Patent application number | Description | Published |
20090266621 | Reliability Metal Traces - The formation of improved reliability conductive traces in touch sensor panels that are less prone to failures due to environmental effects is disclosed. Conductive traces, which can be formed from a stackup of metal layers or a single metal layer, can be protected with an additional photoimageable passivation layer of a material such as an organic polymer. This photoimageable coating can be patterned so that it does not appear in the visible area of the touch sensor panel, with much finer tolerances than conventional passivation layers to help keep product dimensions to a minimum. | 10-29-2009 |
20090303189 | High Resistivity Metal Fan Out - The formation of metal traces in the border areas of a touch sensor panel to provide improved reliability, better noise rejection, and lower manufacturing costs is disclosed. The metal traces can be coupled to rows on the touch sensor panel in an interleaved manner, so that any two successive rows can be coupled to metal traces in border areas on opposite sides of the touch sensor panel. In addition, by utilizing the full width available in the border areas in some embodiments, the metal traces can be formed from higher resistivity metal, which can reduce manufacturing costs and improve trace reliability. The wider traces can also provide better noise immunity from noise sources such as an LCD by providing a larger fixed-potential surface area and by more effectively coupling the drive lines to the fixed potential. | 12-10-2009 |
20100035030 | INDIUM TIN OXIDE (ITO) LAYER FORMING - A layer of material, such as crystalline indium tin oxide (ITO), is formed on top of a substrate by heating the material to a high temperature, while a temperature increase of the substrate is limited such that the temperature of the substrate does not exceed a predetermined temperature. For example, a layer including amorphous ITO can be deposited on top of the substrate, and the amorphous layer can be heated in a surface anneal process using radiation while limiting substrate temperature. Another process can pass electrical current through the amorphous ITO. In another process, the substrate is passed through a high-temperature deposition chamber quickly, such that a portion of a layer of crystalline ITO is deposited, while the temperature increase of the substrate is limited. | 02-11-2010 |
20100066683 | Method for Transferring Thin Film to Substrate - A method for transferring single layer thin film from a temporary substrate to a target substrate is disclosed. A base layer may be fabricated onto a fabrication sheet. A single layer thin film of conductive material may be patterned onto the base layer. A temporary transfer substrate may be adhered to the single layer thin film. The fabrication sheet may be removed and the base layer-patterned single layer thin film-temporary transfer substrate block transferred to a target substrate, where the base layer may contact the target substrate. Upon completion of the transfer, the temporary transfer substrate may be removed. | 03-18-2010 |
20100141608 | Index Matching For Touch Screens - Index matching for touch screens is provided. An index matching stackup for a touch screen can be formed including a substantially transparent substrate, a substantially transparent conductive layer disposed in a pattern, and an index matching layer for improving an optical uniformity of the touch screen. The index matching layer can also be designed to operate as a dual-function layer. In one dual-function design, the index matching layer design performs both index matching and passivating the conductive layer. In another dual-function design, the index matching layer performs both index matching and adhesion of layers. The index matching layer can also be designed to serve all three functions of index matching, passivating, and adhering. | 06-10-2010 |
20100175249 | Method for Fabricating Thin Touch Sensor Panels - A method for fabricating thin DITO or SITO touch sensor panels with a thickness less than a minimum thickness tolerance of existing manufacturing equipment. In one embodiment, a sandwich of two thin glass sheets is formed such that the combined thickness of the glass sheets does not drop below the minimum thickness tolerance of existing manufacturing equipment when thin film process is performed on the surfaces of the sandwich during fabrication. The sandwich may eventually be separated to form two thin SITO/DITO panels. In another embodiment, the fabrication process involves laminating two patterned thick substrates, each having at least the minimum thickness tolerance of existing manufacturing equipment. One or both of the sides of the laminated substrates are then thinned so that when the substrates are separated, each is a thin DITO/SITO panel having a thickness less than the minimum thickness tolerance of existing manufacturing equipment. | 07-15-2010 |
