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Lee, Sindian City
Bo-I Lee, Sindian City TW
| Patent application number | Description | Published |
|---|---|---|
| 20100015792 | Bonding Metallurgy for Three-Dimensional Interconnect - A method provides a first substrate with a conductive pad and disposes layers of Cu, TaN, and AlCu, respectively, forming a conductive stack on the conductive pad. The AlCu layer of the first substrate is bonded to a through substrate via (TSV) structure of a second substrate, wherein a conductive path is formed from the conductive pad of the first substrate to the TSV structure of the second substrate. | 01-21-2010 |
| 20100047963 | Through Silicon Via Bonding Structure - System and method for bonding semiconductor substrates is presented. A preferred embodiment comprises forming a buffer layer over a surface of a semiconductor substrate while retaining TSVs that protrude from the buffer layer in order to prevent potential voids that might form. A protective layer is formed on another semiconductor substrate that will be bonded to the first semiconductor substrate. The two substrates are aligned and bonded together, with the buffer layer preventing any short circuit contacts to the surface of the original semiconductor substrate. | 02-25-2010 |
| 20110051378 | Wafer-Level Molded Structure for Package Assembly - An integrated circuit structure includes a bottom die; a top die bonded to the bottom die with the top die having a size smaller than the bottom die; and a molding compound over the bottom die and the top die. The molding compound contacts edges of the top die. The edges of the bottom die are vertically aligned to respective edges of the molding compound. | 03-03-2011 |
| 20110058346 | Bonding Metallurgy for Three-Dimensional Interconnect - A method provides a first substrate with a conductive pad and disposes layers of Cu, TaN, and AlCu, respectively, forming a conductive stack on the conductive pad. The AlCu layer of the first substrate is bonded to a through substrate via (TSV) structure of a second substrate, wherein a conductive path is formed from the conductive pad of the first substrate to the TSV structure of the second substrate. | 03-10-2011 |
| 20110062592 | Delamination Resistance of Stacked Dies in Die Saw - An integrated circuit structure includes a first die including TSVs; a second die over and bonded to the first die, with the first die having a surface facing the second die; and a molding compound including a portion over the first die and the second die. The molding compound contacts the surface of the second die. Further, the molding compound includes a portion extending below the surface of the second die. | 03-17-2011 |
Bo-L Lee, Sindian City TW
| Patent application number | Description | Published |
|---|---|---|
| 20100279463 | METHOD OF FORMING STACKED-DIE PACKAGES - A method of forming a stacked die structure is disclosed. A plurality of dies are respectively bonded to a plurality of semiconductor chips on a first surface of a wafer. An encapsulation structure is formed over the plurality of dies and the first surface of the wafer. The encapsulation structure covers a central portion of the first surface of the wafer and leaves an edge portion of the wafer exposed. A protective material is formed over the first surface of the edge portion of the wafer. | 11-04-2010 |
Chen Ta Lee, Sindian City TW
| Patent application number | Description | Published |
|---|---|---|
| 20090133418 | Plug-in circuit and cooling system thereof - The present invention relates to a plug-in circuit and a cooling system thereof. The cooling system includes the plug-in circuit, an external terminal and an alternating current (AC) compressor, wherein the plug-in circuit includes an AC to AC inverter and an inverter control circuit. The AC to AC inverter is coupled to and between the external terminal and the AC compressor for converting an external AC voltage received by the external terminal to an internal AC voltage to supply to the AC compressor. The inverter control circuit is coupled to the AC to AC inverter for outputting a control signal to the AC to AC inverter to control the frequency of the internal AC voltage according to an external parameter. | 05-28-2009 |
Ching Chuan Lee, Sindian City TW
| Patent application number | Description | Published |
|---|---|---|
| 20090267532 | DIMMABLE CONTROL CIRCUIT - The present invention relates to a dimmable control circuit, comprising: an ac power source; a transformer; a rectifier circuit; a dimmable control chip; a voltage dividing circuit; a dimmable switch; a first resistor; a second resistor; and a half bridge power driving circuit, capable of outputting signals to drive a fluorescent tube, characterized in that said dimmable switch has a coactive variable resistor connected in parallel with said first resistor and said second resistor, and both said first resistor and said second resistor have the negative resistance temperature coefficient to achieve low temperature startup and high temperature operation. | 10-29-2009 |
| 20090267533 | EXPANDABLE LED MODULE FOR ARBITRARILY DISPLAY ASSEMBLY - An expandable LED module for arbitrary display assembly, comprises: a print circuit board, used to carry the following devices; at least a light emitting diode, disposed on said print circuit board; a first connecting device, disposed on one side of said print circuit board and coupled to said light emitting diode; and a second connecting device, disposed on the other side of said print circuit board, coupled to said light emitting diode, and capable of interconnecting with said first connecting device, wherein said first connecting device and second connecting device can be utilized to expand said LED modules to accomplish any assembly indicating figures, words, numbers, or symbols. | 10-29-2009 |
