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Lee, MY
Beng Siong Lee, Ampang MY
| Patent application number | Description | Published |
|---|---|---|
| 20120104583 | SEMICONDUCTOR DEVICE AND METHOD OF PACKAGING SAME - A semiconductor device includes a lead frame that has a die interconnect portion and at least first and second die pads. The die interconnect portion is isolated from the die pads. The device also includes a first die and a second die attached to the first and second die pads and electrically connected to each other by way of the die interconnect portion. The first die is encapsulated in a first medium and the second die is encapsulated in a second medium, the first medium being different from the second medium. | 05-03-2012 |
Boon Seong Lee, Malacca MY
| Patent application number | Description | Published |
|---|---|---|
| 20100281993 | PRESSURE SENSOR PACKAGE - A semiconductor package ( | 11-11-2010 |
Chee Hian Lee, Alor Star MY
| Patent application number | Description | Published |
|---|---|---|
| 20090233467 | Circuit board connector assembly and method for assembling such an assembly - A circuit board connector assembly mounted in a housing and method of mounting are described. The assembly has orthogonal first and second circuit boards (CB). The CB has a CB connector containing a CB housing with CB electrical contacts. A flexible electrical link has a link connector mounted in a link connector housing with link electrical contacts. A resilient pad is mounted on a link connector housing and a flexible sheet is mounted to both the pad and the link. The sheet spans a length of the link. When the length of the link is substantially planar, the sheet provides a ramp tapering away from the pad. During mounting of the assembly in the housing, the CB connector is operatively coupled to the link connector thereby forming a first connector assembly, and an abutment edge of the second circuit board slidably engages the sheet thereby compressing the pad. | 09-17-2009 |
Chooi Tian Lee, Melaka MY
| Patent application number | Description | Published |
|---|---|---|
| 20100217201 | DEVICE FOR PROTECTING AND SECURING MEDICAL DEVICE AT A VENIPUNCTURE SITE - A device for protecting and securing at least a medical device at a venipuncture site and having at least a supporting member in which the medical tube winds around to form a loop, and having restrictor members to retain the loop formed around an arch-shaped passageway. The device is pivotally movable between an open position wherein the venipuncture site is exposed and a close position wherein the venipuncture site is covered and protected. The device further includes a fastening member to secure the device to the patient. | 08-26-2010 |
Chun-Keong Lee, Perak MY
| Patent application number | Description | Published |
|---|---|---|
| 20080315906 | FAULTY DANGLING METAL ROUTE DETECTION - A system is provided that facilitates locating long dangling metal routes in a semiconductor chip design. The system includes mechanisms for partitioning metal features of the chip design to discover dangling metal routes that could be potential violations. The system further comprises mechanisms for determining if the dangling metal routes of the chip design exceed a length limit that could result antenna violations, undesired noise in the circuit, circuitry breakdown or the like. The system enables excessively long dangling metal routes to be allowed as exceptional cases. Machine learning is provided to receive feedback to refine the exceptional cases and enable more efficient fault detection. | 12-25-2008 |
Eu Soon Lee, Kuala Lumpur MY
| Patent application number | Description | Published |
|---|---|---|
| 20100134992 | Embedding Thin Film Resistors in Substrates in Power Delivery Networks - Using die side capacitors and embedded resistors, an advantageous power delivery network may be achieved. In some embodiments, the embedded resistors may be more precisely controllable. The number of die side capacitors may be reduced by combining embedded resistors with these capacitors to reduce costs. The embedded resistors may be provided within the metallization layers either at an upper layer or a lower layer, as two examples. | 06-03-2010 |
Heng Soon Lee, Selangor MY
| Patent application number | Description | Published |
|---|---|---|
| 20100089563 | VEHICLE AIR CONDITIONING IMPROVEMENT - The present device is a temperature regulation system for a vehicle turned on or off. The temperature regulation system includes a rechargeable battery for supplying power to an air moving system and a heat exchanger in accordance with demand signals from the thermostat, independent of the on/off state of the ignition system. In one embodiment, a DC motor is electrically connected to the rechargeable battery and rotationally coupled to a variable-speed compressor replacing the existing compressor of the vehicle, improving efficiency and extending the use of the rechargeable battery. The temperature regulation system may be used to heat or to cool the vehicle when the temperature of the air in the vehicle exceeds a certain threshold. | 04-15-2010 |
Hong Boon Lee, Subang Jaya MY
| Patent application number | Description | Published |
|---|---|---|
| 20110212955 | ROSAMINE DERIVATIVES AS AGENTS FOR THE TREATMENT OF CANCER - The present invention relates to a new class of rosamine derivatives, in one embodiment, the compounds have the structure (I) or any pharmaceutically acceptable salt or solvate thereof, wherein: R | 09-01-2011 |
Hung Kwang Lee, Pengang MY
| Patent application number | Description | Published |
|---|---|---|
| 20100079408 | USER INPUT DEVICE WITH PLANAR LIGHT GUIDE ILLUMINATION PLATE - A user input device to generate an optical navigation signal based on an edge-lit pattern. The user input device includes an optical element, a light source, a sensor array, and a navigation engine. The optical element includes a finger interface surface. At least a portion of the optical element exhibits total internal reflection (TIR). The light source provides light to the finger interface surface. The sensor array detects light reflected from the finger interface surface in response to contact between a finger and the finger interface surface. The contact between the finger and the finger interface surface disrupts the TIR and causes light to be reflected out of the optical element towards the sensor array. The navigation engine generates lateral movement information, which is indicative of lateral movement of the finger relative to the sensor array, in response to the detected light. | 04-01-2010 |
