Patent application number | Description | Published |
20120045571 | ECO-FRIENDLY SOLDERABLE WIRE ENAMEL - Described is a polyurethane wire enamel composed of at least one blocked polyisocyanate adduct, blocked with alkylphenols, at least one hydroxy polyester comprising ester and/or imide and/or amide groups, at least one hydrocarbon-based organic solvent, and further auxiliaries and additives. | 02-23-2012 |
20140148531 | LOW-EMISSION FIBRE-MATRIX MATERIAL CURABLE THERMALLY BY RADICAL POLYMERIZATION - Fibre-matrix material curable thermally by radical polymerization, comprising (A) a polymeric matrix curable thermally by radical polymerization, (B) at least one kind of reinforcing fibres and (C) at least one particulate initiator of the radical polymerization, having an average particle size of 5 nm to 500 μm, as measured by static light scattering, and selected from the group consisting of benzpinacol and substituted benzpinacols; processes for producing it, and its use for producing fibre-reinforced thermoset mouldings. | 05-29-2014 |
20140205758 | SOLVENT-FREE WIRE ENAMEL COMPOSITION - The present invention relates to a solvent-free wire enamel composition containing extrudable, polyesterimide-containing binders, prepared from polyols, polycarboxylic acids, imide-forming components, and structural elements which are crosslinkable after extrusion. | 07-24-2014 |
Patent application number | Description | Published |
20090280237 | Coating Mass - The present invention relates to coating compositions for flat assemblies, hybrids, SMD assemblies, comprising at least one binder or binder mixtures which are curable at 60° C.-120° C., preferably at 70° C.-110° C., more particularly at 80° C.-90° C., and also to a process for preparing them and to their use for flat assemblies in electronics, hybrids, SMD assemblies and assembled printed circuit boards. | 11-12-2009 |
20120190787 | REACTIVE SYSTEMS - Reactive system comprising at least one component (I) composed of particles in very finely divided form present in a liquid phase of at least one further component (II) with which component (I) is capable of reacting following activation through energy supply, wherein component (I) is not soluble in component (II), process for preparation and use. | 07-26-2012 |
20120196964 | SOLVENT COMPOSITION AND WIRE COATING MEDIUM - Solvent composition comprising ethanol, aromatic hydrocarbon or hydrocarbon mixture, high-boiling solvent, wire enamel formulation based on polyvinyl formal and comprising the solvent composition, preparation process and use. | 08-02-2012 |
20120225187 | Epoxy resin curing indicator composition - Compositions comprising at least one epoxy resin and/or reactive diluents, at least one hardener for the at least one epoxy resin, at least one curing indicator, wherein the colour of the composition changes depending on the curing degree, a process for determining sufficient cure of a composition comprising providing a composition comprising at least one epoxy resin and a hardener for the epoxy resin, adding a curing indicator, applying curing conditions to the coloured composition until the composition changes its colour and use of polymeric colourants as curing degree indicator, wherein the curing indicator is a polymeric colourant consisting of chromophores which are chemically bound to polymers having reactive groups. | 09-06-2012 |
20120238783 | PROCESS FOR PREPARING ALKYLATED HYDROXYAROMATICS IN MICROREACTORS - A process is proposed for preparing hydroxyaromatics by heterogeneous catalytic reaction of hydroxyaromatics with C | 09-20-2012 |
20140120246 | RESIN COMPOSITIONS COMPRISING SORBIC ESTERS - Resin composition comprising
| 05-01-2014 |