| 20100240230 | POWER PLUG - The present invention relates to a power plug, comprises: a magnetic conductive ring; a grounding insulation supporting ring; a grounding ring connection seat, a grounding connection sheet is extended from one end of the grounding ring connection seat; a power insulation supporting ring; a power ring connection seat, a power connection sheet is extended from one end of the power ring connection seat; an insulation supporting ring; an identifying connection seat; an insulation retaining ring and a cable housing. The identifying connection seat and the power ring connection seat and the grounding ring connection seat are assembled in a manner of a ring being provided on other rings therefore a 360 degree nondirectional power plug is obtained. | 09-23-2010 |
Chris Lee, Sindian City TW
| Patent application number | Description | Published |
|---|---|---|
| 20110214842 | HEAT SINK - A heat sink has a fin set and at least one heat pipe. The fin set has multiple stacked fins and at least one tapered tube. Each fin has at least one protrusion. The at least one protrusion protrudes from each fin and each protrusion has an internal surface. The at least one tapered tube is defined through corresponding protrusions of the fins. The at least one heat pipe has at least one tapered arm and a pipe wall. The tapered arm corresponds to and is mounted through a corresponding tapered tube of the fin set. The pipe wall of the heat pipe abuts the internal surfaces of corresponding protrusions of the fins tightly so heat can be dissipated efficiently during use. | 09-08-2011 |
Chung-Heng Lee, Sindian City TW
| Patent application number | Description | Published |
|---|---|---|
| 20090159634 | POWDER-ACTUATED FASTENER-DRIVING TOOL - A powder-actuated fastener-driving tool includes a barrel unit inserted movably into a housing, a holder disposed movably in the housing, abutting against the barrel unit and having a through hole defined by an inner annular surface, and a spring-loaded firing pin disposed fixedly in the housing, having a free end portion extending into the through hole in the holder, and movable among normal and standby positions, where the firing pin is inclined due to engagement between the free end portion thereof and the shoulder portion of the holder, and a firing position. When a trigger unit mounted on the housing is operated to switch the firing pin from the standby position to the firing position, the free end portion of the firing pin disengages the shoulder portion of the holder to move frontwardly to thereby contact and ignite gunpowder in a chamber in a rear end portion of the barrel unit. | 06-25-2009 |
Jeng-Farn Lee, Sindian City TW
| Patent application number | Description | Published |
|---|---|---|
| 20090268718 | COMMUNICATION METHOD AND SYSTEM OF INTERNET - An Internet communication system including a first access point, a second access point, a first caller and a first callee is provided. The first access point and the second access point are respectively located in a first LAN and a second LAN. The first caller, having a probing-based mechanism, accesses the Internet via the first access point and has voice packets with a first transmission priority. The first callee accesses the Internet via the second access point. The first caller transmits a simulation packet to the first callee for probing a transmission quality of an end-to-end transmission path of the first caller and the first callee to determine whether to invite the first callee to communicate via the Internet. | 10-29-2009 |
Ming-Han Lee, Sindian City TW
| Patent application number | Description | Published |
|---|---|---|
| 20080291068 | CURRENT OUTPUT CIRCUIT WITH BIAS CONTROL AND METHOD THEREOF - A current output circuit with bias control and a method thereof are provided. The current output circuit includes a current mirror circuit comprising a first transistor and a second transistor having respectively two drains, and a control circuit coupled to the current mirror circuit. The control circuit receives drain voltages of the first transistor and the second transistor, and adjusts a respective gate bias of the first transistor and the second transistor according to a respective drain voltage thereof. | 11-27-2008 |
Min-Yi Lee, Sindian City TW
| Patent application number | Description | Published |
|---|---|---|
| 20090090000 | In-mould molding touch module and method for manufacturing the same - An in-mould molding touch module includes a transparent conducting substrate and a molding rind. The transparent conducting substrate has an inner surface and an outer surface. The inner surface has a capacitive electrode layer formed thereon. The capacitive electrode layer is a touch sense circuit made of ITO, and the outer surface is configured for touching the touch sense circuit. The molding rind is integrated to contain a periphery of the transparent conducting substrate by an in-mould injecting mode. | 04-09-2009 |
| 20090101489 | IN-MOULD MOLDING TOUCH MODULE AND METHOD FOR MANUFACTURING THE SAME - An in-mould molding touch module includes a plastic film, a touch circuit and a molding rind. The plastic film includes an inner surface and an outer surface for handling and touching. At least one region of the inner surface and a corresponding region of the outer surface define a touch area. The touch circuit is arranged on the inner surface in the touch area. The molding rind is integrated on the inner surface by an in-mould injecting mode to contain the touch circuit for forming a one-piece body. In addition, the invention also provides a method for manufacturing an in-mould molding touch module. | 04-23-2009 |