20100323166 | Transparent Conductor Thin Film Formation - Substantially transparent conductor layers in touch sensing systems may be formed by forming a barrier layer between an organic layer and a substantially transparent conductive layer. For example, a barrier layer can be formed over the organic layer, and the transparent conductor layer can be formed over the barrier layer. The barrier layer can reduce or prevent outgassing of the organic layer, to help increase the quality of the transparent conductor layer. In another example, a combination layer of two different types of a transparent conductor may be formed over the organic layer by forming a barrier layer of the transparent conductor, and forming a second layer of the transparent conductor on the barrier layer. Outgassing that can occur when forming the barrier layer can cause the transparent conductor of the barrier layer to be of lower-quality, but can result in a higher-quality transparent conductor of the second layer. | 12-23-2010 |
20110006998 | PATTERNING OF THIN FILM CONDUCTIVE AND PASSIVATION LAYERS - Simplified patterning of conductive layers and passivation layers of a thin film is disclosed. In some embodiments, the patterning can include depositing a conductive layer onto a thin film substrate, depositing a passivation layer onto the conductive layer, applying a removable mask including a desired pattern to the passivation layer, patterning the passivation layer to have the desired pattern, using the patterned passivation layer as a mask for the conductive layer, and patterning the conductive layer to have the desired pattern. In other embodiments, the patterning can include depositing a conductive layer onto a thin film substrate, depositing a passivation layer onto the conductive layer, depositing a protective layer onto the passivation layer, applying a removable mask including a desired pattern to the protective layer, patterning the protective layer to have the desired pattern, using the patterned protective layer as a mask for the passivation and conductive layers, and patterning the passivation and conductive layers to have the desired pattern. An exemplary device utilizing the thin film so patterned can include a touch sensor panel. | 01-13-2011 |
20110030209 | METHOD FOR FABRICATING THIN TOUCH SENSOR PANELS - A method for fabricating thin DITO or SITO touch sensor panels with a thickness less than a minimum thickness tolerance of existing manufacturing equipment. In one embodiment, a sandwich of two thin glass sheets is formed such that the combined thickness of the glass sheets does not drop below the minimum thickness tolerance of existing manufacturing equipment when thin film process is performed on the surfaces of the sandwich during fabrication. The sandwich may eventually be separated to form two thin SITO/DITO panels. In another embodiment, the fabrication process involves laminating two patterned thick substrates, each having at least the minimum thickness tolerance of existing manufacturing equipment. One or both of the sides of the laminated substrates are then thinned so that when the substrates are separated, each is a thin DITO/SITO panel having a thickness less than the minimum thickness tolerance of existing manufacturing equipment. | 02-10-2011 |
20110043383 | PATTERNING OF THIN FILM LAYERS - Simplified patterning of layers of a thin film is disclosed. In some embodiments, the patterning can include patterning a first conductive layer using a patterned dielectric layer as a mask and patterning a second conductive layer using a patterned passivation layer as another mask. In other embodiments, the patterning can include patterning a first conductive layer using a removable photosensitive layer as a mask, patterning a black mask layer using a removable photo mask, and patterning a second conductive layer using a patterned passivation layer as another mask. In still other embodiments, the patterning can include patterning a first conductive layer using a patterned black mask layer as a mask and patterning a second conductive layer using a patterned passivation layer as another mask. An exemplary device utilizing the thin film so patterned can include a touch sensor panel. | 02-24-2011 |
20120024816 | METHOD FOR FABRICATING TOUCH SENSOR PANELS - A method for fabricating a touch sensor panel is disclosed. The method includes providing a substrate for the touch sensor panel, depositing a conductive material layer on a top surface of the substrate, depositing a metal layer on top of the conductive material layer, affixing a resist to a first area of the metal layer, the resist also adapted to serve as a passivation layer during passivation, removing metal from the metal layer outside of the first area; and performing passivation on the substrate while leaving the affixed resist intact. | 02-02-2012 |
