Lee, Kyunggi-Do

Deok Gyu Lee, Kyunggi-Do KR

Patent application number	Description	Published
20100259644	APPARATUS AND METHOD FOR PROCESSING IMAGE INFORMATION - An apparatus and a method for processing image information are provided. The apparatus for processing image information includes an image capturing device and an image information server for receiving and storing an image captured by the image capturing device and adds information on the image capturing device and signature information to image data obtained by the image capturing device. Accordingly, the device information and the signature information can be added to the image data obtained by the image capturing device to maintain security of the image data and use the image data as digital proof when a specific event is generated.	10-14-2010

Gil-Soo Lee, Kyunggi-Do KR

Patent application number	Description	Published
20110130122	Method and Apparatus for Sending Voice Message in Mobile Network - To use the supplementary services of a conventional mobile communication service, such as Short Message Service (SMS) and Voice Mail System (VMS) service, there are problems in that an access method to each service must be known and several steps must be undergone. The present invention relates to a method and apparatus for sending voice messages in a mobile communication network and, more particularly, to a method and apparatus that gain access to the service providing page of the wireless Internet in such a way as to input the telephone number of a counterpart and a wireless Internet access key, and send a voice message to the counterpart.	06-02-2011

Hak-Min Lee, Kyunggi-Do KR

Patent application number	Description	Published
20100323208	Plastic-thin metal film and method for preparing the same - The present invention relates to a plastic-thin metal film and a method for preparing the same, and more precisely a plastic-thin metal film and a method for preparing the same which can improve an adhesion strength between the plastic substrate and the thin metal film, by forming a reactive functional group on a surface of a plastic substrate by plasma treatment and bonding the plastic substrate to a thin metal film by coating the plastic substrate or the thin metal film with an adhesive composition containing a reactive material which can be chemically bound to the reactive functional group.	12-23-2010

Ha-Yong Lee, Kyunggi-Do KR

Patent application number	Description	Published
20080220234	Method of Preparing Wear-Resistant Coating Layer Comprising Metal Matrix Composite and Coating Layer Prepared Thereby - The invention provides a method of preparing a wear-resistant coating layer comprising metal matrix composite and a coating layer prepared by using the same and more particularly, it provides a method of preparing a wear-resistant coating layer comprising metal matrix composite, which comprises the steps of providing a base material, preparing a mixture powder comprising a metal, alloy or mixture particle thereof having an average diameter of 50 to 100 um and a ceramic or mixture particle thereof having an average diameter of 25 to 50 um in a ratio of 1:1 to 3:1 by volume, injecting the mixture powder into a spray nozzle for coating, and coating the mixture powder on the surface of the base material by accelerating the mixture powder in the state of non-fusion at a rate of 300 to 1,200 m/s by the flow of transportation gas flowing in the nozzle and a coating layer prepared by using the same whereby the coating layer with high wear resistance and excellent resistance against fatigue crack on the surface of the base material without causing damages such as heat strain to the base material during the formation of the coating layer can be provided.	09-11-2008
20090120539	Method of Preparing Metal Matrix Composite and Coating Layer and Bulk Prepared Thereby - This invention provides a method of preparing a metal matrix composite, and a coating layer and bulk prepared by using the same and in particular, it provides a method of preparing a metal matrix composite, which comprises the steps of providing a substrate; preparing a mixed powder comprising i) a first metal powder comprising a metal, alloy or mixture particle thereof, ii) a second metal powder comprising an intermetallic compound forming metal particle which forms an intermetallic compound along with the metal or the alloy element of the alloy, and iii) a ceramic powder comprising a ceramic or mixture particle thereof; injecting the mixed powder prepared above into a spray nozzle for coating; coating the mixed powder on the surface of the substrate by accelerating the mixed powder in the state of non-fusion at a speed of 300 to 1,200 m/s by the flow of transportation gas flowing in the spray nozzle; and forming the intermetallic compound by the thermal treatment of the coated coating layer, and a coating layer and bulk prepared by using the same, whereby the coating layer and bulk material with high wear resistance and excellent resistance against fatigue crack on the surface without causing damages such as heat strain to the substrate during the preparation of the coating layer can be provided.	05-14-2009

