure. A second etchant solution is used to permeate through the gaps between the protrusion structures, so that the protrusion structures are etched completely. The first substrate is removed from the third semiconductor stacking structure to form a fourth semiconductor stacking structure. | 04-18-2013 |
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| 20110291200 | INTEGRATED CIRCUITS AND MANUFACTURING METHODS THEREOF - An integrated circuit includes a first diffusion area for a first type transistor. The first type transistor includes a first drain region and a first source region. A second diffusion area for a second type transistor is separated from the first diffusion area. The second type transistor includes a second drain region and a second source region. A gate electrode continuously extends across the first diffusion area and the second diffusion area in a routing direction. A first metallic structure is electrically coupled with the first source region. A second metallic structure is electrically coupled with the second drain region. A third metallic structure is disposed over and electrically coupled with the first and second metallic structures. A width of the first metallic structure is substantially equal to or larger than a width of the third metallic structure. | 12-01-2011 |
| 20120240088 | SYSTEMS AND METHODS OF DESIGNING INTEGRATED CIRCUITS - A method of designing an integrated circuit includes defining at least one dummy layer covering at least one of a portion of a first metallic layer and a portion of a second metallic layer of an integrated circuit. The second metallic layer is disposed over the first metallic layer. The first metallic layer, the second metallic layer and a gate electrode of the integrated circuit have a same routing direction. A logical operation is performed to a file corresponding to the at least one of the portion of the first metallic layer and the portion of the second metallic layer covered by the dummy layer so as to size at least one of the portion of the first metallic layer and the portion of the second metallic layer. | 09-20-2012 |
| 20120280287 | Integrated Circuit Layouts with Power Rails under Bottom Metal Layer - A circuit includes a semiconductor substrate; a bottom metal layer over the semiconductor substrate, wherein no additional metal layer is between the semiconductor substrate and the bottom metal layer; and a cell including a plug-level power rail under the bottom metal layer. | 11-08-2012 |
| 20120313256 | Non-Hierarchical Metal Layers for Integrated Circuits - An integrated circuit structure includes a semiconductor substrate, and a first metal layer over the semiconductor substrate. The first metal layer has a first minimum pitch. A second metal layer is over the first metal layer. The second metal layer has a second minimum pitch smaller than the first minimum pitch. | 12-13-2012 |
| 20120331426 | CELL ARCHITECTURE AND METHOD - A method includes selecting a cell stored in a non-transient computer readable storage medium, arranging a plurality of the cells on a model of a semiconductor device, and creating a mask for the semiconductor device based on the model of the semiconductor device. The cell is designed according to a design rule in which a first power-supply-connection via satisfies a criterion from the group consisting of: i) the first power-supply-connection via is spaced apart from a second power-supply-connection via by a distance that is greater than a threshold distance such that the cell can be fabricated by a single-photolithography single-etch process, or ii) the first power-supply-connection via is coupled to first and second substantially parallel conductive lines that extend along directly adjacent tracks. | 12-27-2012 |
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| 20110273949 | ELECTRICAL FUSE PROGRAMMING TIME CONTROL SCHEME - A circuit includes a fuse and a sensing and control circuit. The fuse is coupled between a MOS transistor and a current source node. The sensing and control circuit is configured to receive a programming pulse and output a modified programming signal to the gate of the MOS transistor for programming the fuse. The modified programming signal has a pulse width based on a magnitude of a current through the first fuse. | 11-10-2011 |
| 20120020177 | ELECTRICAL FUSE MEMORY - Some embodiments regard a memory array that has a plurality of rows and columns. A column includes a program control device, a plurality of eFuse memory cells in the column, a sense amplifier, and a bit line coupling the program control device, the plurality of memory cells in the column, and the sense amplifier. A row includes a plurality of eFuse memory cells in the row, a word line coupling the plurality of eFuse memory cells in the row, and a footer configured as a current path for the plurality of eFuse memory cells in the row. | 01-26-2012 |
| 20120038410 | CIRCUIT AND METHOD FOR CHARACTERIZING THE PERFORMANCE OF A SENSE AMPLIFIER - An integrated circuit includes a sensing circuit, a fuse box, and a fuse bus decoder. The sensing circuit includes an output node, and the fuse box includes a plurality of switches coupled in series with a plurality of resistive elements. The fuse box is coupled to the output node of the sensing circuit from which the fuse box is configured to receive a current. The fuse bus decoder is coupled to the fuse box and includes at least one demultiplexer configured to receive a signal and in response output a plurality of control signals for selectively opening and closing the switches of the fuse box to adjust a resistance across the fuse box. A voltage of the output node of the sense amplifier is based on a resistance the fuse box and the current. | 02-16-2012 |
