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Lee, Hsinchu

Chao-Chi Lee, Hsinchu TW

Patent application numberDescriptionPublished
20090067474Adjusting method and system thereof for a temperature sensing element - A method and a system thereof for adjusting a temperature sensing element are proposed. The temperature sensing element is coupled to a control chip and has a temperature sensing resistor. Firstly, a memory area of the control chip is set to pre-store a temperature standard, and a predetermined standard is defined such that the temperature standard is equal to the predetermined standard ±ΔT. Then, the temperature sensing element is placed in and thermal equilibrates with a constant-temperature environment. The temperature sensing resistor is oscillated until a temperature measured by the temperature sensing element is consistent with the predetermined standard such that a first oscillation time is determined. A reference resistor is provided and oscillated based on the first oscillation time to determine an updated temperature standard, and then the updated temperature standard is stored to the memory area to replace the temperature standard pre-stored in the memory area.03-12-2009

Cheng-Hung Hung Lee, Hsinchu TW

Patent application numberDescriptionPublished
20090268501Novel SRAM Cell Array Structure - This invention discloses a static random access memory (SRAM) cell array structure which comprises a first and second bit-line coupled to a column of SRAM cells, the first and second bit-lines being substantially parallel to each other and formed by a first metal layer, and a first conductive line being placed between the first and second bit-lines and spanning across the column of SRAM cells without making conductive coupling thereto, the first conductive line being also formed by the first metal layer.10-29-2009

Chien-Hsiun Lee, Hsinchu TW

Patent application numberDescriptionPublished
20090321948METHOD FOR STACKING DEVICES - A method for fabricating a semiconductor device is provided which includes providing a first device, a second device, and a third device, providing a first coating material between the first device and the second device, the first coating material being uncured, providing a second coating material between the second device and the third device, the second coating material being uncured, and thereafter, curing the first and second coating materials in a same process.12-31-2009
20100279463METHOD OF FORMING STACKED-DIE PACKAGES - A method of forming a stacked die structure is disclosed. A plurality of dies are respectively bonded to a plurality of semiconductor chips on a first surface of a wafer. An encapsulation structure is formed over the plurality of dies and the first surface of the wafer. The encapsulation structure covers a central portion of the first surface of the wafer and leaves an edge portion of the wafer exposed. A protective material is formed over the first surface of the edge portion of the wafer.11-04-2010

Patent applications by Chien-Hsiun Lee, Hsinchu TW

Chien-Hui Lee, Hsinchu TW

Patent application numberDescriptionPublished
20100330321COVER LAYER FOR PRINTED CIRCUIT BOARD - The present invention provides a cover layer for a printed circuit board. The cover layer includes a first polymer layer, a second polymer layer and a light-reflecting layer disposed between the first and second polymer layers and having a thickness being 0.5 to 10 micro meters. Due to the light-reflecting layer, the cover layer of the present invention has high reflection rate and great flexibility suitable for a flexible printed circuit board.12-30-2010
20110086192COVER LAYER FOR PRINTED CIRCUIT BOARD - The present invention provides a cover film for a printed circuit board. The cover film includes an adhesive layer; a core layer made of a polymer; and a composite material layer formed on the core layer, comprising epoxy resin, a black material selected from the group consisting of a black pigment, carbon powder, nano carbon tube and a combination thereof, and an additive selected from the group consisting of titanium dioxide, boron nitride, barium sulfate and a combination thereof, wherein the core layer is disposed between the adhesive layer and the composite material layer, and the adhesive layer and the composite material layer have the same thickness or have a thickness difference being no more than 15 micro meters. The cover film of the preset invention is capable of shielding circuit patterns and has great folding endurance, and is thus applicable to flexible printed circuit boards.04-14-2011
20110114371COMPOSITE DOUBLE-SIDED COPPER FOIL SUBSTRATES AND FLEXIBLE PRINTED CIRCUIT BOARD STRUCTURES USING THE SAME - A double-sided copper foil substrate, which comprises: a polymer layer; a first copper foil; an adhesive layer formed on the polymer layer such that the polymer layer is sandwiched between the adhesive layer and the first copper layer; and a second copper foil causing the adhesive layer to be sandwiched between the second copper foil and the polymer layer, wherein the polymer layer and the adhesive layer have a total thickness of from 12 to 25 μm. The present invention further provides a flexible printed circuit board structure utilizing the composite double-sided copper foil substrate of the present invention, wherein the second double-sided copper foil substrate has a trench for exposing a portion of the adhesive layer. The double-sided copper foil substrate of the present invention are lower in rebound and satisfying the demand for the greater number of bending and sliding cycles under a lower R angle, and particularly is suitable for thin and flexible electronic products.05-19-2011