Patent applications by Ha-Yong Lee, Kyunggi-Do KR

Hyung-Rae Lee, Kyunggi-Do KR

Patent application number	Description	Published
20110017926	SEMICONDUCTOR INTRA-FIELD DOSE CORRECTION - A system and method are provided for automatic dose-correction recipe generation, the system including a dose-correction recipe generator, a reticle data unit in signal communication with the recipe generator, a slit data unit in signal communication with the recipe generator, a process data unit in signal communication with the recipe generator, a wafer data unit in signal communication with the recipe generator, a control unit in signal communication with the recipe generator, and an output unit or a storage unit in signal communication with the control unit; and the method including receiving a current reticle data set and a previous reticle data set, receiving a current slit data set and a previous slit data set, receiving a process condition, receiving a wafer condition, automatically generating a dose-correction recipe in accordance with the received reticle, slit, process and wafer information, and controlling a dose in accordance with the generated recipe.	01-27-2011

Hyunil Lee, Kyunggi-Do KR

Patent application number	Description	Published
20100176407	METHOD FOR MANUFACTURING LIGHT EMITTING DIODE PACKAGE AND PACKAGE STRUCTURE THEREOF - The present invention relates to a method for forming a package structure for a light emitting diode (LED) and the LED package structure thereof. By employing the same sawing process to cut through the trenches of the leadframe, the package units are singulated and different lead portions are simultaneously separated from each other in each package unit. Therefore, the overflow issues of the encapsulant can be avoided without using extra taping process.	07-15-2010
20110278609	PACKAGE STRUCTURE AND PACKAGE PROCESS OF LIGHT EMITTING DIODE - A light emitted diode (LED) package structure and an LED package process are provided. The LED package structure comprises a carrier, a spacer, at least one LED chip, a junction coating, a plurality of phosphor particles, and an encapsulant. The spacer is disposed on the carrier and provided with a reflective layer covering a top surface of the spacer. The LED chip is disposed on the reflective layer and electrically connected to the carrier. The junction coating is disposed over the spacer and covers the LED chip. The phosphor particles are distributed within the junction coating. The encapsulant is disposed on the carrier and encapsulates the LED chip, the spacer and the junction coating. Uniform light output and high illuminating efficiency can be obtained by the phosphor particles uniformly distributed in the junction coating. The junction coating is formed by package level dispensing process to reduce the fabrication cost.	11-17-2011
20110278610	PACKAGE STRUCTURE AND PACKAGE PROCESS OF LIGHT EMITTING DIODE - A light emitting diode (LED) package structure comprising a carrier, an LED chip, a first encapsulant, at least one bonding wire, a plurality of phosphor particles and a second encapsulant is provided. The LED chip is disposed on the carrier. The LED chip has at least one electrode. The first encapsulant is disposed on the carrier and covering the LED chip. The first encapsulant is provided with at least one preformed opening exposing at least a portion of the at least one electrode. The at least one bonding wire is electrically connected between the at least one electrode and the carrier via the at least one preformed opening. The phosphor particles are distributed within the first encapsulant. The second encapsulant is disposed on the carrier and encapsulates the LED chip, the first encapsulant and the at least one bonding wire.	11-17-2011

