Lim, TW
Ai-Hwa Lim, New Taipei City TW
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20150121693 | MANUFACTURING METHOD FOR MULTI-LAYER CIRCUIT BOARD - A manufacturing method for a multi-layer circuit board includes the following steps. Firstly, two core layers are compressed to form a substrate having two surfaces opposite to each other. Then, a via connecting the surfaces is formed. A patterned circuit layer including a concentric-circle pattern is then formed on each surface by using the via as an alignment target. Next, a first stacking layer is formed on each surface. Then, a first through hole penetrating regions of the first stacking layer and the substrate where a first concentric circle from the center of the concentric-circle pattern is orthogonally projected thereon is formed. A second stacking layer is then formed on each first stacking layer. Afterward, a second through hole penetrating regions of the first, the second stacking layers and the substrate where a second concentric circle from the center of the concentric-circle pattern is orthogonally projected thereon is formed. | 05-07-2015 |
Chang Huat Lim, New Taipei City TW
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20150241911 | WEARABLE ELECTRONIC DEVICE - A wearable electronic device includes an electronic assembly and at least one detachable power supply strap. The electronic assembly includes a first main body, a circuit module, a first buckling device and a first connector. The circuit module is disposed inside the first main body. The first buckling device and the first connector are disposed outside the first main body. The first connector is electrically connected with the circuit module. The power supply strap mounted to one end of the electronic assembly includes a second main body, a second battery module disposed inside the second main body, a second connector and a second buckling device matchable with the first buckling device. The second connector and the second buckling device are disposed to one end of the second main body. The second connector is electrically connected with the second battery module and is connected with the first connector. | 08-27-2015 |
20150277742 | WEARABLE ELECTRONIC DEVICE - A wearable electronic device includes an electronic assembly, and a rollable strap body connected with the electronic assembly. The electronic assembly includes a display screen, a touch sensing panel disposed on the display screen, and a processor disposed in the electronic assembly and electrically connected with the touch sensing panel. The display screen includes a display area for displaying a user interface. The touch sensing panel includes a one-dimensional horizontal instruction touch area for sensing horizontal moving signals, a one-dimensional longitudinal instruction touch area for sensing longitudinal moving signals, and a normally open instruction touch area for sensing clicking signals. The processor receives the horizontal moving signals, the longitudinal moving signals and the clicking signals for operating the user interface. | 10-01-2015 |
Chung-Dial Lim, Taipei City TW
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20160058649 | REHABILITATION DEVICE WITH PACE PATTERN PROJECTING FUNCTION AND SEAT STRUCTURE AND CONTROL METHOD THEREOF - A rehabilitation device with pace pattern projecting function and seat structure and a control method thereof are provided. The rehabilitation device includes a body with a moving module, a projection device, a first sensor and a control system. The projection device projects pace patterns on a walking plane. The first sensor detects a walking situation of a user on the walking plane. Based on the walking situation detected by the first sensor, the control system adjusts a distance between the rehabilitation device and the user by controlling the moving module and adjusts a position of the pace patterns on the walking plane by controlling the projection device. Moreover, a movable seat mechanism is also disposed on the rear of the rehabilitation device. The user can sit down on the movable seat mechanism and towards the front of the rehabilitation device to rest moderately. | 03-03-2016 |
Donna Lim, New Taipei City TW
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20110307720 | COMPUTER SYSTEM AND POWER MANAGEMENT METHOD THEREOF - A computer system and a power-management method thereof are provided. The computer system has an image-reading mode, a first power-management mode and a second power-management mode, and the computer system operating in the second power-management mode consumes less power than it consumes in the first power-management mode. The computer system comprises a first portion comprising a graphics processing unit, a memory space and a display; and a second portion comprising a storage storing an image data. When the computer system operates in the image-reading mode, the image data has been transferred to the memory space from the storage, the second portion enters to the second power-management mode from the first power-management mode, and the first portion keeps in the first power-management mode, so that the graphics processing unit can display an image by the display according to the image data stored in the memory space. | 12-15-2011 |
