Patent application number | Description | Published |
20110024898 | METHOD OF MANUFACTURING SUBSTRATES HAVING ASYMMETRIC BUILDUP LAYERS - A method of manufacturing a substrate for use in electronic packaging having a core, m buildup layers on a first surface of the core and n buildup layers on a second surface of the core, where m≠n is disclosed. The method includes forming (m−n) of the m buildup layers on the first surface, and then forming n pairs of buildup layers, with each one of the pairs including one of the n buildup layers formed on the second surface and one of the remaining n of the m buildup layers formed on the first surface. Each buildup layer includes a dielectric layer and a conductive layer formed thereon. The disclosed method protects the dielectric layer in each of buildup layers from becoming overdesmeared during substrate manufacturing by avoiding repeated desmearing of dielectric materials. | 02-03-2011 |
20110100692 | Circuit Board with Variable Topography Solder Interconnects - Various circuit boards and methods of making the same are disclosed. In one aspect, a method of manufacturing is provided that includes applying a solder mask to a first side of a first circuit board. The first side of the first circuit board includes a first conductor structure and a second conductor structure. A first opening is formed in the solder mask that extends to the first conductor structure. The first opening has a first area. A second opening is formed in the solder mask that extends to the second conductor structure and has a second area larger than the first area. | 05-05-2011 |
20110225813 | METHOD OF MANUFACTURING SUBSTRATES HAVING ASYMMETRIC BUILDUP LAYERS - A method of manufacturing a substrate for use in electronic packaging having a core, m buildup layers on a first surface of the core and n buildup layers on a second surface of the core, where m≠n is disclosed. The method includes forming (m−n) of the m buildup layers on the first surface, and then forming n pairs of buildup layers, with each one of the pairs including one of the n buildup layers formed on the second surface and one of the remaining n of the m buildup layers formed on the first surface. Each buildup layer includes a dielectric layer and a conductive layer formed thereon. The disclosed method protects the dielectric layer in each of buildup layers from becoming overdesmeared during substrate manufacturing by avoiding repeated desmearing of dielectric materials. | 09-22-2011 |
Patent application number | Description | Published |
20090032940 | Conductor Bump Method and Apparatus - Various semiconductor die conductor structures and methods of fabricating the same are provided. In one aspect, a method of manufacturing is provided that includes forming a conductor structure on a conductor pad of a semiconductor die. The conductor layer has a surface. A polymeric layer is formed on the surface of the conductor layer while a portion of the surface is left exposed. A solder structure is formed on the exposed portion of the surface and a portion of the polymeric layer. | 02-05-2009 |
20100102457 | Hybrid Semiconductor Chip Package - Various apparatus and method of packaging semiconductor chips are disclosed. In one aspect, a method of manufacturing is provided that includes placing a semiconductor chip package into a mold. The semiconductor chip package includes a substrate that has a side and a first semiconductor chip coupled to the side in spaced apart relation to define a space between the first semiconductor chip and the side. A second semiconductor chip is mounted on the first semiconductor chip. At least one conductor wire is electrically coupled to the second semiconductor chip and the substrate. A molding material is introduced into the mold to flow into the space and establish an underfill and encapsulate the first semiconductor chip and the second semiconductor chip. | 04-29-2010 |
20110074041 | Circuit Board with Oval Micro Via - Various circuit boards and methods of manufacturing the same are disclosed. In one aspect, a method of manufacturing is provided that includes forming a first interconnect layer of a circuit board. The first interconnect layer includes a first conductor structure. A first via is formed in the first interconnect layer and in electrical contact with the first conductor structure. The first via has a first oval footprint. | 03-31-2011 |
20110110061 | Circuit Board with Offset Via - Various circuit boards and methods of manufacturing the same are disclosed. In one aspect, a method of manufacturing is provided that includes forming a first interconnect layer of a circuit board. The first interconnect layer includes first and second conductor structures in spaced apart relation, a first via in ohmic contact with the first conductor structure and a second via in ohmic contact with the second conductor structure. A second interconnect layer is formed on the first interconnect layer. The second interconnect layer includes third and fourth conductor structures in spaced apart relation and offset laterally from the first and second conductor structures, a third via in ohmic contact with the third conductor structure and a fourth via in ohmic contact with the fourth conductor structure. | 05-12-2011 |