Hyun Kook Lee, Kyunggi-Do KR

Patent application number	Description	Published
20090177479	Method for Encoding and Decoding Object-Based Audio Signal and Apparatus Thereof - Methods and apparatuses for encoding and decoding an object-based audio signal are provided. The method of decoding an object-based audio signal includes extracting a down-mix signal and object-based parameter information from an input audio signal, generating an object-audio signal using the down-mix signal and the object-based parameter information, and generating an object audio signal with three-dimensional (3D) effects by applying 3D information to the object audio signal. Accordingly, it is possible to localize a sound image for each object audio signal and thus provide a vivid sense of reality during the reproduction of object audio signals.	07-09-2009
20090210238	Methods and Apparatuses for Encoding and Decoding Object-Based Audio Signals - An audio decoding method and apparatus and an audio encoding method and apparatus which can efficiently process object-based audio signals are provided. The audio decoding method includes receiving a downmix signal, which is obtained by downmixing a plurality of object signals, and object side information, extracting metadata from the object-side information and displaying an information regarding the object signals based on the metadata.	08-20-2009
20090210239	Method for Encoding and Decoding Object-Based Audio Signal and Apparatus Thereof - The present invention relates to a method and apparatus for encoding and decoding object-based audio signals. This audio decoding method includes extracting a first audio signal and a first audio parameter in which a music object are encoded on a channel basis and a second audio signal and a second audio parameter in which a vocal object are encoded on an object basis, from an audio signal, generating a third audio signal by employing at least one of the first and second audio signals, and generating a multi-channel audio signal by employing at least one of the first and second audio parameters and the third audio signal. Accordingly, the amount of calculation in encoding and decoding processes and the size of a bitstream that is encoded can be reduced efficiently.	08-20-2009
20090265164	Method for Encoding and Decoding Object-Based Audio Signal and Apparatus Thereof - The present invention relates to a method for encoding and decoding object-based audio signal and an apparatus thereof. The audio decoding method includes extracting a first audio signal in which one or more music objects are grouped and encoded, a second audio signal in which at least two vocal objects are grouped step by step and encoded, and a residual signal corresponding to the second audio signal, from an audio signal, and generating a third audio signal by employing at least one of the first and second audio signals and the residual signal. A multi-channel audio signal is then generated by employing the third audio signal. Accordingly, a variety of play modes can be provided efficiently.	10-22-2009
20090326958	Methods and Apparatuses for Encoding and Decoding Object-Based Audio Signals - An audio decoding method and apparatus and an audio encoding method and apparatus which can efficiently process object-based audio signals are provided. The audio decoding method includes receiving first and second audio signals, which are object-encoded; generating third object energy information based on first object energy information included in the first audio signal and second object energy information included in the second audio signal; and generating a third audio signal by combining the first and second object signals and the third object energy information.	12-31-2009
20100076772	Methods and Apparatuses for Encoding and Decoding Object-Based Audio Signals - An audio decoding method and apparatus and an audio encoding method and apparatus which can efficiently process object-based audio signals are provided. The audio decoding method includes receiving a downmix signal and object-based side information, the downmix signal comprising at least two downmix channel signals; extracting gain information from the object-based side information and generating modification information for modifying the downmix channel signals on a channel-by-channel basis based on the gain information; and modifying the downmix channel signals by applying the modification information to the downmix channel signals.	03-25-2010
20110200197	Methods and Apparatuses for Encoding and Decoding Object-Based Audio Signals - An audio decoding method and apparatus and an audio encoding method and apparatus which can efficiently process object-based audio signals are provided. The audio decoding method includes receiving a downmix signal and object-based side information, the downmix signal comprising at least two downmix channel signals; extracting gain information from the object-based side information and generating modification information for modifying the downmix channel signals on a channel-by-channel basis based on the gain information; and modifying the downmix channel signals by applying the modification information to the downmix channel signals.	08-18-2011
20110202356	Methods and Apparatuses for Encoding and Decoding Object-Based Audio Signals - An audio decoding method and apparatus and an audio encoding method and apparatus which can efficiently process object-based audio signals are provided. The audio decoding method includes receiving a downmix signal, which is obtained by downmixing a plurality of object signals, and object side information, extracting metadata from the object-side information and displaying an information regarding the object signals based on the metadata.	08-18-2011
20110202357	Methods and Apparatuses for Encoding and Decoding Object-Based Audio Signals - An audio decoding method and apparatus and an audio encoding method and apparatus which can efficiently process object-based audio signals are provided. The audio decoding method includes receiving a downmix signal, which is obtained by downmixing a plurality of object signals, and object side information, extracting metadata from the object-side information and displaying an information regarding the object signals based on the metadata.	08-18-2011

Patent applications by Hyun Kook Lee, Kyunggi-Do KR

Jac-Hong Lee, Kyunggi-Do KR

Patent application number	Description	Published
20080220234	Method of Preparing Wear-Resistant Coating Layer Comprising Metal Matrix Composite and Coating Layer Prepared Thereby - The invention provides a method of preparing a wear-resistant coating layer comprising metal matrix composite and a coating layer prepared by using the same and more particularly, it provides a method of preparing a wear-resistant coating layer comprising metal matrix composite, which comprises the steps of providing a base material, preparing a mixture powder comprising a metal, alloy or mixture particle thereof having an average diameter of 50 to 100 um and a ceramic or mixture particle thereof having an average diameter of 25 to 50 um in a ratio of 1:1 to 3:1 by volume, injecting the mixture powder into a spray nozzle for coating, and coating the mixture powder on the surface of the base material by accelerating the mixture powder in the state of non-fusion at a rate of 300 to 1,200 m/s by the flow of transportation gas flowing in the nozzle and a coating layer prepared by using the same whereby the coating layer with high wear resistance and excellent resistance against fatigue crack on the surface of the base material without causing damages such as heat strain to the base material during the formation of the coating layer can be provided.	09-11-2008

