Patent application number | Description | Published |
20080257860 | METHOD FOR MICROSTRUCTURING FLAT GLASS SUBSTRATES - In the method for microstructuring flat glass substrates a substrate surface of a glass substrate is coated with at least one structured mask layer and subsequently exposed to a chemically reactive ion etching process (RIE) with at least one chemical etching gas. In order to provide the same or a higher quality etching and etching rate even for economical types of glass the chemical etching gas is mixed with at least one noble gas, so that the proportion of sputtering etching in the ion etching process is significantly increased. | 10-23-2008 |
20090321867 | Method for production of packaged electronic components, and a packaged electronic component - The invention relates to a method for production of packaged electronic, in particular optoelectronic, components in a composite wafer, in which the packaging is carried out by fitting microframe structures of a cover substrate composed of glass, and the composite wafer is broken up along trenches which are produced in the cover substrate, and to packaged electronic components which can be produced using this method, comprising a composite of a mount substrate and a cover substrate, with at least one functional element and at least one bonding element, which makes contact with the functional element, being arranged on the mount substrate, with the cover substrate being a microstructured glass which is arranged on the mount substrate, and forms a cavity above the functional element, and with the bonding elements being located outside the cavity. | 12-31-2009 |
20100059877 | Method for packaging electronic devices and integrated circuits - The present invention relates to the field of electronic devices and their associated driver and/or controller integrated circuits and in particular to the mechanical packaging of electronic devices and to the packaging of electronic devices and their associated driver and/or controller integrated circuits. | 03-11-2010 |
20120003791 | Method for Packaging Electronic Devices and Integrated Circuits - The present invention relates to the field of electronic devices and their associated driver and/or controller integrated circuits and in particular to the mechanical packaging of electronic devices and to the packaging of electronic devices and their associated driver and/or controller integrated circuits. | 01-05-2012 |
Patent application number | Description | Published |
20100065883 | PROCESS FOR MAKING CONTACT WITH AND HOUSING INTEGRATED CIRCUITS - A process for producing electrical contact connections for a component integrated in a substrate material is provided, the substrate material having a first surface region, and at least one terminal contact being arranged at least partially in the first surface region for each component, which is distinguished in particular by application of a covering to the first surface region and production of at least one contact passage which, in the substrate material, runs transversely with respect to the first surface region, in which process, in order to form at least one contact location in a second surface region which is to be provided, at least one electrical contact connection from the contact location to at least one of the terminal contacts is produced via the respective contact passages. | 03-18-2010 |
20100130246 | Method and Apparatus for Producing Hybrid Lenses - The invention generally concerns optical systems and, in particular, a method and device for joining at least one first and one second optical element to an optical composite element, as well as an optical composite element itself. In order to produce optical systems having at least two optical elements more easily and more economically, the invention provides a method for joining at least one first and one second optical element, in which the first optical element contains a first glass or a crystalline material, the second optical element contains a second glass, and the first glass or the crystalline material has a transformation temperature Tg1 or a melting temperature that differs from the transformation temperature Tg2 of the second glass, and at least the glass of the second optical element is heated and brought into contact with the glass or with the crystalline material of the first optical element. The invention also relates to a device for carrying out the method and to an optical composite element that can be produced using the method. | 05-27-2010 |
20110021002 | Process for Making Contact with and Housing Integrated Circuits - A process for producing electrical contact connections for a component integrated in a substrate material is provided, the substrate material having a first surface region, and at least one terminal contact being arranged at least partially in the first surface region for each component, which is distinguished in particular by application of a covering to the first surface region and production of at least one contact passage which, in the substrate material, runs transversely with respect to the first surface region, in which process, in order to form at least one contact location in a second surface region which is to be provided, at least one electrical contact connection from the contact location to at least one of the terminal contacts is produced via the respective contact passages. | 01-27-2011 |
Patent application number | Description | Published |
20100130246 | Method and Apparatus for Producing Hybrid Lenses - The invention generally concerns optical systems and, in particular, a method and device for joining at least one first and one second optical element to an optical composite element, as well as an optical composite element itself. In order to produce optical systems having at least two optical elements more easily and more economically, the invention provides a method for joining at least one first and one second optical element, in which the first optical element contains a first glass or a crystalline material, the second optical element contains a second glass, and the first glass or the crystalline material has a transformation temperature Tg1 or a melting temperature that differs from the transformation temperature Tg2 of the second glass, and at least the glass of the second optical element is heated and brought into contact with the glass or with the crystalline material of the first optical element. The invention also relates to a device for carrying out the method and to an optical composite element that can be produced using the method. | 05-27-2010 |
20110021002 | Process for Making Contact with and Housing Integrated Circuits - A process for producing electrical contact connections for a component integrated in a substrate material is provided, the substrate material having a first surface region, and at least one terminal contact being arranged at least partially in the first surface region for each component, which is distinguished in particular by application of a covering to the first surface region and production of at least one contact passage which, in the substrate material, runs transversely with respect to the first surface region, in which process, in order to form at least one contact location in a second surface region which is to be provided, at least one electrical contact connection from the contact location to at least one of the terminal contacts is produced via the respective contact passages. | 01-27-2011 |
Patent application number | Description | Published |
20110175487 | METHOD FOR PRODUCING A DIELECTRIC LAYER IN AN ELECTROACOUSTIC COMPONENT, AND ELECTROACOUSTIC COMPONENT - The invention relates to a method for producing a dielectric layer ( | 07-21-2011 |
20120231212 | METHOD FOR PRODUCING A STRUCTURED COATING ON A SUBSTRATE, COATED SUBSTRATE, AND SEMI-FINISHED PRODUCT HAVING A COATED SUBSTRATE - The invention relates to a method for producing a structured coating on a substrate, wherein the method comprises the following steps: providing a substrate having a surface to be coated and producing a structured coating on the surface of the substrate to be coated by depositing at least one evaporation coating material, namely aluminium oxide, silicon dioxide, silicon nitride, or titanium dioxide, on the surface of the substrate to be coated by means of thermal evaporation of the at least one evaporation coating material and using additive structuring. The invention further relates to a coated substrate and a semi-finished product having a coated substrate. | 09-13-2012 |
20120314393 | METHOD FOR MANUFACTURING AN ARRANGEMENT WITH A COMPONENT ON A CARRIER SUBSTRATE, AN ARRANGEMENT AND METHOD FOR MANUFACTURING A SEMI-FINISHED PRODUCT, AND A SEMI-FINISHED PRODUCT - The invention relates to a method for manufacturing an arrangement with a component on a carrier substrate, wherein the method encompasses the following steps: Manufacturing spacer elements on the rear side of a cover substrate, arranging a component on a cover surface of a carrier substrate, and arranging the spacer elements formed on the carrier substrate so as to situate the component in the at least one hollow space and close the latter. In addition, the invention relates to an arrangement, a method for manufacturing a semi-finished product for a component arrangement, as well as a semi-finished product for a component arrangement. | 12-13-2012 |