| 20110186422 | IN-MOULD MOLDING TOUCH MODULE AND METHOD FOR MANUFACTURING THE SAME - An in-mould molding touch module includes a plastic film, a touch circuit and a molding rind. The plastic film includes an inner surface and an outer surface for handling and touching. At least one region of the inner surface and a corresponding region of the outer surface define a touch area. The touch circuit is arranged on the inner surface in the touch area. The molding rind is integrated on the inner surface by an in-mould injecting mode to contain the touch circuit for forming a one-piece body. In addition, the invention also provides a method for manufacturing an in-mould molding touch module. | 08-04-2011 |
Pen-Jung Lee, Sindian City TW
| Patent application number | Description | Published |
|---|---|---|
| 20110096219 | IMAGE SENSOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME - An image sensor package includes a substrate, an image sensor chip, a plurality of metal wires and an encapsulant. The substrate has an upper face, a lower face and a plurality of connecting pads arranged on the upper face. The image sensor chip has an active surface, a back surface opposite to the active surface and a plurality of bonding pads arranged on the active surface. The metal wires electrically connect the bonding pads of the image sensor chip to the connecting pads of the substrate. The transparent cover is arranged above the image sensor chip. A gap is formed between the transparent cover and the image sensor chip. The encapsulant is disposed around the transparent cover and the metal wires, and is used for sealing the metal wires and fixing the transparent cover above the image sensor chip. | 04-28-2011 |
Ronald Lee, Sindian City TW
| Patent application number | Description | Published |
|---|---|---|
| 20090313130 | Credit card signature inspection system and method capable of enhancing security for transaction - A credit card signature inspection system includes a card-sliding device and a credit card server. The card-sliding device produces a signature authentication request including credit card data and produces a bill to be signed. The credit card server includes a credit card database pre-stored with data of credit cards. Data of each credit card corresponds to an authentication signature of a credit card holder. The credit card server receives the signature authentication request and searches the credit card database based on the credit card data in the signature authentication request to produce an authentication signature corresponding to the credit card data. The authentication signature is transferred to the card-sliding device and displayed on the card-sliding device to check whether the authentication signature on the card-sliding device corresponds to the signature of the consumer for the bill, so as to determine whether to approve the proceeding of the transaction. | 12-17-2009 |
| 20100076942 | Food nutrition management system and method - A food nutrition management system provides a portable electronic device to a user for inputting a personal data and special codes. The personal data and the special codes are received by a register and management unit for further registering at a database. The database is searched for a food nutrition component table corresponding to a special code. The food nutrition component table searched is transmitted for displaying on a display unit, stored in the database when a store instruction is input through the portable device, and analyzed and compared with a suggestion of daily ingestion amounts per person for a variety of nutrition when an inquiry instruction is input. The portable electronic device displays current and past ingestion amounts for the variety of nutrition and notices the user of which nutrition is insufficient or surplus and of the possible diseases and symptoms. | 03-25-2010 |
Tsai-Yun Lee, Sindian City TW
| Patent application number | Description | Published |
|---|---|---|
| 20110139634 | SYSTEM AND METHOD FOR MEASURING ANALYTE CONCENTRATION WITH INTERFERANT CORRECTION - The present invention is related to an electrochemical biosensing test strip, biosensing meter, system and method for analyte measurement incorporating a hematocrit correction. The biosensor strip comprises a first and a second electrode sets respectively for detecting analyte concentration and hematocrit level. The first and second electrode sets are respectively corresponding to different reaction zones and a reaction reagent is only formed on the first electrode set corresponding reaction zone. Applying a first signal comprising a DC component and a second signal comprising an AC component that has a constant frequency respectively to the first and second electrode sets can respectively detect an uncorrected analyte concentration and hematocrit level. Therefore, the corrected analyte concentration is more accurate by incorporating the hematocrit correction. | 06-16-2011 |
Ying-Jui Lee, Sindian City TW
| Patent application number | Description | Published |
|---|---|---|
| 20110272878 | MEDIA PICK SYSTEM AND MEDIA PICK METHOD THEREOF - A media pick system includes a pick-up rack, a pick-up roller, a separate roller, a swing gear arm, a swing gear lever, and a part of action. While the separate roller and the swing gear arm are driven to rotate, the swing gear lever would be driven to rotate. Therefore, while the torque generated on the pick-up rack by the part of action so that the pick-up rack could be lifted up or pushed down to pick up the media. | 11-10-2011 |