20110133338 | CONDUCTOR BUMP METHOD AND APPARATUS - Various semiconductor die conductor structures and methods of fabricating the same are provided. In one aspect, a method of manufacturing is provided that includes forming a conductor structure on a conductor pad of a semiconductor die. The conductor layer has a surface. A polymeric layer is formed on the surface of the conductor layer while a portion of the surface is left exposed. A solder structure is formed on the exposed portion of the surface and a portion of the polymeric layer. | 06-09-2011 |
20110147061 | Circuit Board with Via Trace Connection and Method of Making the Same - Various circuit boards and methods of manufacturing the same are disclosed. In one aspect, a method of manufacturing is provided that includes forming a first interconnect layer of a circuit board. The first interconnect layer includes a first conductor trace with a first segment that does not include a via land. A first via is formed on the first segment. | 06-23-2011 |
20120120615 | CIRCUIT BOARD WITH VIA TRACE CONNECTION AND METHOD OF MAKING THE SAME - Various circuit boards and methods of manufacturing the same are disclosed. In one aspect, a method of manufacturing is provided that includes forming a first interconnect layer of a circuit board. The first interconnect layer includes a first conductor trace with a first segment that does not include a via land. A first via is formed on the first segment. | 05-17-2012 |
20130062786 | SOLDER MASK WITH ANCHOR STRUCTURES - Various substrates or circuit boards for receiving a semiconductor chip and methods of processing the same are disclosed. In one aspect, a method of manufacturing is provided that includes forming a first opening in a solder mask positioned on a side of a substrate. The first opening does not extend to the side. A second opening is formed in the solder mask that extends to the side. The first opening may serve as an underfill anchor site. | 03-14-2013 |
20150049441 | CIRCUIT BOARD WITH CORNER HOLLOWS - A method of manufacturing is provided that includes singulating a circuit board from a substrate of plural of the circuit boards, wherein the circuit board is shaped to have four corner hollows. The corner hollows may be various shapes. | 02-19-2015 |
Patent application number | Description | Published |
20080267222 | System for combining a plurality of video streams and method for use therewith - A system for combining a plurality of video streams includes a time stamp adjustment module that generates an adjusted second video stream by adjusting a plurality of time stamps of a second video stream. A video stream concatenation module generates a combined video stream by concatenating the adjusted second video stream to an end of a first video stream. | 10-30-2008 |
20090022315 | SECURITY MODULE FOR SECURING AN ENCRYPTED SIGNAL WITH SYSTEM AND METHOD FOR USE THEREWITH - A security module includes a signal interface for receiving an encrypted signal and a host interface that is coupleable to a host. A processing module is operable to receive encrypted decryption code from the host via the host interface, decrypt the encrypted decryption code to form decrypted decryption code that is operable to decrypt the encrypted signal, send the decrypted decryption code to the host via the host interface, monitor the security of the decrypted decryption code via security signaling sent between the host and the security module via the host interface to detect potential tampering with the decrypted decryption code, transfer the encrypted signal to the host via the host interface, and discontinue transfer of the encrypted signal when the security signaling indicates the potential tampering with the decrypted decryption code. | 01-22-2009 |
20090141894 | USB VIDEO CARD AND DONGLE DEVICE WITH VIDEO ENCODING AND METHODS FOR USE THEREWITH - A universal serial bus (USB) dongle device includes a USB interface for receiving a video signal in a first format and for sending a processed video signal in a second format wherein the first format differs from the second format. An encoding module generates the processed video signal based on the video signal. In a further embodiment, A video card includes a video receiver for receiving a video signal in a first format, based on a selection command. An encoding module generates a processed video signal in a second format based on the video signal, wherein the first format differs from the second format. A USB interface transfers the processed video signal to the host device, receives the selection command from the host device and receives a power signal from the host device to power the video receiver and the encoding module. | 06-04-2009 |
