Patent application number | Description | Published |
20100015792 | Bonding Metallurgy for Three-Dimensional Interconnect - A method provides a first substrate with a conductive pad and disposes layers of Cu, TaN, and AlCu, respectively, forming a conductive stack on the conductive pad. The AlCu layer of the first substrate is bonded to a through substrate via (TSV) structure of a second substrate, wherein a conductive path is formed from the conductive pad of the first substrate to the TSV structure of the second substrate. | 01-21-2010 |
20100047963 | Through Silicon Via Bonding Structure - System and method for bonding semiconductor substrates is presented. A preferred embodiment comprises forming a buffer layer over a surface of a semiconductor substrate while retaining TSVs that protrude from the buffer layer in order to prevent potential voids that might form. A protective layer is formed on another semiconductor substrate that will be bonded to the first semiconductor substrate. The two substrates are aligned and bonded together, with the buffer layer preventing any short circuit contacts to the surface of the original semiconductor substrate. | 02-25-2010 |
20110051378 | Wafer-Level Molded Structure for Package Assembly - An integrated circuit structure includes a bottom die; a top die bonded to the bottom die with the top die having a size smaller than the bottom die; and a molding compound over the bottom die and the top die. The molding compound contacts edges of the top die. The edges of the bottom die are vertically aligned to respective edges of the molding compound. | 03-03-2011 |
20110058346 | Bonding Metallurgy for Three-Dimensional Interconnect - A method provides a first substrate with a conductive pad and disposes layers of Cu, TaN, and AlCu, respectively, forming a conductive stack on the conductive pad. The AlCu layer of the first substrate is bonded to a through substrate via (TSV) structure of a second substrate, wherein a conductive path is formed from the conductive pad of the first substrate to the TSV structure of the second substrate. | 03-10-2011 |
20110062592 | Delamination Resistance of Stacked Dies in Die Saw - An integrated circuit structure includes a first die including TSVs; a second die over and bonded to the first die, with the first die having a surface facing the second die; and a molding compound including a portion over the first die and the second die. The molding compound contacts the surface of the second die. Further, the molding compound includes a portion extending below the surface of the second die. | 03-17-2011 |
20130044004 | Apparatus and Methods for Real-Time Error Detection in CMP Processing - Methods and apparatus for detecting errors in real time in CMP processing. A method includes disposing a semiconductor wafer onto a wafer carrier in a tool for chemical mechanical polishing (“CMP”); positioning the wafer carrier so that a surface of the semiconductor wafer contacts a polishing pad mounted on a rotating platen; dispensing an abrasive slurry onto the rotating polishing pad while maintaining the surface of the semiconductor wafer in contact with the polishing pad to perform a CMP process on the semiconductor wafer; in real time, receiving signals from the CMP tool into a signal analyzer, the signals corresponding to vibration, acoustics, temperature, or pressure; and comparing the received signals from the CMP tool to expected received signals for normal processing by the CMP tool; outputting a result of the comparing. A CMP tool apparatus is disclosed. | 02-21-2013 |
20130078810 | METHOD AND APPARATUS FOR PERFORMING A POLISHING PROCESS IN SEMICONDUCTOR FABRICATION - The present disclosure provides an apparatus for fabricating a semiconductor device. The apparatus includes a polishing head that is operable to perform a polishing process to a wafer. The apparatus includes a retaining ring that is rotatably coupled to the polishing head. The retaining ring is operable to secure the wafer to be polished. The apparatus includes a soft material component located within the retaining ring. The soft material component is softer than silicon. The soft material component is operable to grind a bevel region of the wafer during the polishing process. The apparatus includes a spray nozzle that is rotatably coupled to the polishing head. The spray nozzle is operable to dispense a cleaning solution to the bevel region of the wafer during the polishing process. | 03-28-2013 |
20130210173 | Multiple Zone Temperature Control for CMP - To provide improved planarization, techniques in accordance with this disclosure include a CMP station that includes a plurality of concentric temperature control elements arranged over a number of concentric to-be-polished wafer surfaces. During polishing, a wafer surface planarity sensor monitors relative heights of the concentric to-be-polished wafer surfaces, and adjusts the temperatures of the concentric temperature control elements to provide an extremely well planarized wafer surface. Other systems and methods are also disclosed. | 08-15-2013 |
