| Patent application number | Description | Published |
|---|
| 20080237841 | Microelectronic package, method of manufacturing same, and system including same - A microelectronic package includes a substrate ( | 10-02-2008 |
| 20080237843 | Microelectronic package including thermally conductive sealant between heat spreader and substrate - A microelectronic package. The package includes a substrate; a die mounted onto the substrate; an integrated heat spreader mounted onto the substrate, and thermally coupled to a backside of the die; and a sealant material bonding the integrated heat spreader to the substrate, the sealant material having a bulk thermal conductivity above about 1 W/m/° C. and a modulus of elasticity lower than a modulus of elasticity of solder. | 10-02-2008 |
| 20080251932 | Method of forming through-silicon vias with stress buffer collars and resulting devices - A method of forming a via having a stress buffer collar, wherein the stress buffer collar can absorb stress resulting from a mismatch in the coefficients of thermal expansion of the surrounding materials. Other embodiments are described and claimed. | 10-16-2008 |
| 20090004317 | HIGH THERMAL CONDUCTIVITY MOLDING COMPOUND FOR FLIP-CHIP PACKAGES - A molding compound for use in an integrated circuit package comprises an epoxy and a thermally conductive filler material. The thermally conductive filler material comprises between 70% and 95% of the molding compound and has a thermal conductivity between 10 W/m-K and 3000 W/m-K. | 01-01-2009 |
| 20090057881 | MICROELECTRONIC PACKAGE AND METHOD OF COOLING SAME - A microelectronic package comprises a chip stack ( | 03-05-2009 |
| 20090168390 | DIRECTING THE FLOW OF UNDERFILL MATERIALS USING MAGNETIC PARTICLES - Electronic devices and methods for fabricating electronic devices are described. One method includes providing a substrate and a die, and coupling the die to the substrate, wherein a gap remains between the die and the substrate. The method also includes placing an underfill material on the substrate and delivering at least part of the underfill material into the gap. The method also includes controlling the flow of the underfill material in the gap using magnetic force. Other embodiments are described and claimed. | 07-02-2009 |
| 20110151624 | Coating for a microelectronic device, treatment comprising same, and method of managing a thermal profile of a microelectronic die - A coating for a microelectronic device comprises a polymer film ( | 06-23-2011 |
| 20110156283 | Use of die backside films to modulate EOL coplanarity of thin packages while providing thermal capability and laser markability of packages - A microelectronic package comprises a die ( | 06-30-2011 |
| 20110159310 | Methods of fabricating low melting point solder reinforced sealant and structures formed thereby - Methods and associated structures of forming a package structure including forming a low melting point solder material on a solder resist opening location of an IHS keep out zone, forming a sealant in a non SRO keep out zone region; attaching the IHS to the sealant, and curing the sealant, wherein a solder joint is formed between the IHS and the low melting point solder material. | 06-30-2011 |