Hun Kwang Lee, Simpang Ampat MY
| Patent application number | Description | Published |
|---|---|---|
| 20090279270 | DUAL-CHANNEL OPTICAL NAVIGATION DEVICE - A dual-channel optical navigation system with vertically aligned sensors. The dual-channel optical navigation system includes a circuit board, a contact navigation sensor, and a free-space navigation sensor. The circuit board mechanically supports and electrically connects multiple navigation sensors on opposing sides of the circuit board. The contact navigation sensor is coupled to a first side of the circuit board. The contact navigation sensor generates a contact navigation signal based on contact navigation images of a contact navigation surface approximately adjacent to the dual-channel optical navigation system. The free-space navigation sensor is coupled to a second side of the circuit board. The free-space navigation sensor generates a free-space navigation signal based on free-space navigation images of an operating environment of the dual-channel optical navigation system. | 11-12-2009 |
| 20110267268 | BACKLIGHTING FOR OPTICAL FINGER NAVIGATION - An optical finger navigation (OFN) device includes an OFN sensor module, a light source, and a vertical light guide. The OFN sensor module is coupled to a circuit substrate. The OFN sensor module generates a navigation signal in response to a movement detected at a navigation surface based on light reflected from a user's finger. The light source is also coupled to the circuit substrate. The light source generates light (which is separate from the light generated for the OFN sensor module). The vertical light guide is disposed to circumscribe a perimeter of the OFN sensor module. The vertical light guide receives the light from the light source and guides the light toward a light emission surface at a perimeter surface area circumscribing the navigation surface. | 11-03-2011 |
Hun Kwang Lee, Seberang Perai Selatan MY
| Patent application number | Description | Published |
|---|---|---|
| 20100289775 | FINGER NAVIGATION DEVICE - A finger navigation device is disclosed herein. An embodiment of the navigation device comprises a substrate; a light emitter located on the substrate; a photosensor located on the substrate; and a first cover located above the light emitter and the photosensor. The first cover has a first side and a second side, wherein the first side faces the substrate. A first lens is located in the first cover proximate the light emitter. An aperture is located in the first cover proximate the photosensor. A second cover faces the first side of the first cover and has a second lens proximate a transparent portion. A first light path extends between the light emitter and the first lens. A second light path extends between the first lens and the second lens. A third light path extends between the second lens and the transparent portion. A fourth light path extends between the transparent portion and the photosensor through the aperture. | 11-18-2010 |
Joon Chok Lee, Kuching Sarawak MY
| Patent application number | Description | Published |
|---|---|---|
| 20080238335 | Light Source Having a Plurality of White LEDs with Different Output Spectra - A solid state light source having first and second component light sources and an interface circuit and a method for making the same are disclosed. The first and second component light sources emit light having first and second color points on different sides of the black body radiation curve. The first and second component light sources include LEDs that emit light of a first wavelength and a layer of a light converting material that converts a portion of that light to light of a second wavelength. The interface circuit powers the first and second component light sources such that the solid state light source has a color point that is closer to the black body radiation curve than either the first or second color points. A third component light source can be included to expand the range of white color temperatures that can be reached by the light source. | 10-02-2008 |
Joon Chok Lee, Sarawak MY
| Patent application number | Description | Published |
|---|---|---|
| 20080204382 | COLOR MANAGEMENT CONTROLLER FOR CONSTANT COLOR POINT IN A FIELD SEQUENTIAL LIGHTING SYSTEM - A color management system for a field sequential lighting system. The color management system includes a plurality of light sources, a driver circuit, and a controller. The driver circuit is coupled to the plurality of light sources, and the controller is coupled to the driver circuit. The driver circuit drives the plurality of light sources. The controller generates first and second control signals for a first subframe of a temporal sequence of subframes. The first control signal corresponds to a first light source of a first color which is a primary color for the first subframe. The second control signal corresponds to a second light source of a second color which is a supplemental color for the first subframe. Embodiments of the color management system maintain a color point of the primary color of each subframe. | 08-28-2008 |
| 20090090843 | Illumination and Color Management System - Systems and methods for illumination and color management in a system having a plurality of color sources and a plurality of color sensors, wherein there are more color sources than color sensors are described herein. An embodiment of the method includes emitting a plurality of different colors of light from at least two of the color sources, wherein the plurality of colors consist of different intensities of light emitted by the plurality of color sources. Colors of light emitted by the at least two color sources are detected using at least one of the color sensors. The color rendering index for each of the plurality of colors emitted is determined. A color of light to be emitted by the light sources is selected. The intensities of light to be emitted by the color sources is selected, based at least in part on the color rendering index, to achieve the selected color of light. | 04-09-2009 |