20130210323 | CMP Pad Cleaning Apparatus - The present disclosure relates to a two-phase cleaning element that enhances polishing pad cleaning so as to prevent wafer scratches and contamination in chemical mechanical polishing (CMP) processes. In some embodiments, the two-phase pad cleaning element comprises a first cleaning element and a second cleaning element configured to successively operate upon a section of a CMP polishing pad. The first cleaning element comprises a megasonic cleaning jet configured to utilize cavitation energy to dislodge particles embedded in the CMP polishing pad without damaging the surface of the polishing pad. The second cleaning element is configured to apply a high pressure mist, comprising two fluids, to remove by-products from the CMP polishing pad. By using megasonic cleaning to dislodge embedded particles a two-fluid mist to flush away by-products (e.g., including the dislodged embedded particles), the two-phase pad cleaning element enhances polishing pad cleaning. | 08-15-2013 |
20130217306 | CMP Groove Depth and Conditioning Disk Monitoring - Some embodiments relate to a chemical mechanical polishing (CMP) system. The CMP system includes a polishing pad having a polishing surface, and a wafer carrier to retain a wafer proximate to the polishing surface during polishing. A motor assembly rotates the polishing pad and concurrently rotates the wafer during polishing of the wafer. A conditioning disk has a conditioning surface that is in frictional engagement with the polishing surface during polishing. A torque measurement element measures a torque exerted by the motor assembly during polishing. A condition surface analyzer determines a surface condition of the conditioning surface or the polishing surface based on the measured torque. Other systems and methods are also disclosed. | 08-22-2013 |
20130244552 | MANUFACTURE AND METHOD OF MAKING THE SAME - A manufacture includes a substrate, a reinforcement layer over the substrate, and abrasive particles over the substrate. The abrasive particles are partially buried in the reinforcement layer. Upper tips of the abrasive particles are substantially coplanar. | 09-19-2013 |
20140048926 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME - A semiconductor package includes a passivation layer overlying a semiconductor substrate, a bump overlying the passivation layer, and a molding compound layer overlying the passivation layer and covering a lower portion of the bump. A sidewall of the passivation layer is covered by the molding compound layer. | 02-20-2014 |
20140206140 | Method of Forming Wafer-Level Molded Structure for Package Assembly - A method of forming an integrated circuit structure is provided. In an embodiment, the method includes bonding top dies onto a bottom wafer and then molding a first molding material onto and in between the top dies and the bottom wafer. The bottom wafer, the top dies, and the first molding material are sawed to form molding units. Each of the molding units includes one of the top dies and a bottom die sawed from the bottom wafer. The molding units are bonded onto a package substrate and a second molding material is molding onto the one of the molding units and the package substrate. Thereafter, the package substrate and the second molding material are sawed to form package-molded units. | 07-24-2014 |
20140346669 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME - A semiconductor package includes a passivation layer overlying a semiconductor substrate, a pillar bump overlying the passivation layer, and a molding compound layer overlying the passivation layer and covering a lower portion of the bump. A sidewall of the passivation layer is covered by the molding compound layer. | 11-27-2014 |
Patent application number | Description | Published |
20090267532 | DIMMABLE CONTROL CIRCUIT - The present invention relates to a dimmable control circuit, comprising: an ac power source; a transformer; a rectifier circuit; a dimmable control chip; a voltage dividing circuit; a dimmable switch; a first resistor; a second resistor; and a half bridge power driving circuit, capable of outputting signals to drive a fluorescent tube, characterized in that said dimmable switch has a coactive variable resistor connected in parallel with said first resistor and said second resistor, and both said first resistor and said second resistor have the negative resistance temperature coefficient to achieve low temperature startup and high temperature operation. | 10-29-2009 |