Jae-Hong Lee, Kyunggi-Do KR

Patent application number	Description	Published
20090120539	Method of Preparing Metal Matrix Composite and Coating Layer and Bulk Prepared Thereby - This invention provides a method of preparing a metal matrix composite, and a coating layer and bulk prepared by using the same and in particular, it provides a method of preparing a metal matrix composite, which comprises the steps of providing a substrate; preparing a mixed powder comprising i) a first metal powder comprising a metal, alloy or mixture particle thereof, ii) a second metal powder comprising an intermetallic compound forming metal particle which forms an intermetallic compound along with the metal or the alloy element of the alloy, and iii) a ceramic powder comprising a ceramic or mixture particle thereof; injecting the mixed powder prepared above into a spray nozzle for coating; coating the mixed powder on the surface of the substrate by accelerating the mixed powder in the state of non-fusion at a speed of 300 to 1,200 m/s by the flow of transportation gas flowing in the spray nozzle; and forming the intermetallic compound by the thermal treatment of the coated coating layer, and a coating layer and bulk prepared by using the same, whereby the coating layer and bulk material with high wear resistance and excellent resistance against fatigue crack on the surface without causing damages such as heat strain to the substrate during the preparation of the coating layer can be provided.	05-14-2009

Jae-Jung Lee, Kyunggi-Do KR

Patent application number	Description	Published
20080220234	Method of Preparing Wear-Resistant Coating Layer Comprising Metal Matrix Composite and Coating Layer Prepared Thereby - The invention provides a method of preparing a wear-resistant coating layer comprising metal matrix composite and a coating layer prepared by using the same and more particularly, it provides a method of preparing a wear-resistant coating layer comprising metal matrix composite, which comprises the steps of providing a base material, preparing a mixture powder comprising a metal, alloy or mixture particle thereof having an average diameter of 50 to 100 um and a ceramic or mixture particle thereof having an average diameter of 25 to 50 um in a ratio of 1:1 to 3:1 by volume, injecting the mixture powder into a spray nozzle for coating, and coating the mixture powder on the surface of the base material by accelerating the mixture powder in the state of non-fusion at a rate of 300 to 1,200 m/s by the flow of transportation gas flowing in the nozzle and a coating layer prepared by using the same whereby the coating layer with high wear resistance and excellent resistance against fatigue crack on the surface of the base material without causing damages such as heat strain to the base material during the formation of the coating layer can be provided.	09-11-2008
20090120539	Method of Preparing Metal Matrix Composite and Coating Layer and Bulk Prepared Thereby - This invention provides a method of preparing a metal matrix composite, and a coating layer and bulk prepared by using the same and in particular, it provides a method of preparing a metal matrix composite, which comprises the steps of providing a substrate; preparing a mixed powder comprising i) a first metal powder comprising a metal, alloy or mixture particle thereof, ii) a second metal powder comprising an intermetallic compound forming metal particle which forms an intermetallic compound along with the metal or the alloy element of the alloy, and iii) a ceramic powder comprising a ceramic or mixture particle thereof; injecting the mixed powder prepared above into a spray nozzle for coating; coating the mixed powder on the surface of the substrate by accelerating the mixed powder in the state of non-fusion at a speed of 300 to 1,200 m/s by the flow of transportation gas flowing in the spray nozzle; and forming the intermetallic compound by the thermal treatment of the coated coating layer, and a coating layer and bulk prepared by using the same, whereby the coating layer and bulk material with high wear resistance and excellent resistance against fatigue crack on the surface without causing damages such as heat strain to the substrate during the preparation of the coating layer can be provided.	05-14-2009

Patent applications by Jae-Jung Lee, Kyunggi-Do KR

Jin-Soo Lee, Kyunggi-Do KR

Patent application number	Description	Published
20110306580	PROPHYLACTIC AGENT OR THERAPEUTIC AGENT FOR DISEASE RESULTING FROM ABNORMAL BONE METABOLISM - The object of the present invention is to provide a therapeutic agent or a prophylactic agent for a disease resulting from an abnormal bone metabolism, especially osteoporosis which is more effective than conventional agents. Excellent therapeutic effect or prophylactic effect on a disease resulting from an abnormal bone metabolism, especially osteoporosis, compared with the effect in administration of each compound alone can be obtained by the combination of an N-hydroxybenzamidine derivative represented by Formula (I) or a salt thereof with an activated vitamin D or a prodrug thereof.	12-15-2011

