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Li-Cheng
Li-Cheng Chen, Kaohsiung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20090189578 | LOW RIPPLE DC TO DC POWER CONVERTER - A low ripple DC to DC power converter comprises a first switch, a second switch, an inductor, a driving circuit, and an oscillating circuit. The driving circuit is used to control the first switch and the second switch based on a driving signal. The driving signal has a duty cycle. The oscillating circuit comprises a first oscillating signal and a second oscillating signal. The first oscillating signal has a first pulse width and the second oscillating signal has a second pulse width. The oscillating circuit is used to generate a pulse oscillating signal, where the frequency of the pulse oscillating signal is modulated based on the duty cycle, the first pulse width, and the second pulse width so as to reduce the ripple of the output voltage. | 07-30-2009 |
| 20090289299 | HIGH DENSITY HIGH PERFORMANCE POWER TRANSISTOR LAYOUT - A power transistor comprises a gate region, a source region, and a drain region. The gate region comprises a first line portion, a second line portion, and a third line portion. The first line portion couples to the second line portion so as to form a first V-shaped structure. The second line portion couples to the third line portion so as to form a second V-shaped structure. The first line portion, the second line portion, and the third line portion form a N-shaped structure. | 11-26-2009 |
| 20100052634 | DRIVING CIRCUIT FOR IMPROVING THE LOADING TRANSIENT PERFORMANCE OF A POWER CONVERTER - A driving circuit that improves the loading transient performance of a power converter is provided. The driving circuit comprises an input unit, an output unit, a reference current generating unit, and a discharging unit. The input unit receives a first voltage signal and a second voltage signal. The first voltage signal has a first voltage V | 03-04-2010 |
Li-Cheng Chen, Taoyuan County TW
| Patent application number | Description | Published |
|---|---|---|
| 20090267951 | Method for rendering fluid - A method for rendering fluid is provided. First, state information of a plurality of fluid particles is provided, wherein the state information records whether the fluid particles are located above or under a fluid surface and the interactions between the fluid particles and a terrain or the dynamic objects. Then, whether to render the fluid particles in a direction facing a viewer or in a direction parallel to the flow direction is determined according to the information that whether the fluid particles are located above or under the fluid surface. Next, the fluid particles are rendered as a plurality of two-dimensional metaballs according to the interactions between the fluid particles and the terrain or the dynamic objects, and these metaballs are stacked to reconstruct the fluid. | 10-29-2009 |
Li-Cheng Hsu, Dongshan Township TW
| Patent application number | Description | Published |
|---|---|---|
| 20100072239 | CARRIER FOR BICYCLE - A bicycle carrier includes a main body, at least one supporting frame, at least one side frame and at least one restrainer. The main body includes a supporting plane and a plurality of slide bases. The slide bases are located on at least one side of the main body. The supporting frame connects the main body and the bicycle. The side frame includes at least one slide rod that slides and couples to the slide bases and at least one fence connected to the slide rod to define a container space. The restrainer restrains the side frame from moving relative to the main body. | 03-25-2010 |
Li-Cheng Tai, Kao-Hsiung Hsien TW
| Patent application number | Description | Published |
|---|---|---|
| 20080220566 | Substrate process for an embedded component - A substrate process for an embedded component is disclosed. A mold having a surface and protruding components protruded from the surface is provided. A first dielectric layer is formed on the surface and covers the protruding components. At least one electronic component having an active surface, a back surface, and contacts formed on the active surface is disposed on the first dielectric layer. The active surface is faced to the first dielectric layer, and the contacts are corresponding to the protruding components. A second dielectric layer is formed on the first dielectric layer and a carrier is disposed on the back surface of the electronic component. Openings are formed on the first dielectric layer by the protruding components in an imprinting step. The openings are corresponding to the contacts. Finally, the mold is removed to form a substrate with an embedded component. | 09-11-2008 |