Kah Soon Lee, Ipoh MY
| Patent application number | Description | Published |
|---|---|---|
| 20110107359 | Apparatus and methods for managing connection cables of portable optical drives - Apparatus and methods for managing a connection cable that is used for interconnecting a small form factor (SFF) portable optical disk drive (ODD) or other similarly configured ODD to an information handling system such as notebook or desktop computer. A retractable fixed connection cable may be provided inside an internal cavity within the external enclosure of a portable ODD apparatus that has an inner chassis with a disk receiving section that is configured to receive an optical disk media and that extends beyond the outer boundary of an electronics section of the inner chassis of an ODD that contains electronic components so as to form a cut-out section that defines the internal cavity between the inner ODD chassis and the inside of an outer ODD enclosure when these components are assembled together. | 05-05-2011 |
Kean Cheong Lee, Melaka MY
| Patent application number | Description | Published |
|---|---|---|
| 20080290484 | Leadframe Strip and Mold Apparatus for an Electronic Component and Method of Encapsulating an Electronic Component - A leadframe strip comprises a plurality of units arranged in a line. Each unit provides two component positions, each having a chip support substrate. The chip support substrates of the two component positions are mechanically linked by at least one support bar. The two component positions of a unit are molded at essentially the same time to produce a plastic housing for a package in each component position. The central portion of the first support bars remains outside of the plastic housing of the two packages. | 11-27-2008 |
| 20090001535 | Semiconductor Module for a Switched-Mode Power Supply and Method for Its Assembly - Semiconductor module for a Switched-Mode Power Supply comprises at least one semiconductor power switch, a control semiconductor chip and a leadframe comprising a die pad and a plurality of leads disposed on one side of the die pad. The die pad comprises at least two mechanically isolated regions wherein the semiconductor power switch is mounted on a first region of the die pad and the control semiconductor chip is mounted on a second region of the die pad. Plastic housing material electrically isolates the first region and the second region of the die pad and electrically isolates the semiconductor power switch from the control semiconductor chip. | 01-01-2009 |
| 20090051017 | Lead Frame with Non-Conductive Connective Bar - An electronic component includes a lead frame, a semiconductor chip and an encapsulating body. The lead frame includes a heat spreader area, a plurality of conductive lead fingers, at least one non-conductive tie bar, and a metal joint. The metal joint connects the at least one non-conductive tie bar to the heat spreader area. The semiconductor chip is provided on a die pad located on the heat spreader area. The encapsulating body covers at least part of the semiconductor chip, at least part of the at least one non-conductive tie bar and part of the lead frame. | 02-26-2009 |
Kee Hon Lee, Kuala Lumpur MY
| Patent application number | Description | Published |
|---|---|---|
| 20100289055 | SILICONE LEADED CHIP CARRIER - In an embodiment, the invention provides a SLCC package comprising first and second electrically conductive terminals, a polysiloxane and glass fiber structural body, a light source and a polysiloxane encapsulant. The first and second electrically conductive terminals are attached to the polysiloxane and glass fiber structural body. The light source is electrically connected to the first and second electrically conductive terminals. The polysiloxane and glass fiber structural body has a cavity that contains at least a portion of the polysiloxane encapsulant. | 11-18-2010 |
| 20110176573 | Silicone Leaded Chip Carrier - In an embodiment, the invention provides a SLCC package comprising first and second electrically conductive terminals, a polysiloxane and glass fiber structural body, a light source and a polysiloxane encapsulant. The first and second electrically conductive terminals are attached to the polysiloxane and glass fiber structural body. The light source is electrically connected to the first and second electrically conductive terminals. The polysiloxane and glass fiber structural body has a cavity that contains at least a portion of the polysiloxane encapsulant. | 07-21-2011 |
Khee Wooi Lee, Pulau Pinang MY
| Patent application number | Description | Published |
|---|---|---|
| 20110320742 | METHOD, APPARATUS AND SYSTEM FOR GENERATING ACCESS INFORMATION FROM AN LRU TRACKING LIST - Techniques for generating access information indicating a least recently used (LRU) memory region in a set of memory regions. In an embodiment, data is stored in an entry of an LRU tracking list (LTL) based on a touch message indicating when a memory group has been touched—e.g. read from, written to and/or associated with a memory region. The data stored in an LTL entry may include an identifier of a memory group and/or validity data specifying whether that LTL entry stores a set of default data. In another embodiment, access information may be generated based on the memory group identifier and the validity data. | 12-29-2011 |
| 20120005386 | METHOD, APPARATUS AND SYSTEM FOR MAINTAINING TRANSACTION COHERECY IN A MULTIPLE DATA BUS PLATFORM - Techniques for maintaining an order of transactions in a multi-bus computer architecture. In an embodiment, an arbitrator receives access requests from a plurality of requestors, each access request requesting a respective access to a bus. Based on an arbitration between the access requests—e.g. between those requestors providing the access requests—the arbitrator may generate a grant message which triggers a carrying of a first message on the first bus. In certain embodiments, the grant message further triggers another carrying of the first message on the second bus. | 01-05-2012 |
Kim Meow Lee, Selangor Darul Ehsan MY
| Patent application number | Description | Published |