20120111491 | CURVED TOUCH SENSOR - A method of forming a curved touch surface is disclosed. The method can include depositing and patterning a conductive thin film on a flexible substrate to form at least one touch sensor pattern, while the flexible substrate is in a flat state. According to certain embodiments, the method can include supporting the flexible substrate in the flat state on at least one curved forming substrate having a predetermined curvature; and performing an anneal process, or an anneal-like high-heat process, on the conductive thin film, wherein the anneal process can cause the flexible substrate to conform to the predetermined curvature of the at least one curved forming substrate. According to an embodiment, the curved forming substrate can include a first forming substrate having a first predetermined curvature and a second forming substrate having a second predetermined curvature complementing the first predetermined curvature. | 05-10-2012 |
20120306771 | TOUCH PANEL DISPLAY WITH IMPROVED PATTERN VISIBILITY - Systems and methods are directed to reducing surface reflections on an electronic display device having a touch-screen panel. A touch-screen panel may contribute to undesirable reflection of external light. For example, a touch-screen panel typically includes conductive electrodes which may significantly reflect ambient light, resulting in decreased visibility of displayed images. In some embodiments, a circular polarizer is disposed over a touch-screen panel in the display device. The circular polarizer includes a linear polarizer and a quarter-wave plate to modify the polarization of the external light traveling towards and reflecting from the touch-screen panel and absorbing the reflected light from the touch-screen panel to significantly reduce undesirable light reflections from the touch-screen panel. | 12-06-2012 |
20130063684 | DUAL PURPOSE TOUCH SENSOR PANEL AND OPTICAL RETARDER - When a user operates a touch sensor panel having an LCD device outdoors or in a bright environment, light reflecting off the device can create glare. In order to reduce glare, a user can view the device through polarized filters such as polarized sunglasses. | 03-14-2013 |
20130068505 | PERFORATED MOTHER SHEET FOR PARTIAL EDGE CHEMICAL STRENGTHENING - Methods for chemically strengthening the edges of glass sheets are provided. Voids can be formed in a mother sheet. The edges of these voids may correspond to a portion of the new edges that would normally be created during separation and free shaping of the mother sheet. The mother sheet can then be immersed in a chemical strengthener. The edges of the voids can be chemically strengthened in addition to the front and back sides of the mother sheet. After thin film processing and separation, each of the resulting individual sheets has been chemically strengthened on both sides and on a portion of its edges. | 03-21-2013 |
20130285240 | SENSOR ARRAY PACKAGE - A sensor array package can include a sensor disposed on a first side of a substrate. Signal trenches can be formed along the edges of the substrate and a conductive layer can be deposited in the signal trench and can couple to sensor signal pads. Bond wires can be attached to the conductive layers and can be arranged to be below a surface plane of the sensor. The sensor array package can be embedded in a printed circuit board enabling the bond wires to terminate at other conductors within the printed circuit board. | 10-31-2013 |
20130293513 | DISPLAY WITH DUAL-FUNCTION CAPACITIVE ELEMENTS - A touch screen including display pixels with capacitive elements is provided. The touch screen includes first common voltage lines connecting capacitive elements in adjacent display pixels, and a second common voltage line connecting first common voltage lines. The pixels can be formed as electrically separated regions by including breaks in the common voltage lines. The regions can include a drive region that is stimulated by stimulation signals, a sense region that receives sense signals corresponding to the stimulation signals. A grounded region can also be included, for example, between a sense region and a drive region. A shield layer can be formed of a substantially high resistance material and disposed to shield a sense region. A black mask line and conductive line under the black mask line can be included, for example, to provide low-resistance paths between a region of pixels and touch circuitry outside the touch screen borders. | 11-07-2013 |
20140139484 | DISPLAY WITH DUAL-FUNCTION CAPACITIVE ELEMENTS - A touch screen including display pixels with capacitive elements is provided. The touch screen includes first common voltage lines connecting capacitive elements in adjacent display pixels, and a second common voltage line connecting first common voltage lines. Groups of pixels can be formed as electrically separated regions by including breaks in the common voltage lines. The regions can include a drive region that is stimulated by stimulation signals, a sense region that receives sense signals corresponding to the stimulation signals. A grounded region can also be included, for example, between a sense region and a drive region. A shield layer can be formed of a substantially high resistance material and disposed to shield a sense region. A black mask line and conductive line under the black mask line can be included, for example, to provide low-resistance paths between a region of pixels and touch circuitry outside the touch screen borders. | 05-22-2014 |