Chih-Kuo Lee, Hsinchu TW

Patent application numberDescriptionPublished
20090033646DISPLAY WITH A LUMINANCE AND COLOR TEMPERATURE CONTROL SYSTEM AND METHOD FOR CONTROLLING THE LUMINANCE OF A DISPLAY - A display includes a display module, a light source, a light source driving circuit, a display driving circuit, and an optical sensor. The optical sensor is installed next to the light source for detecting the luminance and color temperature of the light source. The optical sensor is coupled to the display driving circuit for generating a feedback signal to the display driving circuit according to the luminance and the color temperature of the light source. The display driving circuit drives the display module to display an image according to a received image signal and updates the data of the image signal according to the feedback signal so as to adjust the luminance and the color temperature of the image.02-05-2009

Ching Liang Lee, Hsinchu TW

Patent application numberDescriptionPublished
20090256774Outdoor antenna box - The present invention provides an outdoor antenna box comprising a thermally conductive baseboard; a thermally conductive reflector in planar contact with the thermally conductive baseboard and has a first side face and a second side face; an antenna board securely mounted on the first side face of the thermally conductive reflector; a circuit board having a thermal body where the heat energy generated by the thermal body is transferred to the second side face of the thermally conductive reflector via a thermally conductive element; and a casing having an opening covered by the thermally conductive baseboard and an accommodation space that houses the thermally conductive reflector, the antenna board and the circuit board.10-15-2009

Ching-Ran Lee, Hsinchu TW

Patent application numberDescriptionPublished
20100060201METHOD OF CONTROLLING A BALLAST FOR A HIGH INTENSITY DISCHARGE LAMP AND RELATED SYSTEM - A method of controlling a ballast for a high intensity discharge (HID) lamp and related system. The method includes setting initial operating parameters of the ballast to turn on the HID lamp, generating starting transient electric characteristic values of the HID lamp by measuring actual electric parameters at a predetermined time during a transient process after the HID lamp is turned on, searching stored data for a rated power corresponding to the starting transient electric characteristic value range of the HID lamp after determining that the starting transient electric characteristic value is within stored starting transient electric characteristic value ranges of the HID lamp, and searching the stored data for a corresponding ballast operating parameter, to allow the HID lamp to operate in the corresponding rated power, and realize that a single ballast can be adapted to and control the HID lamps to operable in their respective specific rated power.03-11-2010

Chun-Kuan Lee, Hsinchu TW

Patent application numberDescriptionPublished
20090256307SHEET SEPARATING MECHANISM OF AN AUTO SHEET FEEDER AND AUTO SHEET FEEDER INCORPORATING THE SAME - An auto sheet feeder used for a device comprises an upper frame, a pick roller and a sheet separating mechanism secured on the upper frame. The sheet separating mechanism includes a bracket and a pair of arms disposed on the bracket and spring-biased toward the pick roller. A separator pad is disposed on the bracket and spring-biased toward the pick roller. A press plate is positioned on the bracket and presses against the separator pad. A torsion spring mounted above the press plate has at least two coil portions. Two adjacent ends of the coil portions extend toward the same side and then joint each other to form a contact portion which always props the upper frame. Two ends of the torsion spring have a retaining arm respectively. The two retaining arms are opposite each other and pivotally engage to two sides of the press plate respectively. The torsion spring is compressed by the press plate when the sheets push the separator pad and pushes the press plate and the separator pad to be reposition after the lowermost one of the sheets is separated.10-15-2009
20100258997SHEET PROCESSING APPARATUS AND SHEET PROCESSING METHOD - A sheet processing apparatus includes a sheet-table unit, a sheet-separating unit disposed at a downstream end of the sheet-table unit along a convey direction of the sheets, a convey unit arranged at a downstream end of sheet-separating unit, a discharge unit located at a downstream end of the convey unit, an sheet processing unit placed between the convey unit and the discharge unit, a speed sensor arranged at an upstream end of the sheet-separating unit for detecting a movement of each sheet for forming a sheet interval between two adjacent sheets, and an edge sensor located between the sheet-separating unit and the sheet processing unit. The edge sensor detects a front edge and a rear edge of each sheet passing therethrough, and sends corresponding control signals to a system controller which delays a predetermined time according to the control signals to control the sheet processing unit to start and stop processing.10-14-2010

