Li-Han
Li-Han Chang, Tu-Cheng TW
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20130070418 | HEAT DISSIPATION MODULE - An electronic device includes printed circuit board having an electronic component and a heat dissipation module mounted the printed circuit board. The heat dissipation module includes a base with a heat absorbing plate and two elastic pieces extending from the heat absorbing plate. The heat absorbing plate thermally engages on the electronic component. The elastic pieces are fixed on the printed circuit board. The base is made of one of copper-nickel-silicon alloy, beryllium copper, a titanium copper or phosphor bronze. | 03-21-2013 |
Li-Han Chen, San Diego, CA US
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20080272299 | Probe System Comprising an Electric-Field-Aligned Probe Tip and Method for Fabricating the Same - A mechanically stable and oriented scanning probe tip comprising a carbon nanotube having a base with gradually decreasing diameter, with a sharp tip at the probe tip. Such a tip or an array of tips is produced by depositing a catalyst metal film on a substrate ( | 11-06-2008 |
20080287030 | METHOD OF FABRICATING CARBIDE AND NITRIDE NANO ELECTRON EMITTERS - This invention discloses novel field emitters which exhibit improved emission characteristics combined with improved emitter stability, in particular, new types of carbide or nitride based electron field emitters with desirable nanoscale, aligned and sharped-tip emitter structures. | 11-20-2008 |
20090075157 | Carbon nanotube for fuel cell, nanocomposite comprising the same, method for making the same, and fuel cell using the same - Provided are aligned carbon nanotubes for a fuel cell having a large surface area, a nanocomposite that includes the aligned carbon nanotubes loaded with highly dispersed nanoparticles of a metallic catalyst, methods of producing the carbon nanotubes and the nanocomposite, and a fuel cell including the nanocomposite. In the nanocomposite, nanoparticles of the metallic catalyst are uniformly distributed on external walls of the nanotubes. A fuel cell including the nanocomposite exhibits better performance. | 03-19-2009 |
20090098671 | Nanotube assembly including protective layer and method for making the same - Nanotube assemblies and methods for manufacturing the same, including one or more protective layers. A nanotube assembly may include a substrate, a nanotube array, formed on the substrate, and a protective layer, formed on a first area of the substrate where the nanotube array is not, the protective layer reducing the formation of nanocones, and promoting the formation of nanotubes, which make up the nanotube array. | 04-16-2009 |
20100229265 | PROBE SYSTEM COMPRISING AN ELECTRIC-FIELD-ALIGNED PROBE TIP AND METHOD FOR FABRICATING THE SAME - A mechanically stable and oriented scanning probe tip comprising a carbon nanotube having a base with a gradually decreasing diameter, with a sharp tip at the probe tip. Such a tip or an array of tips is produced by depositing a catalyst metal film on a substrate, depositing a carbon dot on the catalyst metal film, etching away the catalyst metal film not masked by the carbon dot, removing the carbon dot from the catalyst metal film to expose the catalyst metal film and growing a carbon nanotube probe tip on the catalyst metal film. The carbon probe tips can be straight, angled, or sharply bent and have various technical applications. | 09-09-2010 |
Li-Han Chung, Miaoli City TW
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20120141858 | MULTILAYER BATTERY SEPARATOR AND METHOD FOR MANUFACTURING THE SAME - A multilayer battery separator is provided. The multilayer battery separator includes a porous polyethylene (PE) film, and a porous thermal resistant film selected from a group consisting of: a weight ratio of polyvinylidene fluoride (PVDF) and cellulose of 90/10-40/60; a weight ratio of polyvinylidene fluoride and polyethylene glycol (PEG) of 99/1-85/15; and polyimide (PI), and combinations thereof. A method for manufacturing the multilayer battery separator is also provided. | 06-07-2012 |
Li-Han Hsu, Hsinchu TW
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20090267201 | Vertical Transmission Structure - A vertical transmission structure for high frequency transmission lines includes a conductive axial core and a conductive structure surrounding the conductive axial core. The vertical transmission structure is applied to a high-frequency flip chip package for reducing the possibility of underfill from coming in contact with the conductive axial core. | 10-29-2009 |
20100248430 | High Frequency Flip Chip Package Process of Polymer Substrate and Structure thereof - In a high frequency flip chip package process of a polymer substrate and a structure thereof, the structure is a one-layer structure packaged by a high frequency flip chip package process to overcome the shortcomings of a conventional two-layer structure packaged by the high frequency flip chip package process. The conventional structure not only incurs additional insertion loss and return loss in its high frequency characteristic, but also brings out a reliability issue. Thus, the manufacturing process of a ceramic substrate in the conventional structure still has the disadvantages of a poor yield rate and a high cost. | 09-30-2010 |
20110121923 | VERTICAL TRANSMISSION STRUCTURE - A vertical transmission structure for high frequency transmission lines includes a conductive axial core and a conductive structure surrounding the conductive axial core. The vertical transmission structure is applied to a high-frequency flip chip package for reducing the possibility of underfill from coming in contact with the conductive axial core. | 05-26-2011 |
20110186974 | HIGH FREQUENCY FLIP CHIP PACKAGE STRUCTURE OF POLYMER SUBSTRATE - A high frequency flip chip package substrate of a polymer is a one-layer structure packaged by a high frequency flip chip package process to overcome the shortcomings of a conventional two-layer structure packaged by the high frequency flip chip package process. The conventional structure not only incurs additional insertion loss and return loss in its high frequency characteristic, but also brings out a reliability issue. Thus, the manufacturing process of a ceramic substrate in the conventional structure still has the disadvantages of a poor yield rate and a high cost. | 08-04-2011 |