|---|---|---|
| 20090176088 | NITRILE GLOVE - Nitrile rubber compositions and articles of manufacture made therefrom are disclosed. The resulting articles of manufacture, including gloves have ultimate tensile strength and lower modulus which are soft but strong and can be economically manufactured. | 07-09-2009 |
Kock Huat Lee, Ipoh MY
| Patent application number | Description | Published |
|---|---|---|
| 20080286901 | Method of Making Integrated Circuit Package with Transparent Encapsulant - A method for making an IC package with transparent encapsulant includes providing a leadframe, where the leadframe includes a first die pad and a second die pad, disposing a first die on the first die pad and a second die on the second die pad, forming a cavity on the leadframe, where the cavity includes the first die pad and the second die pad, injecting an encapsulant material into the cavity and cutting the injected encapsulant material and the leadframe to form a first IC package and a second IC package. The encapsulant material is transparent for visible wavelengths. The injection of the encapsulant material is performed at an encapsulant temperature ranging from 140° C. to 160° C. | 11-20-2008 |
Kok Hua Lee, Shah Alam MY
| Patent application number | Description | Published |
|---|---|---|
| 20110043234 | SOCKET CONNECTOR FOR CONNECTION LEAD OF SEMICONDUCTOR DEVICE UNDER TEST WITH TESTER - A socket connector for electrically connecting a lead of a semiconductor device under test (DUT) with a tester includes a container having a chamber, a conductive end or plug that seals the chamber at one end, and a conductive membrane that seals the chamber at another end. A liquid conductive material fills the chamber. The conductive plug is arranged to be in electrical contact with the tester. The lead of the semiconductor DUT is in electrical contact with the conductive membrane and thus with the tester via the conductive membrane, the liquid conductive material and the conductive plug. | 02-24-2011 |
Kok Hua Lee, Petaling Jaya MY
| Patent application number | Description | Published |
|---|---|---|
| 20100315109 | BURN-IN SYSTEM FOR ELECTRONIC DEVICES - A burn-in system ( | 12-16-2010 |
Kok Peng Lee, Puchong MY
| Patent application number | Description | Published |
|---|---|---|
| 20100229084 | RAPID SOFTWARE REPORT DEVELOPMENT TOOL WITH AUTO DATABASE HANDLING AND MENU TOOL-BAR PLUG-IN FOR APPLICATION REPORT ACCESS - A method is provided for generating reports for a computer monitored or aided environment that has a server-side module, a client-side module and a database, the server-side module, client-side module and database being interconnected, The method includes creating a report layout, the report layout containing a predefined number of dynamic fields at predetermined positions; associating, at the server-side, each dynamic field with a data source; collecting, at the server-side, information for each dynamic field according to the associated data source; storing the information in the database; and displaying the information for each dynamic field on a display according to the report layout. The report layout is shared universally for the generation of a displayed report and a printed report. | 09-09-2010 |
Kok-Wah Lee, Melaka MY
| Patent application number | Description | Published |
|---|---|---|
| 20110055585 | Methods and Systems to Create Big Memorizable Secrets and Their Applications in Information Engineering - Main invention is methods and systems to create big and yet memorizable secret, which are later applied into many novel and innovated applications in information engineering. Among the big secret creation methods are (i) self-created signature-like Chinese character, (ii) two-dimensional key (2D key), (iii) multilingual key, (iv) multi-tier geo-image key, (v) multi-factor key using software token, and their hybrid combinations. Multihash key using hash iteration and hash truncation is further used to increase number of created secret for multiple offline and online accounts. Besides, multihash signature using multiple hash values of a message from different hash iteration provides object-designated signature function. The object may be recipient, action, feature, function, meaning, etc., as representation. Also, random space steganography using stego-data with random noise insertion is proposed. The main application of big memorizable secret is MePKC (Memorizable Public-Key Cryptography) using fully memorizable private key. Here, 160- to 512-bit MePKC can be realized. | 03-03-2011 |
Kwee Hui Lee, Sungai Buloh MY
| Patent application number | Description | Published |
|---|---|---|
| 20100229084 | RAPID SOFTWARE REPORT DEVELOPMENT TOOL WITH AUTO DATABASE HANDLING AND MENU TOOL-BAR PLUG-IN FOR APPLICATION REPORT ACCESS - A method is provided for generating reports for a computer monitored or aided environment that has a server-side module, a client-side module and a database, the server-side module, client-side module and database being interconnected, The method includes creating a report layout, the report layout containing a predefined number of dynamic fields at predetermined positions; associating, at the server-side, each dynamic field with a data source; collecting, at the server-side, information for each dynamic field according to the associated data source; storing the information in the database; and displaying the information for each dynamic field on a display according to the report layout. The report layout is shared universally for the generation of a displayed report and a printed report. | 09-09-2010 |
Lee Han Meng@eugene Lee, Muar MY
| Patent application number | Description | Published |
|---|---|---|
| 20120080781 | DELAMINATION RESISTANT DEVICE PACKAGE HAVING RAISED BOND SURFACE AND MOLD LOCKING APERTURE - A semiconductor package configured to attain a thin profile and low moisture sensitivity. Packages of this invention can include a semiconductor die mounted on a die attachment site of a leadframe and further connected with a plurality of elongate I/O leads arranged about the die attach pad and extending in said first direction. The leadframe having an “up-set” bonding pad arranged with a bonding support for supporting a plurality of wire bonds and a large mold flow aperture in the up-set bonding pad. The package encapsulated in a mold material that surrounds the bonding support and flows through the large mold flow aperture to establish well supported wire bonds such that the package has low moisture sensitivity. | 04-05-2012 |