Jong Koo Lee, Kyunggi-Do KR

Patent application number	Description	Published
20090252625	Linear Compressor and the Supporter for the Same - The present invention relates to a linear compressor compressing a working fluid in the cylinder such as a refrigerant and etc with the reciprocating movement of the piston in the cylinder due to the reciprocating force of the linear motor, and provides a linear compressor and the supporter for the same that the change of the lateral resonance frequency due to the lateral stiffness of the piston spring is easy as having a stub or a narrow part on the supporter preventing the increase of the mass inertia moment compared with the distance between the centroid of the supporter and the center of the piston spring sat on the supporter arm of the supporter, and capable of reducing the entire size and the manufacturing costs as raising the lateral resonance frequency easily without extending the length of the supporter arm.	10-08-2009

Joo Mun Lee, Kyunggi-Do KR

Patent application number	Description	Published
20090201215	QUADRIFILAR HELICAL ANTENNA - A quadrifilar helical antenna comprising two pairs of filars having unequal lengths and phase quadrature signals propagating thereon. A conductive H-shaped impedance matching element matches a source impedance to an antenna impedance. The impedance matching element having a feed terminal at the center thereof from which current is supplied to the two filars of each filar pair disposed about an edge of the impedance matching element and symmetric with respect to a center of the impedance matching element. The impedance matching element further comprises a reactive element for matching the antenna and source impedances.	08-13-2009

Patent applications by Joo Mun Lee, Kyunggi-Do KR

Jung Lee, Kyunggi-Do KR

Patent application number	Description	Published
20100109132	CHIP PACKAGE AND MANUFACTURING METHOD THEREOF - A chip package including a shielding layer having a plurality of conductive connectors for better electromagnetic interferences shielding is provided. The conductive connectors can be flexibly arranged within the molding compound for better shielding performance. The shielding layer having the conductive connectors functions as the EMI shield and the shielding layer is electrically grounded within the package structure.	05-06-2010
20100110656	CHIP PACKAGE AND MANUFACTURING METHOD THEREOF - A chip package including a plurality of conductive bodies and a shielding layer for better electromagnetic interferences shielding is provided. The shielding layer over the molding compound contacts with the conductive bodies disposed on the substrate, and the shielding layer and the conductive bodies function as EMI shield. The shielding layer is electrically grounded through the conductive bodies connected to the laminate substrate and the ground plane of the substrate.	05-06-2010

Jun Ha Lee, Kyunggi-Do KR

Patent application number	Description	Published
20100038239	DEVICE FOR FABRICATING FLEXIBLE FILM - A device for fabricating a flexible film is provided. The device includes a serving unit providing an insulation film; a main processing unit including at least one of a dust removing unit, an etching unit, a neutralizing unit, a coupling unit, a catalyst bonding unit, a plating unit, and a drying unit; an assistant power unit controlling a tension of the insulation film; a top transporter disposed at an upper part of the main processing unit; and a bottom transporter disposed at a lower part of the main processing unit, wherein the top transporter includes a squeezing unit pressing a material on the insulation film. The device can improve the quality of a flexible film by pressing the flexible film using the squeezing unit.	02-18-2010
20100072246	DEVICE FOR TRANSFERRING FILM - A device for transferring a film is provided. The device includes a roller transferring a film; a balancing unit connected to the roller by fixed supporters, the fixed supporters being disposed on both sides of the roller; and springs disposed on both sides of the balancing unit, wherein, if the film is out of balance, the balancing unit restores balance to the film by vibrating the both sides of the balancing unit. That is, if a film becomes out of balance during the transfer of the film, the device may restore balance to the film with the aid of the balancing unit which can vibrate on both sides of the balancing unit due to the springs.	03-25-2010

Ki-Ho Lee, Kyunggi-Do KR

Patent application number	Description	Published
20110319083	SYSTEM AND METHOD FOR HANDOFF IN AN INTEGRATED CELL - A system and method for handoff in an integrated cell. A user equipment selects an integrated cell as a target cell supporting a target network based on a white list and physical cell identities. A cell-to-cell handoff is performed to the target cell. After the cell-to-cell handoff, a base station of the target cell establishes a communication session directly to a service. Then, the user equipment determines whether or not a physical cell identity of a base station of the target cell is an integrated physical cell identity. The user equipment turns on a module for the target network when the physical cell identity of the base station is determined to be the integrated physical cell identity. A heterogeneous-network handoff is then performed, and the base station communicates directly with a service server using a mapping table in order to seamlessly provide the service to the user equipment.	12-29-2011