20140139763 | HIGH RESISTIVITY METAL FAN OUT - The formation of metal traces in the border areas of a touch sensor panel to provide improved reliability, better noise rejection, and lower manufacturing costs is disclosed. The metal traces can be coupled to rows on the touch sensor panel in an interleaved manner, so that any two successive rows can be coupled to metal traces in border areas on opposite sides of the touch sensor panel. In addition, by utilizing the full width available in the border areas in some embodiments, the metal traces can be formed from higher resistivity metal, which can reduce manufacturing costs and improve trace reliability. The wider traces can also provide better noise immunity from noise sources such as an LCD by providing a larger fixed-potential surface area and by more effectively coupling the drive lines to the fixed potential. | 05-22-2014 |
20140247247 | DISPLAY WITH DUAL-FUNCTION CAPACITIVE ELEMENTS - A touch screen including display pixels with capacitive elements is provided. The touch screen includes first common voltage lines connecting capacitive elements in adjacent display pixels, and a second common voltage line connecting first common voltage lines. Groups of pixels can be formed as electrically separated regions by including breaks in the common voltage lines. The regions can include a drive region that is stimulated by stimulation signals, a sense region that receives sense signals corresponding to the stimulation signals. A grounded region can also be included, for example, between a sense region and a drive region. A shield layer can be formed of a substantially high resistance material and disposed to shield a sense region. A black mask line and conductive line under the black mask line can be included, for example, to provide low-resistance paths between a region of pixels and touch circuitry outside the touch screen borders. | 09-04-2014 |
20140265915 | Thin Film Encapsulation Battery Systems - A battery assembly can be formed on a base layer provided on a substrate, with a thin film battery stack including an anode layer, a cathode layer, and an electrolyte layer between the anode and cathode layers. The thin film battery stack can be encapsulated, and assembled into a battery system with electrical power connections for the anode and cathode layers. | 09-18-2014 |
20140272190 | Annealing Method for Thin Film Electrodes - A method of annealing a thin film deposited on a substrate. According to the method, the thin film deposited on the substrate is provided. The provided thin film is irradiated with electromagnetic radiation until a predetermined crystal quality of the thin film is achieved. The spectral band of the electromagnetic radiation is selected such that the thin film is substantially absorptive to the electromagnetic radiation and the substrate is substantially transparent to the electromagnetic radiation. | 09-18-2014 |
20140272541 | Thin Film Pattern Layer Battery Systems - A battery assembly can be formed on a base layer provided on a substrate, with a thin film battery stack including an anode layer, a cathode layer, and an electrolyte layer between the anode and cathode layers. The thin film battery stack can be attached to a pattern film layer with holes for electrical connection to the anode and cathode layers. | 09-18-2014 |
20140272560 | Method to Improve LiCoO2 Morphology in Thin Film Batteries - A method for improving the lithium cobalt oxide (LiCoO2) film (such as films in thin film batteries) morphology includes using oxygen (O2) and argon (Ar) gases during sputtering deposition of the LiCoO2 film. This may allow for the manufacturing of thicker LiCoO2 films. Such a method may also significantly reduce or eliminate cracking and obvious columnar structures within the resulting LiCoO2 film layer. Sputtering using a mixture of O2 and Ar also may produce a LiCoO2 film layer that requires lower annealing temperatures to reach good utilization and has higher lithium diffusion rates. | 09-18-2014 |
20140272561 | Alternative Current Collectors for Thin Film Batteries and Method for Making the Same - A thin film battery has one or more current collectors with a substantially mesh configuration. The mesh current collector may include a network or web of thin strands of current collector material. The thin strands may overlap each other and/or may be arranged to define a plurality of individual cells within the mesh current collector. The strands of the mesh current collector may also be arranged to have a grid-like configuration. Additionally, in some configurations, the anode or cathode may fill the cells within the current collector layer to optimize the amount of active material within the battery. | 09-18-2014 |
20140273890 | Thin Film Transfer Battery Systems - A battery assembly can be formed on a base layer provided on a temporary process substrate, with a thin film battery stack including an anode layer, a cathode layer, and an electrolyte layer between the anode and cathode layers. The thin film battery stack can be bonded to a transfer layer, and the process substrate can be removed for assembly into a battery system. | 09-18-2014 |