Lee Han Meng Eugene Lee, Muar MY
| Patent application number | Description | Published |
|---|---|---|
| 20110140249 | TIE BAR AND MOLD CAVITY BAR ARRANGEMENTS FOR MULTIPLE LEADFRAME STACK PACKAGE - A semiconductor chip package having multiple leadframes is disclosed. Packages can include a first leadframe having a first plurality of electrical leads and a die attach pad having a plurality of tie bars, a second leadframe generally parallel to the first leadframe and having a second plurality of electrical leads, and a mold or encapsulant. Tie bars can be located on three main sides of the die attach pad, but not the fourth main side. Gaps in the first and second plurality of electrical leads can be enlarged or aligned with each other to enable the elimination of mold flash outside the encapsulated region, which can be accomplished with mold cavity bar protrusions. Additional components can include a primary die, a secondary die, an inductor and/or a capacitor. The first and second leadframes can be substantially stacked atop one another, and one or both leadframes can be leadless leadframes. | 06-16-2011 |
| 20110140253 | DAP GROUND BOND ENHANCEMENT - A variety of semiconductor package arrangements and packaging methods are described that improve the reliability of bonding wires that down bond a die to a die attach pad. In one aspect, selected portions of the top surface of a lead frame (which may be in panel form) are plated (e.g., silver plated) to facilitate wire bonding. The plating covers some, but not all of a die attach surface of the die attach pad. In some preferred embodiments, the plating on the die attach pad is arranged as a peripheral ring that surrounds an unplated central region of the die support surface. In other embodiments, the plating on the die attach pad takes the form of bars or other geometric patterns that do not fully cover the die support surface. Unplated portions of the die support surface are roughened to improve the adherence of the die to the die attach pad, thereby reducing the probability of die attach pad delamination and the associated risks to down bonded bonding wires. The described lead frames may be used in a variety of packages. Most commonly, a die is attached to the die support surface of the die attach pad and electrically connected to the lead frame leads by wire bonding as appropriate. At least one of the die's bond pads (typically the ground bond pad(s)) is down bonded to the die attach pad. The die, the bonding wires and at least portions of the lead frame are then typically encapsulated with a plastic encapsulant material while leaving a contact surface of the die attach pad exposed to facilitate electrically coupling the die attach pad to an external device. | 06-16-2011 |
| 20110140262 | MODULE PACKAGE WITH EMBEDDED SUBSTRATE AND LEADFRAME - An integrated circuit package is described that includes a substrate, a leadframe and one or more integrated circuits that are positioned between the substrate and the leadframe. Multiple electrical components may be attached to one or both sides of the substrate. The active face of the integrated circuit is electrically and physically connected to the substrate. The back side of the integrated circuit is mounted on a die attach pad of the leadframe. The leadframe includes multiple leads that are physically attached to and electrically coupled with the substrate. A molding material encapsulates portions of the substrate, the leadframe and the integrated circuit. Methods for forming such packages are also described. | 06-16-2011 |
Lee Han Meng Eugene Lee, Johor MY
| Patent application number | Description | Published |
|---|---|---|
| 20110089556 | LEADFRAME PACKAGES HAVING ENHANCED GROUND-BOND RELIABILITY - Various semiconductor package arrangements and methods that improve the reliability of wire bonding a die to ground or other outside contacts are described. In one aspect, selected ground pads on the die are wire bonded to a bonding region located on the tie bar portion of the lead frame. The tie bar is connected to an exposed die attach pad that is downset from the bonding region of the tie bar. In some embodiments, the bonding region and the leads are at substantially the same elevation above the die and die attach pad. The die, bonding wires, and at least a portion of the lead frame can be encapsulated with a plastic encapsulant material while leaving a contact surface of the die attach pad exposed to facilitate electrically coupling the die attach pad to an external device. | 04-21-2011 |
Meng Ee Lee, Bukit Mertajam MY
| Patent application number | Description | Published |
|---|---|---|
| 20100188853 | LIGHT EMITTER - A light emitter is disclosed herein. An embodiment of the light emitter comprises a substrate having a substrate surface; a light emitting diode located on the substrate surface; an encapsulant located on the substrate surface and encapsulating the light emitting diode; and a reflector cup attached to the substrate, the reflector cup having a reflector cup first side and a reflector cup second side with a hole extending between the reflector cup first side and the reflector cup second side, wherein the reflector cup first side is attached to the substrate surface so that the hole in the reflector cup first side encompasses the light emitting diode. | 07-29-2010 |
| 20100296297 | LIGHT EMITTER - A light emitter is disclosed herein. The light emitter may have a lead frame and a plastic reflector cup. The lead frame may have a planar portion; a bond area having a light-emitting diode attached thereto; and at least two terminals configured for surface mount technology. The reflector cup may be proximate the bond area and may have an opening, wherein light emitted from the light-emitting diode passes through the opening; a side wall extending between the planar portion and the opening; and a clear lens located proximate the opening and attached to the reflector cup. The combination of the lens and the reflector cup causes a light beam originating from the light-emitting diode to be less than fifteen degrees. | 11-25-2010 |