20090267533 | EXPANDABLE LED MODULE FOR ARBITRARILY DISPLAY ASSEMBLY - An expandable LED module for arbitrary display assembly, comprises: a print circuit board, used to carry the following devices; at least a light emitting diode, disposed on said print circuit board; a first connecting device, disposed on one side of said print circuit board and coupled to said light emitting diode; and a second connecting device, disposed on the other side of said print circuit board, coupled to said light emitting diode, and capable of interconnecting with said first connecting device, wherein said first connecting device and second connecting device can be utilized to expand said LED modules to accomplish any assembly indicating figures, words, numbers, or symbols. | 10-29-2009 |
20100240230 | POWER PLUG - The present invention relates to a power plug, comprises: a magnetic conductive ring; a grounding insulation supporting ring; a grounding ring connection seat, a grounding connection sheet is extended from one end of the grounding ring connection seat; a power insulation supporting ring; a power ring connection seat, a power connection sheet is extended from one end of the power ring connection seat; an insulation supporting ring; an identifying connection seat; an insulation retaining ring and a cable housing. The identifying connection seat and the power ring connection seat and the grounding ring connection seat are assembled in a manner of a ring being provided on other rings therefore a 360 degree nondirectional power plug is obtained. | 09-23-2010 |
20110280023 | LENS MODULE FOR LED LAMP - The present invention relates to a lens module for LED lamp, comprises a base installed with a first chamber and a second chamber opposite to the first chamber, the first chamber is able to be connected with a substrate, and at least one LED module is installed on the substrate; a first lens; and a second lens. With the mentioned structure, lights emitted by LED modules can be refracted by the first lens and the second lens for achieving the purpose of unifying lights. Moreover, the base, the first lens and the second lens are made of transparent material and formed with an injection molding means for lowering the production cost. | 11-17-2011 |
Patent application number | Description | Published |
20090090000 | In-mould molding touch module and method for manufacturing the same - An in-mould molding touch module includes a transparent conducting substrate and a molding rind. The transparent conducting substrate has an inner surface and an outer surface. The inner surface has a capacitive electrode layer formed thereon. The capacitive electrode layer is a touch sense circuit made of ITO, and the outer surface is configured for touching the touch sense circuit. The molding rind is integrated to contain a periphery of the transparent conducting substrate by an in-mould injecting mode. | 04-09-2009 |
20090101489 | IN-MOULD MOLDING TOUCH MODULE AND METHOD FOR MANUFACTURING THE SAME - An in-mould molding touch module includes a plastic film, a touch circuit and a molding rind. The plastic film includes an inner surface and an outer surface for handling and touching. At least one region of the inner surface and a corresponding region of the outer surface define a touch area. The touch circuit is arranged on the inner surface in the touch area. The molding rind is integrated on the inner surface by an in-mould injecting mode to contain the touch circuit for forming a one-piece body. In addition, the invention also provides a method for manufacturing an in-mould molding touch module. | 04-23-2009 |
20110186422 | IN-MOULD MOLDING TOUCH MODULE AND METHOD FOR MANUFACTURING THE SAME - An in-mould molding touch module includes a plastic film, a touch circuit and a molding rind. The plastic film includes an inner surface and an outer surface for handling and touching. At least one region of the inner surface and a corresponding region of the outer surface define a touch area. The touch circuit is arranged on the inner surface in the touch area. The molding rind is integrated on the inner surface by an in-mould injecting mode to contain the touch circuit for forming a one-piece body. In addition, the invention also provides a method for manufacturing an in-mould molding touch module. | 08-04-2011 |
20120138451 | IN-MOULD MOLDING TOUCH MODULE AND METHOD FOR MANUFACTURING THE SAME - An in-mould molding touch module includes a plastic film, a touch circuit and a molding rind. The plastic film includes an inner surface and an outer surface for handling and touching. At least one region of the inner surface and a corresponding region of the outer surface define a touch area. The touch circuit is arranged on the inner surface in the touch area. The molding rind is integrated on the inner surface by an in-mould injecting mode to contain the touch circuit for forming a one-piece body. In addition, the invention also provides a method for manufacturing an in-mould molding touch module. | 06-07-2012 |