20120137038 | ELECTRONIC SYSTEMS SUPPORTING MULTIPLE OPERATION MODES AND OPEARATION METHODS THEREOF - Electronic systems supporting multiple operation modes are provided, wherein the electronic system includes a portable device and a docking system. The portable device at least includes one processing unit and a first operation module, wherein the processing unit includes a plurality of operation frequencies and is operable in a plurality of operation modes, and each operation mode corresponds to an operation frequency. The docking system includes a container for containing the portable device and a second operation module. When the portable device is plugged into the container of the docking system, the portable device receives a signal from the docking system, determines an operation mode of the portable device according to the received signal, adjusts the operation frequency of the processing unit corresponding to the operation mode and selectively applies the first modules or second modules to control the electronic system. | 05-31-2012 |
Eng-Lun Lim, Taichung City TW
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20130266753 | RUBBER PAD CAPABLE OF REPEATED WASHING AND PEELING - A rubber pad capable of repeated washing and peeling includes a substrate, made of a sheet of certain thickness and area and defined into a first and a second side surface. An inertia adhesive layer is incorporated onto the first side surface to form an inertia bonding surface. The inertia bonding surface can be repeatedly peeled-off without residual colloid, and the temperature resistance range is between −20° C. and 120° C. An adhesion layer; incorporated onto the second side surface is made of glue of high adhesive capacity to form an adhesion surface. The adhesion surface is adhered securely at one time without repeated peeling-off. At least a debonding layer is attached onto at least the adhesion surface or inertia bonding surface in a peeling-off state. | 10-10-2013 |
Hoe-Hong Lim, Miaoli County TW
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20150262677 | DATA STORING METHOD, MEMORY CONTROL CIRCUIT UNIT AND MEMORY STORAGE APPARATUS - A data writing method, and a memory control circuit unit and a memory storage apparatus using the method are provided. The method including: programming data to several memory cells on a first word line of the rewritable non-volatile memory module of the memory storage apparatus, and a first predetermined reading voltage is initially configured for the first word line. The data storing method further includes: adjusting the first predetermined reading voltage to obtain a first available reading voltage for the first word line, and applying the first available reading voltage to the first word line to read first page data. The storing method further includes: if the difference value between the first available reading voltage and the first predetermined reading voltage is larger than a predetermined threshold value, performing a protection operation for the first page data. | 09-17-2015 |
Huoy-Bing Lim, Taipei County TW
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20090028228 | SIGNAL STRENGTH ESTIMATION SYSTEM AND METHOD - A signal strength estimation circuit for a code division multiple access system comprises a channel compensator, a demodulator, an extractor and an average circuit. The channel compensator compensates different channel effect upon a received signal and outputs first and second compensated signals wherein the received signal comprises a first signal and a second signal. The demodulator electrically connected to the channel compensator demodulates the first and second compensated signals and outputs first and second demodulated signals wherein the demodulator demodulates the first and second compensated signals by corresponding 4 bits pilot patterns when each of the first and second compensated signals only has 2 pilot bits in a slot and the second signal is obtained by space time transmit diversity encoding the first signal. The extractor coupled to the demodulator respectively extracts first and second pilot signals from the first and second demodulated signals. The average circuit coupled to the extractor averages the first and second pilot signals, thereby obtaining a signal strength estimation. | 01-29-2009 |
Kian-Long Lim, Hsinchu City TW
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20120261726 | DIVOT ENGINEERING FOR ENHANCED DEVICE PERFORMANCE - An integrated circuit device and method for manufacturing the same are disclosed. An exemplary device includes a semiconductor substrate having a substrate surface; a trench isolation structure disposed in the semiconductor substrate, the trench isolation structure having a trench isolation structure surface that is substantially planar to the substrate surface; and a gate feature disposed over the semiconductor substrate, wherein the gate feature includes a portion that extends from the substrate surface to a depth in the trench isolation structure, the portion being defined by a trench isolation structure sidewall and a semiconductor substrate sidewall, such that the portion tapers from a first width at the substrate surface to a second width at the depth, the first width being greater than the second width. | 10-18-2012 |
Min-Tak Lim, Seoul TW