| 20110254032 | Electronic Assembly - An electronic assembly includes a first substrate and a second substrate, a hole through the first substrate, the second substrate having a trace with an indentation, an electronic device mounted over the indentation in the trace, and the first substrate is attached to the second substrate such that the electronic device is positioned within the hole through the first substrate. | 10-20-2011 |
See Yau Lee, Semabok MY
| Patent application number | Description | Published |
|---|---|---|
| 20090315172 | Semiconductor chip assembly - A semiconductor chip assembly includes a semiconductor chip and a pyrolytic graphite element that is an electrode that is electrically connected to and provides electrical conduction of current from the chip during operation of the chip. | 12-24-2009 |
Sian Tatt Lee, Klang MY
| Patent application number | Description | Published |
|---|---|---|
| 20110304484 | LIGHT GUIDE HAVING A CAPACITIVE SENSING GRID AND RELATED METHODOLOGY - An electronic device may include a keypad having a plurality of predefined key areas and a light guide that may be used to illuminate the key areas. The light guide may include a capacitive sensing grid to sense user contact relative to the keypad. | 12-15-2011 |
| 20120044716 | MULTI-SEGMENTED LIGHT GUIDE FOR KEYPAD AND DISPLAY APPARATUS - A multi-segmented light guide for keypad and display apparatus has been disclosed. The light guide film may comprise a plurality of light segments configured to transmit light independently. The boundaries of the light segments may be defined by a plurality of micro-optic structures. The micro-optic structures may have a height at least half the thickness of the light guide. | 02-23-2012 |
Sian Tatt Lee, Persiaran Tanjung Bungah MY
| Patent application number | Description | Published |
|---|---|---|
| 20110203911 | KEYPAD ASSEMBLY - A keypad assembly having a light guide sheet having a first surface with a layer of graphics printed thereon, a second surface opposite the first surface, and an edge surface; and a flexible sheet having a central portion engaged with the light guide sheet second surface and having a peripheral portion positioned in light blocking relationship with the light guide sheet edge surface. | 08-25-2011 |
Sian Tatt Lee, Georgetown MY
| Patent application number | Description | Published |
|---|---|---|
| 20100258419 | LIGHT GUIDE FILM WITH CUT LINES - A light guide for an optical keypad is described. The light guide includes a light interface surface, top and bottom surfaces, a surface feature pattern, and a cut line. The light interface surface receives light into the light guide from a light source. The light received through the light interface surface reflects according to total internal reflection (TIR) within the light guide between portions of the top and bottom surfaces. The surface feature pattern disrupts the TIR and scatters at least some of the light outside of at least one surface of the top and bottom surfaces. The cut line redirects at least some of the light from a first direction to a second direction within the light guide. The first direction is a direction other than towards the surface feature pattern, while the second direction is a direction substantially towards the surface feature pattern. | 10-14-2010 |
| 20100288608 | ILLUMINATED KEYPAD - An illuminated keypad is disclosed herein. And embodiment of the keypad comprises a first zone and a second zone; a substrate comprising a substrate surface; a first switch located on the substrate in the first zone; a first light guide having a first light guide first side and a first light guide second side, wherein the first light guide first side faces the first switch; a second light guide having a second light guide first side and a second light guide second side, wherein the second light guide first side faces the substrate surface; a masking layer having a masking layer first side and a masking layer second side, the masking layer first side facing the substrate surface; and at least one cut in the masking layer, wherein the masking layer blocks a light path between the light guides. | 11-18-2010 |
Siew Chin Lee, Sungai Ara MY
| Patent application number | Description | Published |
|---|---|---|
| 20100289745 | SYSTEM AND METHOD FOR AUTOMATICALLY ADJUSTING LIGHT SOURCE DRIVE CURRENT DURING OPTICAL NAVIGATION OPERATION - A system and method for automatically adjusting a drive current to a light source during an optical navigation operation uses brightness characteristics of captured frames of image data to determine whether each of the frames of image data belongs to one of at least first and second types of frames of image data. The drive current is adjusted depending on counts of the frames of image data belonging to the first and second types of frames of image data. | 11-18-2010 |
Sik Pong Lee, Petaling Jaya MY
| Patent application number | Description | Published |
|---|---|---|
| 20110101072 | ADJUSTABLE CLAMP SYSTEM AND METHOD FOR WIRE BONDING DIE ASSEMBLY - A method and an adjustable clamp system for clamping a die assembly during wire bonding. The system includes at least one pair of opposing base walls, each of the base walls has a base clamping surface. There is at least one pair of clamping members, each one of the clamping members being movable towards a respective base clamping surface to thereby clamp a lead frame of the die assembly. A die assembly support is disposed between the pair of opposing base walls and the die assembly support and pair of opposing base walls provide a cavity. There is a position sensor coupled to a controller and there is also a drive that is controllable by the controller. The drive provides movement of the die assembly support relative to each the base clamping surface to thereby adjust a depth of the cavity. In operation, after the lead frame is clamped between the base clamping surface and clamping members, the controller allows the drive to provide the relative movement until the position sensor detects that an underside of the lead frame has abutted the die assembly support. | 05-05-2011 |
Swee Kah Lee, Seri Jati MY