20090147840 | VIDEO ENCODING SYSTEM WITH UNIVERSAL TRANSCODING AND METHOD FOR USE THEREWITH - An encoding system includes a first signal interface for receiving a first video signal in a first format. A second signal interface receives a second video signal in a second format. A first encoding module generates a first processed video signal in a third format. A second encoding module generates a second processed video signal in a fourth format, wherein the second processed signal is generated contemporaneously with the first processed video signal and wherein the first format differs from the third format and the second format differs from the fourth format. | 06-11-2009 |
20090219986 | HIERARCHICAL VIDEO ANALYSIS-BASED REAL-TIME PERCEPTUAL VIDEO CODING - A system for encoding a video stream into a processed video signal that includes at least one image. The system includes a downscaling module, a partitioning module, a rate control module, and an encoder section. The downscaling module receives the video stream and produces a downscaled video stream. A partitioning module, including a region detection module, receives the downscaled video stream and detects a pattern of interest in the at least one image. The partitioning module is operable to partition the at least one image based on the detected pattern of interest. The rate control module that receives an output from the partitioning module and produces an encoder control signal dependent on the output from the partitioning module. The encoder section, coupled to the rate control module, receives the video stream and generates the processed video signal. | 09-03-2009 |
20100161975 | PROCESSING SYSTEM WITH APPLICATION SECURITY AND METHODS FOR USE THEREWITH - A processing system includes an interface for receiving application data at the processing system corresponding to an application, the application data including authentication data. A one-time programmable memory stores at least one application key. A processing module executes an operating system that includes a security routine to authenticate the application data based on the authentication data and the at least one application key. The security routine permits the execution of the application by the processing module when the authentication data is authenticated, and prevents the execution of the application by the processing system when the authentication data is not authenticated. | 06-24-2010 |
20110099244 | COPROCESSING MODULE FOR PROCESSING ETHERNET DATA AND METHOD FOR USE THEREWITH - A co-processing module communicates with at least one remote device via an Ethernet communication link. The co-processing module includes a first processor that executes an application of the host device via a first operating system, the application including socket system calls. A second processor executes a second operating system to execute a transport control protocol/Internet protocol stack, an Ethernet driver, and an Ethernet media access control layer, to bidirectionally communicate first data via the Ethernet communication link and further to bidirectionally communicate the first data with the first processor. The first processor bidirectionally communicates the first data with the application via the socket system calls. | 04-28-2011 |
20110164685 | ENTROPY DECODER WITH ENTROPY DECODING INTERFACE AND METHODS FOR USE THEREWITH - An entropy decoding module can be used in a video decoder that decodes a stream of video data from a first buffer. An entropy decoding interface includes a second buffer. A load controller automatically fetches the video data from the first buffer for storage in the second buffer. A search engine searches the video data stored in the second buffer for at least one bit pattern. A processing module retrieves the video data from the second buffer for entropy decoding. | 07-07-2011 |
20110304767 | DONGLE DEVICE WITH VIDEO ENCODING AND METHODS FOR USE THEREWITH - A universal serial bus (USB) dongle device includes a USB interface that receives selection data from a host device that indicates a selection of a first video format from a plurality of available formats. The USB interface also receives an input video signal from the host device in the first video format and a power signal from the host device. An encoding module generates a processed video signal in a second video format based on the input video signal, wherein the first video format differs from the second video format. The USB interface transfers the processed video signal to the host device. | 12-15-2011 |
20150271545 | CONTENT ACCESS DEVICE WITH POLLING PROCESSOR AND METHODS FOR USE THEREWITH - A content access device includes an interface module that receives a transport stream and outputs a processed transport stream. An input buffer buffers the received transport stream. A polling processor processes the transport stream based on the at least one key to generate the processed transport stream, wherein the polling processor operates to descramble individual packets of the transport stream in a plurality of polling slots of a polling loop. An output buffer buffers the processed transport stream for output by the interface module. | 09-24-2015 |