| 20120057423 | ELECTRICAL FUSE MEMORY ARRAYS - Some embodiments regard a memory array that has a plurality of eFuse memory cells arranged in rows and columns, a plurality of bit lines, and a plurality of word lines. A column includes a bit line selector, a bit line coupled to the bit line selector, and a plurality of eFuse memory cells. An eFuse memory cell of the column includes a PMOS transistor and an eFuse. A drain of the PMOS transistor is coupled to a first end of the eFuse. A gate of the PMOS transistor is coupled to a word line. A source of the PMOS transistor is coupled to the bit line of the column. | 03-08-2012 |
| 20120086495 | VOLTAGE LEVEL SHIFTER - An input of a first inverter is configured to serve as an input node. An output of the first inverter is coupled to an input of a second inverter. An output of the second inverter is configured to serve as an output node. An input of a third inverter is coupled to an input of the first inverter. A gate of a first NMOS transistor is coupled to an output of the third inverter. A drain of the first NMOS transistor is coupled to the second inverter. A source of the first NMOS transistor is configured to serve as a level input node. When the input node is configured to receive a low logic level, the output node is configured to receive a voltage level provided by a voltage level at the level input node. | 04-12-2012 |
| 20120212993 | ONE TIME PROGRAMMING BIT CELL - A one time programming (OTP) memory cell includes a first transistor and a second transistor. The first transistor has a first drain, a first source, a first gate, and a first normal operational voltage value higher that a second normal operational voltage value of the second transistor. The second transistor has a second drain, a second source, and a second gate. The first source is coupled to the second drain. The second source is configured to detect data stored in the OTP memory cell. | 08-23-2012 |
| 20120257435 | NON-SALICIDE POLYSILICON FUSE - The embodiments of methods and structures disclosed herein provide mechanisms of forming and programming a non-salicided polysilicon fuse. The non-salicided polysilicon fuse and a programming transistor form a one-time programmable (OTP) memory cell, which can be programmed with a low programming voltage. | 10-11-2012 |
| 20130038375 | VOLTAGE LEVEL SHIFTER - A circuit includes a power switch and a level shifter. The level shifter has a node and an assistant circuit. The node is configured to control the power switch. The assistant circuitry is coupled to the node and configured for the node to receive a first voltage value through the assistant circuit. The first voltage value is different from a second voltage value of an input signal received by the level shifter. | 02-14-2013 |
| 20130039117 | ELECTRICAL FUSE BIT CELL - An electrical fuse (eFuse) bit cell includes a program transistor, a read transistor, and an eFuse. The program transistor has a first program terminal, a second program terminal, and a third program terminal. The read transistor has a first read terminal, a second read terminal, and a third read terminal. The eFuse has a first end and a second end. The first end, the first program terminal, and the second read terminal are coupled together. The read transistor is configured to be off and the program transistor is configured to be on when the eFuse bit cell is in a program mode. The program transistor is configured to be off and the read transistor is configured to be on when the eFuse bit cell is in a read mode. | 02-14-2013 |
| 20130100756 | ELECTRICAL FUSE MEMORY ARRAYS - A mechanism of reconfiguring an eFuse memory array to have two or more neighboring eFuse bit cells placed side by and side and sharing a program bit line. By allowing two or more neighboring eFuse bit cells to share a program bit line, the length of the program bit line is shortened, which results in lower resistivity of the program bit line. The width of the program bit line may also be increased to further reduce the resisivity of program bit line. Program bit lines with low resistance and high current are needed for advanced eFuse memory arrays using low-resistivity eFuses. | 04-25-2013 |
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| 20120126368 | Semiconductor Package - The invention provides a semiconductor package. The semiconductor package includes a substrate. A first passivation layer is disposed on the substrate. An under bump metallurgy layer is disposed on the first passivation layer. A passive device is disposed on the under bump metallurgy layer | 05-24-2012 |
| 20120267779 | SEMICONDUCTOR PACKAGE - The invention provides a semiconductor package. The semiconductor package includes a semiconductor die having a central area and a peripheral area surrounding the central area. A first conductive bump is disposed on the semiconductor die in the central area. A second conductive bump is disposed on the semiconductor die in the peripheral area. An area ratio of the first conductive bump to the second conductive bump from a top view is larger than 1, and less than or equal to 3. | 10-25-2012 |
| 20130087911 | INTEGRATED CIRCUIT PACKAGE STRUCTURE - An integrated circuit (IC) package structure is provided, including: a first integrated circuit (IC) package, including: a first package substrate, having opposite first and second surfaces, wherein a first semiconductor chip is disposed over a first portion of the first surface of the first package substrate. In addition, a second integrated circuit (IC) package is disposed on a second portion different from the first portion of the first surface of the first package substrate, including: a second package substrate, having opposite third and fourth surfaces, wherein a second semiconductor chip is disposed over a portion of the third surface of the second package substrate, and the second semiconductor chip has a function different from that of the first semiconductor chip. | 04-11-2013 |