| Patent application number | Description | Published |
|---|---|---|
| 20110309493 | Electronic Device Package Locking System and Method - Device and method for an electronic device package is disclosed. The electronic device package includes a first pad, a second pad and an encapsulation surrounding the first and second pad, wherein the encapsulation includes a first opening underneath the first pad and a second opening underneath the second pad. A first bump is arranged in the first opening and a second bump is arranged in the second opening, wherein the encapsulation mechanically locks the first bump to the first pad and the second bump to the second pad. | 12-22-2011 |
Teck Sim Lee, Malacca MY
| Patent application number | Description | Published |
|---|---|---|
| 20090212417 | Semiconductor Device - A semiconductor device including: a heat sink, a die on the heat sink, resin encapsulating the die, and a mounting aperture in the resin having at least a segment between the heat sink and a first end of the resin, wherein the thickness of the heat sink is no greater than 35% of the thickness of the device. | 08-27-2009 |
| 20100227436 | METHOD OF FABRICATING A SEMICONDUCTOR PACKAGE WITH MOLD LOCK OPENING - A method of fabricating a semiconductor package. In one embodiment the method includes forming a mold cavity about a portion of a first major surface of a leadframe, including about a mold lock opening extending through the leadframe between the first major surface and a second major surface. A spacer is inserted to fill at least a portion of the mold lock opening. The mold cavity is filled with an encapsulating material including filling a portion of the mold lock opening not occupied by the spacer. | 09-09-2010 |
| 20110121439 | SEMICONDUCTOR DEVICE WITH PROTRUDING COMPONENT PORTION AND METHOD OF PACKAGING - A semiconductor package device having a protruding component portion and a method of packaging the semiconductor device is disclosed. The semiconductor device has a component, such as a leadframe, and a packaging mold body. The packaging mold body is formed around a portion of the component and a recess is formed in the packaging mold body adjacent the protruding portion of the component to prevent the protruding portion of the component from damaging other adjacent and abutting semiconductor devices. | 05-26-2011 |
Teck Sim Lee, Melaka MY
| Patent application number | Description | Published |
|---|---|---|
| 20120074546 | Multi-chip Semiconductor Packages and Assembly Thereof - Semiconductor packages and method of fabricating them are described. In one embodiment, the semiconductor package includes a substrate having a first and a second die attach pad. A first die is disposed over the first die attach pad. A second die is disposed over the second die attach pad. A third die is disposed between the first and the second die. The third die having a first, a second, and a third portion such that the first portion is disposed above a portion of the first die, the second portion is disposed above a portion of the second die, and the third portion is disposed above an area between the first die and the second die. | 03-29-2012 |
Yee Kim Lee, Johor MY
| Patent application number | Description | Published |
|---|---|---|
| 20110089556 | LEADFRAME PACKAGES HAVING ENHANCED GROUND-BOND RELIABILITY - Various semiconductor package arrangements and methods that improve the reliability of wire bonding a die to ground or other outside contacts are described. In one aspect, selected ground pads on the die are wire bonded to a bonding region located on the tie bar portion of the lead frame. The tie bar is connected to an exposed die attach pad that is downset from the bonding region of the tie bar. In some embodiments, the bonding region and the leads are at substantially the same elevation above the die and die attach pad. The die, bonding wires, and at least a portion of the lead frame can be encapsulated with a plastic encapsulant material while leaving a contact surface of the die attach pad exposed to facilitate electrically coupling the die attach pad to an external device. | 04-21-2011 |
Yee Kim Lee, Segamat MY
| Patent application number | Description | Published |
|---|---|---|
| 20110140253 | DAP GROUND BOND ENHANCEMENT - A variety of semiconductor package arrangements and packaging methods are described that improve the reliability of bonding wires that down bond a die to a die attach pad. In one aspect, selected portions of the top surface of a lead frame (which may be in panel form) are plated (e.g., silver plated) to facilitate wire bonding. The plating covers some, but not all of a die attach surface of the die attach pad. In some preferred embodiments, the plating on the die attach pad is arranged as a peripheral ring that surrounds an unplated central region of the die support surface. In other embodiments, the plating on the die attach pad takes the form of bars or other geometric patterns that do not fully cover the die support surface. Unplated portions of the die support surface are roughened to improve the adherence of the die to the die attach pad, thereby reducing the probability of die attach pad delamination and the associated risks to down bonded bonding wires. The described lead frames may be used in a variety of packages. Most commonly, a die is attached to the die support surface of the die attach pad and electrically connected to the lead frame leads by wire bonding as appropriate. At least one of the die's bond pads (typically the ground bond pad(s)) is down bonded to the die attach pad. The die, the bonding wires and at least portions of the lead frame are then typically encapsulated with a plastic encapsulant material while leaving a contact surface of the die attach pad exposed to facilitate electrically coupling the die attach pad to an external device. | 06-16-2011 |