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20090094562 | MENU DISPLAY METHOD FOR A MOBILE COMMUNICATION TERMINAL - A mobile terminal comprising a display module to display a tag and to display a menu screen image related to the tag at one portion of a background image as the tag is dragged, the menu screen image being displayed according to a dragging direction and a dragging distance; an input unit to detect a touch input with respect to the display module or the tag to determine the dragging direction and the dragging distance; and a controller to expose or hide the menu screen image according to the dragging direction the dragging distance of the inputted touch. | 04-09-2009 |
Peng-Soon Lim, Johor TW
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20140004694 | METAL GATE ELECTRODE OF A FIELD EFFECT TRANSISTOR | 01-02-2014 |
Peng-Soon Lim, Kluang TW
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20100081262 | METHOD FOR FORMING METAL GATES IN A GATE LAST PROCESS - The present disclosure provides a method of fabricating a semiconductor device that includes providing a substrate having a first region and a second region, forming first and second gate stacks in the first and second regions, respectively, the first gate stack including a first dummy gate and the second gate stack including a second dummy gate, removing the first dummy gate in the first gate stack thereby forming a first trench and removing the second dummy gate in the second gate stack thereby forming a second trench, forming a first metal layer in the first trench and in the second trench, removing at least a portion of the first metal layer in the first trench, forming a second metal layer in the remainder of the first trench and in the remainder of the second trench, reflowing the second metal layer, and performing a chemical mechanical polishing (CMP). | 04-01-2010 |
20120217578 | METHOD AND SYSTEM FOR METAL GATE FORMATION WITH WIDER METAL GATE FILL MARGIN - A method includes providing a semiconductor substrate having a gate trench and depositing a metal layer, using a physical vapor deposition (PVD) process, over the substrate to partially fill the trench. The metal layer includes a bottom portion and a sidewall portion that is thinner than the bottom portion. The method also includes forming a coating layer on the metal layer, etching back the coating layer such that a portion of the coating layer protects a portion of the metal layer within the trench, and removing the unprotected portion of the metal layer. A different aspect involves a semiconductor device that includes a gate that includes a trench having a top surface, and a metal layer formed over the trench, wherein the metal layer includes a sidewall portion and a bottom portion, and wherein the sidewall portion is thinner than the bottom portion. | 08-30-2012 |
Seng-Woon Lim, Kwei Shan Township TW
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20110094897 | Hydrogen Storage Device - A hydrogen storage device includes a first casing and a second casing. A hydrogen storage material is disposed in a receiving space formed inside the first casing. The second casing encloses the first casing such that the first and second casings jointly form an outer flow channel structure. Furthermore, the first casing has a surface extended inward of the first casing to form a recess. By disposing a baffle inside the recess, a curved inner flow channel structure is formed in the recess of the first casing. With this simple structure, a heat exchange substance can exchange heat with the hydrogen storage material, which is disposed inside the receiving space, via both the outer flow channel structure and the curved inner flow channel structure. Therefore, the heat exchange rate can be increased to accelerate the storage and release of hydrogen. | 04-28-2011 |
20110192732 | HYDROGEN STORAGE DEVICE - The present invention discloses a hydrogen storage device. The hydrogen storage device includes a first casing, at least one hydrogen container, at least one stress buffering unit, and a second casing. The hydrogen container is set inside the first casing. The stress buffering unit is set between the hydrogen container and the first casing. The second casing surrounds the first casing forming a second space to contain heat transfer media, thereby controlling the temperature of the hydrogen container. While the hydrogen storage materials loaded in the hydrogen container absorb hydrogen gas, the stress buffering unit can eliminate the stress caused by the volume expansion of the hydrogen storage materials so as to prevent the first casing from distortion and deformation. Thus, the hydrogen gas can be stored efficiently and safely. | 08-11-2011 |
Seng-Woon Lim, Taipei TW
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20100196775 | Heat Recycling System of Fuel Cells - A heat recycling system of fuel cells is provided. The heat recycling system includes: a fuel cell apparatus, a cooling tank, an adsorption refrigerating apparatus, a first set of valve, and a second set of valve. The adsorption refrigerating apparatus has a first adsorption bed, a second adsorption bed, a first evaporator/condenser, and a second evaporator/condenser. The first set of valve connects the fuel cell apparatus and the cooling tank to the first adsorption bed and the second adsorption bed. The second set of valve connects the first evaporator/condenser and the second evaporator/condenser to the cooling tank. Switching of the first and the second sets of valve is controlled by an automatic control system communicating between the fuel cell apparatus, the cooling tank, and the adsorption refrigerating apparatus. Thus, waste heat generated by the fuel cell apparatus is timely brought away, recycled, and reused by the adsorption refrigerating apparatus. | 08-05-2010 |