Li-Han Hsu, Hsin-Chu TW
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20130092935 | Probe Pad Design for 3DIC Package Yield Analysis - An interposer includes a first surface on a first side of the interposer and a second surface on a second side of the interposer, wherein the first and the second sides are opposite sides. A first probe pad is disposed at the first surface. An electrical connector is disposed at the first surface, wherein the electrical connector is configured to be used for bonding. A through-via is disposed in the interposer. Front-side connections are disposed on the first side of the interposer, wherein the front-side connections electrically couple the through-via to the probe pad. | 04-18-2013 |
20140266283 | Chip-on-Wafer Process Control Monitoring for Chip-on-Wafer-on-Substrate Packages - An embodiment method includes providing a standardized testing structure design for a chip-on-wafer (CoW) structure, wherein the standardized testing structure design comprises placing a testing structure in a pre-selected area a top die in the CoW structure, and electrically testing a plurality of microbumps in the CoW structure by applying a universal testing probe card to the testing structure. | 09-18-2014 |
Li-Han Hsu, Lomita, CA US
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20090314731 | Storage rack - A storage system includes a rear frame, a plurality of divider panels, and a plurality of shelving panels. The divider panels include a first divider panel and a second divider panel, each divider panel having a front vertical bar and a rear vertical bar, each divider panel being removably connected to the rear frame adjacent the rear vertical bar. A plurality of U-shaped connectors are provided in spaced apart manner along the front vertical bars and the rear vertical bars of each divider panel. Each shelving panel has a four-sided configuration that defines four corners, with each corner of each shelving panel fitted inside a U-shaped connector. | 12-24-2009 |
Li-Han Hsu, Torrance, CA US
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20100252520 | STORAGE RACK - A storage system includes a rear frame, a plurality of divider panels, and a plurality of shelving supports. The divider panels include a first divider panel and a second divider panel, each divider panel having a front vertical bar and a rear vertical bar, each divider panel being removably connected to the rear frame adjacent the rear vertical bar. The shelving supports are coupled to the divider panel by hoop and prong couplings. A plurality of U-shaped connectors are provided in spaced apart manner along the front vertical bars and the rear vertical bars of each divider panel. Each shelving support has a perimeter that defines corners, with each corner of each shelving support fitted inside a U-shaped connector. Alternatively, loops are provided along the vertical bars of each divider panel, and prongs are provided at the corners of the shelving supports. | 10-07-2010 |
Li-Han Wu, Hsinchu TW
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20130295215 | THREE-DIMENSIONAL PRINTING APPARATUS - A three-dimensional printing apparatus is provided, including a container, a display, a control unit and an optical film. The container contains a photosensitive material. The display has a plurality of display units. Each of the display units is capable of emitting a light beam. The control unit is capable of controlling the display units. The optical film is capable of projecting the light beams emitted from the display units onto the photosensitive material, forming a plurality of projected patterns. An arranging sequence and an arranging direction of the projected patterns are substantially the same as an arranging sequence and an arranging direction of the display units. | 11-07-2013 |
20140362189 | THREE-DIMENSIONAL IMAGE APPARATUS AND OPERATION METHOD THEREOF - A three-dimensional image apparatus and an operation method thereof are provided. The three-dimensional image apparatus includes a projection unit, a photographic apparatus, a display module and a control unit. In a scan mode, the control unit controls the projection unit to project a structure-light pattern onto an object to be captured in different angles relatively to the object and controls the photographic apparatus to capture a plurality of composition images corresponding to different angles of the object. The composition images are converted into a three-dimensional image in a three dimensional image format through an image conversion module, and the three-dimensional-format image may display a displaying image of the object in a specific viewing angle through the display module. The projection unit and the photographic apparatus are located at a same side of the three-dimensional image apparatus. | 12-11-2014 |
Li-Han Wu, Hsinchu Science Park TW
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20100309444 | Image displacement module - An image displacement module includes a base, a carrier, an optical element, a freely rotating shaft, a flexible shaft, and at least one actuator. The optical element is disposed on the carrier. The freely rotating shaft and the flexible shaft are in a same axis and located between the base and the carrier. The flexible shaft is capable of acting a force on the carrier along the axis, and the carrier is capable of moving along the freely rotating shaft relative to the base to release the force. The actuator is disposed between the base and the carrier. When the actuator drives the carrier to rotate in the axis relative to the base, the flexible shaft generates an elastic torsion. When the actuator does not drive the carrier to rotate in the axis relative to the base, the flexible shaft drives the carrier to reposition relative to the base. | 12-09-2010 |