Li-Yun
Li-Yun Chen, Tu-Cheng TW
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20120295588 | MOBILE DEVICE AND NFC SERVICE PROTECTION METHOD OF THE MOBILE DEVICE - In a near-field communication (NFC) service protection method of the mobile device, the mobile device includes an NFC controller, one or more security elements, a global positioning system (GPS) and a storage system. The method sets a security code for an NFC service of each of the security elements according to the geographic location of the mobile device as acquired by the GPS, and stores a security protection of the NFC service corresponding to each of the NFC services into the storage system. After an NFC service is selected from one of the security elements, and the NFC service is performed by executing an NFC application corresponding to the NFC service through the NFC controller. In addition, the method deletes the security code of the NFC service to disable the security protection of the NFC service when the NFC service needs to disable the security protection. | 11-22-2012 |
Li-Yun Chen, Zhongshan CN
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20150266283 | METHOD OF PRODUCING POLY(VINYL BUTYRAL) LAMINATE FROM DISCARDED LAMINATED GLASS - Provided is a method of producing poly(vinyl butyral) laminate from discarded laminated glass. By means of breaking the discarded laminated glass, water-washing and grinding the reduced glass fragments, a reusable poly(vinyl butyral) material substantially free of glass pieces is obtained by physical treatment without using any organic solvent. After drying, granulation and formation steps, a poly(vinyl butyral) laminate is further obtained from the poly(vinyl butyral) material. Accordingly, the method not only reduces resource waste but also produces a water-proof poly(vinyl butyral) laminate, and is more environmentally friendly and more applicable to industry. | 09-24-2015 |
Li-Yun Lai, Panchiao TW
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20120184143 | SECURING STRUCTURE OF A COVER FOR AN ELECTRIC CONNECTOR - The present invention relates to a cover-fastening structure of an electrical connector. The electrical connector has a base and a cover. The cover is connected to one side of the base. One side of the base is connected to the cover through a connecting portion, so that the cover is and the base can be integrally connected together. In this way, the molding of the cover and the base is integrated and the manufacturing process of the electrical connector is simplified. | 07-19-2012 |
Li-Yun Zhang, Shanghai CN
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20080286582 | Surge absorbing material with dual functions - A surge absorbing material with dual functions has one of the characteristics among capacitance, inductance, voltage suppressor and thermistor in addition to surge absorbing characteristic, which microstructural compositions include a glass substrate with high resistance and three kinds of low-resistance conductive or semiconductive particles in micron, submicron and nanometer size uniformly distributed in the glass substrate to provide with good surge absorbing characteristic. | 11-20-2008 |
20080286898 | Material composition having core-shell microstructure used for varistor - A material composition having a core-shell microstructure suitable for manufacturing a varistor having outstanding electrical properties, the core-shell microstructure of the material composition at least comprising a cored-structure made of a conductive or semi-conductive material and a shelled-structure made from a glass material to wrap the cored-structure, and electrical properties of the varistors during low temperature of sintering process can be decided and designated by precisely controlling the size of the grain of the cored-structure and the thickness and insulation resistance of the insulating layer of the shelled-structure of material composition. | 11-20-2008 |
20090321691 | Process for producing surge absorbing material with dual functions - A kind of manufacturing method for dual functions with varistor material and device has one of the characteristics among capacitance, inductance, voltage suppressor and thermistor in addition to surge absorbing characteristic, which microstructural compositions include a glass substrate with high resistance and three kinds of low-resistance conductive or semiconductive particles in micron, submicron and nanometer size uniformly distributed in the glass substrate to provide with good surge absorbing characteristic. | 12-31-2009 |