20100310962 | FUEL CELL STACK WITH TRANSPARENT FLOW PATHWAYS AND BIPOLAR PLATES THEREOF - A fuel cell stack with transparent flow pathways and bipolar plates thereof are provided. The fuel cell stack includes at least one membrane electrode assembly (MEA) and at least one pair of bipolar plates. Each bipolar plate includes a transparent flowing path plate and a current collector. Each MEA is interposed between two corresponding bipolar plates so that power generated by each MEA is transmitted through the current collectors disposed respectively on margins of adjacent ones of the transparent flowing path plates. The transparent flowing path plates allow the production of liquid water in the fuel cell stack to be monitored in real time from outside the fuel cell stack, so as to prevent flow pathways of the transparent flowing path plates from being blocked and thereby maintain the efficiency of power generation of the fuel cell stack. | 12-09-2010 |
Su-I Lim, New Taipei City TW
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20140105678 | COUPLER - A coupler includes a first hollow sleeve, a plurality of tapered clamps and a second hollow sleeve. The first hollow sleeve is formed with a first inner threaded portion on the inner face of one end while the other end thereof a tapered face. The diameter of tapered face increases toward the first inner threaded portion. The outer face of each tapered clamp is formed with a second tapered face, which contacts the first tapered face. The inner face of each tapered clamp has a plurality of teeth conforming to one end portion of the first bar. One end of the second hollow sleeve is formed with a first outer threaded portion and the first outer threaded portion conforms to the first inner threaded portion. The second hollow sleeve is formed with a second inner threaded portion, which matches a second outer threaded portion of the second bar. | 04-17-2014 |
Sung-Mook Lim, Kaohsiung TW
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20150035127 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME - The present disclosure relates to a semiconductor package and a method of fabricating the same. The semiconductor package includes a substrate, a grounding layer, a chip, a package body, and a shielding layer. The substrate includes a lateral surface and a bottom surface. The grounding layer is buried in the substrate and extends horizontally in the substrate. The chip is arranged on the substrate. The package body envelops the chip and includes a lateral surface. The shielding layer covers the lateral surface of the package body and the lateral surface of the substrate, and is electrically connected to the grounding layer, where a bottom surface of the shielding layer is separated from a bottom surface of the substrate. | 02-05-2015 |
Won-Seok Lim, New Taipei City TW
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20140118054 | SWITCH CONTROL CIRCUIT AND POWER SUPPLY DEVICE INCLUDING THE SAME - The present invention relates to a switch control circuit that controls a switching operation of a power switch circuit that includes cascode-coupled first and second transistors. A switch control circuit includes a first zener diode coupled between a gate of the first transistor and a first end of a capacitor supplying a power voltage and a second zener diode coupled to a gate and a source of the first transistor, and a first resistor coupled between the first zener diode and the second zener diode. | 05-01-2014 |
Wooi Kip Lim, Hsin-Chu City TW
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20150214899 | AMPLIFYING CIRCUIT AND TOUCH CONTROL SENSING SYSTEM - An amplifying circuit, which comprises: an amplifier, comprising a signal input terminal and a signal output terminal; a first current sinking module, for sinking a third current from the signal input terminal; and a noise sensing module, for sensing a output voltage level at the signal output terminal, for controlling the first current sinking module to sink the third current from the signal input terminal if the output voltage level is larger than a first high threshold value, and for controlling the first current sinking module not to sink the third current if the output voltage level is smaller than the first high threshold value. | 07-30-2015 |
Zheng-Yi Lim, Hsin-Chu City TW
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20130334692 | Bonding Package components Through Plating - A method includes aligning a first electrical connector of a first package component to a second electrical connector of a second package component. With the first electrical connector aligned to the second electrical connector, a metal layer is plated on the first and the second electrical connectors. The metal layer bonds the first electrical connector to the second electrical connector. | 12-19-2013 |
Zheng-Yi Lim, Hsin-Chu TW
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20120018878 | Doping Minor Elements into Metal Bumps - A method of forming a device includes providing a substrate, and forming a solder bump over the substrate. A minor element is introduced to a region adjacent a top surface of the solder bump. A re-flow process is then performed to the solder bump to drive the minor element into the solder bump. | 01-26-2012 |