Kwang-Nyeong Lee, Kyunggi-Do KR

Patent application number	Description	Published
20110065088	METHOD AND DEVICES FOR RAPID DIAGNOSIS OF FOOT-AND-MOUTH DISEASE - A rapid immunoassay method and apparatus for detecting foot and mouth disease virus are disclosed. The method and test device permit pen-side testing of animals and provide test results within a relatively short time period. In a preferred embodiment, the method and apparatus provide a means for differentiating between FMDV-infected and FMDV-vaccinated animals.	03-17-2011

Patent applications by Kwang-Nyeong Lee, Kyunggi-Do KR

Kyong-Joo Lee, Kyunggi-Do KR

Patent application number	Description	Published
20100295113	SEMICONDUCTOR DEVICES COMPRISING A PLURALITY OF GATE STRUCTURES - Semiconductor devices including a plurality of gate structures disposed on a semiconductor substrate are provided. Each of the gate structures includes a tunnel dielectric layer, a floating gate, an inter-gate dielectric layer, a control gate, and a mask layer. Liners cover opposing sidewalls of adjacent floating gates. Spacers are disposed on the liners, the spacers protruding from opposing sidewalls of adjacent ones of the gate structures, and a top of each of the spacers is disposed below a top of a corresponding one of the gate structures. The liners define sidewalls of respective air gaps and the spacers define tops of the respective air gaps.	11-25-2010

Kyunghoon Lee, Kyunggi-Do KR

Patent application number	Description	Published
20100148316	Semiconductor Device and Method of Forming Topside and Bottom-side Interconnect Structures Around Core Die with TSV - A semiconductor device has a core semiconductor device with a through silicon via (TSV). The core semiconductor device includes a plurality of stacked semiconductor die and semiconductor component. An insulating layer is formed around the core semiconductor device. A conductive via is formed through the insulating layer. A first interconnect structure is formed over a first side of the core semiconductor device. The first interconnect structure is electrically connected to the TSV. A second interconnect structure is formed over a second side of the core semiconductor device. The second interconnect structure is electrically connected to the TSV. The first and second interconnect structures include a plurality of conductive layers separated by insulating layers. A semiconductor die is mounted to the first interconnect structure. The semiconductor die is electrically connected to the core semiconductor device through the first and second interconnect structures and TSV.	06-17-2010
20110260338	Semiconductor Device and Method of Forming Adjacent Channel and DAM Material Around Die Attach Area of Substrate to Control Outward Flow of Underfill Material - A semiconductor device has a flipchip or PoP semiconductor die mounted to a die attach area interior to a substrate. The substrate has a contact pad area around the die attach area and flow control area between the die attach area and contact pad area. A first channel is formed in a surface of the substrate within the flow control area. The first channel extends around a periphery of the die attach area. A first dam material is formed adjacent to the first channel within the flow control area. An underfill material is deposited between the die and substrate. The first channel and first dam material control outward flow of the underfill material to prevent excess underfill material from covering the contact pad area. A second channel can be formed adjacent to the first dam material. A second dam material can be formed adjacent to the first channel.	10-27-2011

Kyung Ik Lee, Kyunggi-Do KR

Patent application number	Description	Published
20080204430	INPUT DEVICE AND MOBILE COMMUNICATION DEVICE HAVING SAME - An input device is provided. The input device includes a first input unit configured to provide at least two directional signals, a second input unit located in the first input unit, the second input unit including a housing and a rotatable member located therein, the second input unit being configured to provide at least two directional signals different from the at least two directional signals of the first input unit, and a circuitry supporting substrate configured to receive a signal that is input through the first input unit and the second input unit. A mobile communication device having the input device is also provided.	08-28-2008

Min-Ik Lee, Kyunggi-Do KR

Patent application number	Description	Published
20090035895	CHIP PACKAGE AND CHIP PACKAGING PROCESS THEREOF - A chip package comprises a substrate, a chip, a conductive layer and a molding compound. The substrate has a carrying surface and at least a ground pad disposed on the carrying surface. The chip has an active surface and a back surface opposite thereto. The chip is bonded to the substrate with the active surface facing towards the carrying surface of the substrate, wherein the ground pad is disposed outside of the chip. The conductive layer covers the chip and a portion of the carrying surface, and electrically connects to the ground pad. The molding compound is disposed on the carrying surface of the substrate and encapsulates the chip and the conductive layer.	02-05-2009

Sang-Hak Lee, Kyunggi-Do JP

Patent application number	Description	Published
20080319047	Novel Glucitol Derivative, Prodrug Thereof And Salt Thereof, And Therapeutic Agent Containing The Same For Diabetes - The invention provides a glucitol derivative having the function of reducing a blood sugar level and having preferable properties required of medicines, such as long-lasting drug activity; and a medicinal composition for use in the prevention or treatment of diseases attributable to hyperglycemia, such as diabetes, complications of diabetes, and obesity. The derivative is a compound represented by the formula (I):	12-25-2008