| 20120080781 | DELAMINATION RESISTANT DEVICE PACKAGE HAVING RAISED BOND SURFACE AND MOLD LOCKING APERTURE - A semiconductor package configured to attain a thin profile and low moisture sensitivity. Packages of this invention can include a semiconductor die mounted on a die attachment site of a leadframe and further connected with a plurality of elongate I/O leads arranged about the die attach pad and extending in said first direction. The leadframe having an “up-set” bonding pad arranged with a bonding support for supporting a plurality of wire bonds and a large mold flow aperture in the up-set bonding pad. The package encapsulated in a mold material that surrounds the bonding support and flows through the large mold flow aperture to establish well supported wire bonds such that the package has low moisture sensitivity. | 04-05-2012 |
Yeu Wen Lee, Negeri Sembilan MY
| Patent application number | Description | Published |
|---|---|---|
| 20080246130 | Semiconductor Package Structure Having Enhanced Thermal Dissipation Characteristics - In an exemplary embodiment, a packaged device having enhanced thermal dissipation characteristics includes a semiconductor chip having a major current carrying or heat generating electrode. The semiconductor chip is oriented so that the major current carrying electrode faces the top of the package or away from the next level of assembly. The packaged device further includes a conductive clip for coupling the major current carrying electrode to a next level of assembly, and a heat spreader device formed on or integral with the conductive clip. A portion of the heat spreader device may be optionally exposed. | 10-09-2008 |
| 20110298115 | SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURE - A semiconductor component and a method for manufacturing the semiconductor component, wherein the semiconductor component is configured to permit the determination of circuit parameters. A high side FET has a gate terminal coupled to an output terminal of a high side gate drive circuit, a drain terminal coupled for receiving an input voltage, and a source terminal coupled to the drain terminal of a low side FET. The gate terminal of the low side FET is coupled to the output terminal of low side drive circuit and the source terminal of the low side FET is coupled for receiving a source of operating potential. The high side gate drive circuit has a bias terminal coupled for receiving a floating potential where the bias terminal is electrically isolated or decoupled from the commonly connected source and drain terminals of the high side FET and the low side FET, respectively. | 12-08-2011 |
Yin Fei Lee, Sungai Siput MY
| Patent application number | Description | Published |
|---|---|---|
| 20100188853 | LIGHT EMITTER - A light emitter is disclosed herein. An embodiment of the light emitter comprises a substrate having a substrate surface; a light emitting diode located on the substrate surface; an encapsulant located on the substrate surface and encapsulating the light emitting diode; and a reflector cup attached to the substrate, the reflector cup having a reflector cup first side and a reflector cup second side with a hole extending between the reflector cup first side and the reflector cup second side, wherein the reflector cup first side is attached to the substrate surface so that the hole in the reflector cup first side encompasses the light emitting diode. | 07-29-2010 |
Yit Meng Lee, Kuala Lumpur MY
| Patent application number | Description | Published |
|---|---|---|
| 20120073859 | POLYMER CORE WIRE - A wire capable of conducting electrical current has a polymer core and a coating layer surrounding the core. The coating layer, which may be, for example, gold or copper, conducts electrical current and the core provides strength so that the wire is able to withstand bending and breakage. Among other things, the polymer core wire is useful for connecting an integrated circuit to a lead frame or substrate. | 03-29-2012 |
Yit Meng Lee, Kuala Lampur MY
| Patent application number | Description | Published |
|---|---|---|
| 20100279471 | UNDERFILL DISPENSING SYSTEM FOR INTEGRATED CIRCUITS - A system for dispensing an underfill material between an integrated circuit (IC) chip and a substrate includes a platform at which the underfill material is supplied. The IC chip and the substrate are mounted at the periphery of the platform. The platform rotates and facilitates the movement of the underfill material toward the IC chip and the substrate. The system further includes a Bernoulli tube that is located proximate to the IC chip and the substrate. The Bernoulli tube generates a low pressure in the proximity of the IC packages. The low pressure facilitates the dispensing of the underfill material between the IC chip and the substrate. | 11-04-2010 |
Yong Joo Lee, Melaka MY
| Patent application number | Description | Published |
|---|---|---|
| 20090248835 | OFFLOADING DATA TRANSFERS BETWEEN A LOCAL AND REMOTE NETWORK - A method, system, and computer readable medium are disclosed. In one embodiment the method includes initiating a data transfer from a first computing device to a second computing device. Then the method continues by designating a third computing device to offload at least a portion of the data associated with the data transfer. Additionally, the method stores the offloaded portion of the data on the designated third computing device for a period of time. Finally, the method concludes by sending the data stored on the third computing device to the second computing device after the period of time. | 10-01-2009 |
Yook Heng Lee, Selangor MY
| Patent application number | Description | Published |
|---|---|---|
| 20100096277 | AMPEROMETRIC BIOSENSOR FOR HISTAMINE DETERMINATION - There is provided by this invention a simple and rapid amperometric biosensor for determining the level of histamine in seafood or fish. The biosensor combines the technology of screen-printing with immobilized diamine oxidase as the bioreceptor. IQ one embodiment of the present invention, the biosensor incorporates potassium hexacyanoferrate (III) as a mediator. | 04-22-2010 |
Zhan Qiang Lee, Bating MY
| Patent application number | Description | Published |
|---|---|---|
| 20100077397 | Input/output (I/O) device virtualization using hardware - According to embodiments of the present invention a computer system that is capable of sharing physical devices among several virtual machines (VM) includes hardware assisted logic to allow requests from guest operating systems (guest OS) to circumvent a virtual machine monitor (VMM) and be processed by the hardware assisted logic. | 03-25-2010 |