20120286423 | Doping Minor Elements into Metal Bumps - A method of forming a device includes providing a substrate, and forming a solder bump over the substrate. A minor element is introduced to a region adjacent a top surface of the solder bump. A re-flow process is then performed to the solder bump to drive the minor element into the solder bump. | 11-15-2012 |
20120322255 | Metal Bump Formation - A system and method for forming metal bumps is provided. An embodiment comprises attaching conductive material to a carrier medium and then contacting the conductive material to conductive regions of a substrate. Portions of the conductive material are then bonded to the conductive regions using a bonding process to form conductive caps on the conductive regions, and residual conductive material and the carrier medium are removed. A reflow process is used to reflow the conductive caps into conductive bumps. | 12-20-2012 |
20130175685 | UBM Formation for Integrated Circuits - A method includes forming a polymer layer over a metal pad, forming an opening in the polymer layer to expose a portion of the metal pad, and forming an under-bump-metallurgy (UBM). The UBM includes a portion extending into the opening to electrically couple to the metal pad. | 07-11-2013 |
20150364449 | Bonding Package Components Through Plating - A method includes aligning a first electrical connector of a first package component to a second electrical connector of a second package component. With the first electrical connector aligned to the second electrical connector, a metal layer is plated on the first and the second electrical connectors. The metal layer bonds the first electrical connector to the second electrical connector. | 12-17-2015 |
Zheng-Yi Lim, Hsinchu City TW
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20120007230 | CONDUCTIVE BUMP FOR SEMICONDUCTOR SUBSTRATE AND METHOD OF MANUFACTURE - An embodiment of the disclosure includes a conductive bump on a semiconductor die. A substrate is provided. A bond pad is over the substrate. An under bump metallurgy (UBM) layer is over the bond pad. A copper pillar is over the UBM layer. The copper pillar has a top surface with a first width and sidewalls with a concave shape. A nickel layer having a top surface and a bottom surface is over the top surface of the copper pillar. The bottom surface of the nickel layer has a second width. A ratio of the second width to the first width is between about 0.93 to about 1.07. A solder material is over the top surface of the cap layer. | 01-12-2012 |
20120091577 | COPPER PILLAR BUMP WITH COBALT-CONTAINING SIDEWALL PROTECTION - An integrated circuit device includes a Cu pillar and a solder layer overlying the Cu pillar. A Co-containing metallization layer is formed to cover the Cu pillar and the solder layer, and then a thermally reflow process is performed to form a solder bump and drive the Co element into the solder bump. Next, an oxidation process is performed to form a cobalt oxide layer on the sidewall surface of the Cu pillar. | 04-19-2012 |
20120178251 | METHOD OF FORMING METAL PILLAR - The disclosure relates to fabrication of to a metal pillar. An exemplary method of fabricating a semiconductor device comprises the steps of providing a substrate having a contact pad; forming a passivation layer extending over the substrate having an opening over the contact pad; forming a metal pillar over the contact pad and a portion of the passivation layer; forming a solder layer over the metal pillar; and causing sidewalls of the metal pillar to react with an organic compound to form a self-assembled monolayer or self-assembled multi-layers of the organic compound on the sidewalls of the metal pillar. | 07-12-2012 |
20130113094 | POST-PASSIVATION INTERCONNECT STRUCTURE AND METHOD OF FORMING THE SAME - A semiconductor device includes a conductive layer formed on the surface of a post-passivation interconnect (PPI) structure by an immersion tin process. A polymer layer is formed on the conductive layer and patterned with an opening to expose a portion of the conductive layer. A solder bump is then formed in the opening of the polymer layer to electrically connect to the PPI structure. | 05-09-2013 |
20140342546 | COPPER PILLAR BUMP WITH COBALT-CONTAINING SIDEWALL PROTECTION LAYER - A method of forming an integrated circuit device comprises forming a metal pillar over a semiconductor substrate. The method also comprises forming a solder layer over the metal pillar. The method further comprises forming a metallization layer comprising a cobalt (Co) element, the metallization layer covering the metal pillar and the solder layer. The method additionally comprises thermally reflowing the solder layer to form a solder bump, driving the Co element of the metallization layer into the solder bump. The method also comprises oxidizing the metallization layer to form a metal oxide layer on a sidewall surface of the metal pillar. | 11-20-2014 |
20150325539 | METHOD OF FORMING POST-PASSIVATION INTERCONNECT STRUCTURE - A method includes coating a passivation layer overlying a semiconductor substrate and forming an interconnect layer overlying the passivation layer. The interconnect layer includes a line region and a landing pad region. The method further includes forming a metallic layer including tin on a surface of the interconnect layer using an immersion process, forming a protective layer on the metallic layer, and exposing a portion of the metallic layer on the landing pad region of the interconnect layer through the protective layer. | 11-12-2015 |