Sangkwon Lee, Kyunggi-Do KR

Patent application number	Description	Published
20100176503	SEMICONDUCTOR PACKAGE SYSTEM WITH THERMAL DIE BONDING - A semiconductor package system includes providing a substrate having a plurality of thermal vias extending through the substrate. A solder mask is positioned over the plurality of thermal vias. A plurality of thermally conductive bumps is formed on at least some of the plurality of thermal vias using the solder mask. An integrated circuit die is attached to the plurality of thermally conductive bumps. An encapsulant encapsulates the integrated circuit die.	07-15-2010

Seokwon Lee, Kyunggi-Do KR

Seongoo Lee, Kyunggi-Do KR

Patent application number	Description	Published
20100176407	METHOD FOR MANUFACTURING LIGHT EMITTING DIODE PACKAGE AND PACKAGE STRUCTURE THEREOF - The present invention relates to a method for forming a package structure for a light emitting diode (LED) and the LED package structure thereof. By employing the same sawing process to cut through the trenches of the leadframe, the package units are singulated and different lead portions are simultaneously separated from each other in each package unit. Therefore, the overflow issues of the encapsulant can be avoided without using extra taping process.	07-15-2010
20110278609	PACKAGE STRUCTURE AND PACKAGE PROCESS OF LIGHT EMITTING DIODE - A light emitted diode (LED) package structure and an LED package process are provided. The LED package structure comprises a carrier, a spacer, at least one LED chip, a junction coating, a plurality of phosphor particles, and an encapsulant. The spacer is disposed on the carrier and provided with a reflective layer covering a top surface of the spacer. The LED chip is disposed on the reflective layer and electrically connected to the carrier. The junction coating is disposed over the spacer and covers the LED chip. The phosphor particles are distributed within the junction coating. The encapsulant is disposed on the carrier and encapsulates the LED chip, the spacer and the junction coating. Uniform light output and high illuminating efficiency can be obtained by the phosphor particles uniformly distributed in the junction coating. The junction coating is formed by package level dispensing process to reduce the fabrication cost.	11-17-2011
20110278610	PACKAGE STRUCTURE AND PACKAGE PROCESS OF LIGHT EMITTING DIODE - A light emitting diode (LED) package structure comprising a carrier, an LED chip, a first encapsulant, at least one bonding wire, a plurality of phosphor particles and a second encapsulant is provided. The LED chip is disposed on the carrier. The LED chip has at least one electrode. The first encapsulant is disposed on the carrier and covering the LED chip. The first encapsulant is provided with at least one preformed opening exposing at least a portion of the at least one electrode. The at least one bonding wire is electrically connected between the at least one electrode and the carrier via the at least one preformed opening. The phosphor particles are distributed within the first encapsulant. The second encapsulant is disposed on the carrier and encapsulates the LED chip, the first encapsulant and the at least one bonding wire.	11-17-2011

Tae-Gon Lee, Kyunggi-Do KR

Patent application number	Description	Published
20080216314	METHOD FOR MANUFACTURING THE BGA PACKAGE BOARD - Disclosed herein is a Ball Grid Array (BGA) package board. The BGA package board includes a first external layer on which a pattern comprising a circuit pattern and a wire bonding pad pattern is formed, a second external layer on which a pattern comprising a circuit pattern and a solder ball pad pattern is formed, an insulating layer formed between the first and second external layers, a first outer via hole to electrically connect the first and second external layers to each other, and a solder resist layer formed on each of the first and second external layers, with portions of the solder resist layer corresponding to the wire bonding pad pattern and the solder ball pad pattern being opened. The solder ball pad pattern is thinner than the circuit pattern of the second external layer.	09-11-2008

Taehyun Lee, Kyunggi-Do KR

Patent application number	Description	Published
20110241383	REINFORCEMENT ASSEMBLY - The present invention relates to a reinforcement assembly for a beam. In at least one embodiment, the reinforcement assembly comprises a carrier member having a front side and a back side, a plurality of mass support sections, and at least one bendable portion disposed between adjacent mass support sections. Each mass support section has an opening extending from the front side to the back side, and a plurality of heat activated expandable masses supported on both the front side and the back side of the carrier member. Each heat activated expandable mass is positioned over a mass support section and each heat activated expandable mass is disposed on the front side being connected through the opening to a corresponding heat activated expandable mass on the back side.	10-06-2011

Tae-Woong Lee, Kyunggi-Do KR

Patent application number	Description	Published
20110031442	Method For Preparing Electrostatic Dissipative Polymer - A method for preparing an electrostatic dissipative polymer and a blend of a thermoplastic polymer and the ESD polymer is disclosed. The method for preparing an electrostatic dissipative polymer includes the step of polymerizing the electrostatic dissipative polymer in the presence of a reactive solvent and lithium salt dissolved in the reactive solvent, wherein the amount of the reactive solvent is from 0.1 to 20 weight parts based on 100 weight parts of the produced electrostatic dissipative polymer, the amount of lithium salt is from 0.1 to 5 weight parts based on 100 weight parts of the produced electrostatic dissipative polymer, and the reactive solvent is aliphatic glycol having from 2 to 8 carbon atoms and having a primary alcohol group, or aromatic glycol having from 2 to 10 carbon atoms.	02-10-2011

Yoon-Seok Lee, Kyunggi-Do KR

Patent application number	Description	Published
20080299128	Effect of Bst2 on inflammation - The application disclose a method of preventing immune cells from binding to other cells, which includes contacting the immune cells and the other cells with a composition comprising Bst2 antagonist.	12-04-2008
20100129365	TREATMENT OF INFLAMMATION USING BST2 INHIBITOR - The application discloses a method of preventing immune cells from binding to other cells, which includes contacting the immune cells and the other cells with a composition comprising Bst2 antagonist.	05-27-2010

Patent applications by Yoon-Seok Lee, Kyunggi-Do KR

Young-Gue Lee, Kyunggi-Do KR

Patent application number	Description	Published
20090261470	CHIP PACKAGE - A chip package comprising a carrier, a chip, a plurality of first conductive elements, an encapsulation, and a conductive film is provided. The carrier has a carrying surface and a back surface opposite to the carrying surface. Furthermore, the carrier has a plurality of common contacts in the periphery of the carrying surface. The chip is disposed on the carrying surface and electrically connected to the carrier. In addition, the first conductive elements are disposed on the common contacts respectively. The encapsulation is disposed on the carrying surface and encapsulating the chip. Moreover, the conductive film is disposed over the encapsulation and the first conductive elements, so as to electrically connect with the common contacts via the first conductive elements. A process for fabricating the chip package is further provided. The chip package is capable of preventing the EMI problem and thus provides superior electrical performance.	10-22-2009

Young-Joo Lee, Kyunggi-Do KR

Patent application number	Description	Published
20090032052	Cosmetics Vessel - A cosmetic case is provided. The cosmetic case includes: a first casing having a first container; a second casing which is connected with the first casing in a sliding manner, opens and closes the first container, and has a second container; and a third casing which is connected with the second casing, and opens and closes the second container, wherein, when the first container is open by sliding the second casing with respect to the first casing, the third casing is lifted at the same time, thereby opening the second container.	02-05-2009

Yuyong Lee, Kyunggi-Do KR

Patent application number	Description	Published
20110260266	SEMICONDUCTOR PACKAGE STRUCTURE AND PACKAGE PROCESS - A semiconductor package structure and a package process are provided, wherein a lower surface of a die pad of a leadframe is exposed by an encapsulant so as to improve the heat dissipation efficiency of the semiconductor package structure. In addition, two chips are disposed at the same sides of the leadframe and the end portion of each of leads bonding to the upper chip is encapsulated by the encapsulant such that the scratch on the lead tips in wire bonding and die attach steps can be prevented and thus the wire bondability can be enhanced.	10-27-2011

Yu-Yong Lee, Kyunggi-Do KR

Patent application number	Description	Published
20120028459	MANUFACTURING PROCESS OF CIRCUIT SUBSTRATE - A manufacturing process of a circuit substrate is provided. A conductive structure including a first patterned conductive layer, a first dielectric layer, a second dielectric layer, a first conductive layer, and a second conductive layer is provided. The first dielectric layer and the second dielectric layer are respectively disposed on two opposite surfaces of the first patterned conductive layer. The first conductive layer and the second conductive layer are respectively disposed on the first dielectric layer and the second dielectric layer. The first dielectric layer is between the first patterned conductive layer and the first conductive layer. The second dielectric layer is between the first patterned conductive layer and the second conductive layer. A conductive via is formed at the conductive structure. The first conductive layer and the second conductive layer are patterned to respectively form a second patterned conductive layer and a third patterned conductive layer.	02-02-2012

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