Chun-Tao Lee, Hsinchu TW

Patent application numberDescriptionPublished
20080296569Compound semiconductor material and method for forming an active layer of a thin film transistor device - A compound semiconductor material for forming an active layer of a thin film transistor device is disclosed, which has a group II-VI compound doped with a dopant ranging from 0.1 to 30 mol %, wherein the dopant is selected from a group consisting of alkaline-earth metals, group IIIA elements, group IVA elements, group VA elements, group VIA elements, and transitional metals. The method for forming an active layer of a thin film transistor device by using the compound semiconductor material of the present invention is disclosed therewith.12-04-2008

Patent applications by Chun-Tao Lee, Hsinchu TW

Den-Hua Lee, Hsinchu TW

Patent application numberDescriptionPublished
20090033688BRIGHTNESS ADJUSTING METHOD AND DEVICE FOR AN LED-BASED DISPLAY PANEL - A brightness adjusting device for a light-emitting diode (LED) display panel has at least one photo sensor, a control circuit, a timing controller and a driving circuit. The LED display panel is composed of multiple LEDs being divided into groups according to color. The photo sensor sequentially senses brightness of the groups of LEDs and generates brightness values. The control circuit compares the brightness values to standard brightness values. Based on the compared results, the driving circuit adjusts the brightness of corresponding LEDs.02-05-2009

Fwu-Ling Lee, Hsinchu TW

Patent application numberDescriptionPublished
20100317066Bioreactor and method for producing microbial cellulose - A technique for producing microbial cellulose is provided, including: preparing a liquid medium for microbial cultivation in a container; horizontally rotating multiple hollow tubes that are fitted together or separated from one another, so that each of the hollow tubes is alternately partially immersed in the liquid medium and partially exposed above the horizontal surface of the liquid medium; wherein each of the hollow tubes has a rough outer surface and a smooth inner surface, so as to allow microorganisms to form microbial cellulose on the outer surface of each hollow tube, as well as forming sheets of microbial cellulose on the horizontal surface of the liquid medium not being disturbed by the hollow tubes, and removing the microbial cellulose from the outer surfaces of the hollow tubes in order to obtain tubular microbial cellulose. In addition, the sheets of microbial cellulose are also harvested from the liquid medium.12-16-2010

Hao-Chieh Lee, Hsinchu TW

Patent application numberDescriptionPublished
20080277721THIN FILM TRANSISTOR, PIXEL STRUCTURE AND FABRICATING METHOD THEREOF - A fabricating method of a TFT includes first forming a source on a substrate. Then, a first insulation pattern layer is formed to cover parts of the source and the substrate. The first insulation pattern layer has an opening exposing a part of the source. Thereafter, a gate pattern layer is formed on the first insulation pattern layer. Then, the gate pattern layer and a second insulation pattern layer formed thereon surround the opening. Moreover, a second lateral protection wall is formed on an edge of the gate pattern layer in the opening. Afterwards, a channel layer is formed in the opening and covers the second lateral protection wall and the source. Then, a passivation layer with a contact window is formed on the channel layer and the second insulation pattern layer to expose a portion of the channel layer. Thereafter, a drain is formed on the exposed channel layer.11-13-2008
20100136753FABRICATING METHOD OF THIN FILM TRANSISTOR - A fabricating method of a TFT includes first forming a source on a substrate. Then, a first insulation pattern layer is formed to cover parts of the source and the substrate. The first insulation pattern layer has an opening exposing a part of the source. Thereafter, a gate pattern layer is formed on the first insulation pattern layer. Then, the gate pattern layer and a second insulation pattern layer formed thereon surround the opening. Moreover, a second lateral protection wall is formed on an edge of the gate pattern layer in the opening. Afterwards, a channel layer is formed in the opening and covers the second lateral protection wall and the source. Then, a passivation layer with a contact window is formed on the channel layer and the second insulation pattern layer to expose a portion of the channel layer. Thereafter, a drain is formed on the exposed channel layer.06-03-2010

Hsiang-Fan Lee, Hsinchu TW

Patent application numberDescriptionPublished
20080217775Method of forming contact plugs for eliminating tungsten seam issue - A method of forming a contact plug of an eDRAM device includes the following steps: forming a tungsten layer with tungsten seam on a dielectric layer to fill a contact hole; removing the tungsten layer from the top surface of the dielectric layer, recessing the tungsten layer in the contact hole to form a recess of about 600˜900 Angstroms in depth below the top surface of the dielectric layer, depositing a conductive layer on the dielectric layer and the recessed tungsten plug to fill the recess; and removing the conductive layer from the top surface of the dielectric layer to form a conductive plug on the recessed tungsten plug in the contact hole.09-11-2008

Hsiao-Hui Lee, Hsinchu TW

Patent application numberDescriptionPublished
20080250297METHOD AND SYSTEM FOR CALCULATING CRC - The invention relates to a method and system for calculating CRC. Firstly, a Partial CRC is calculated directly according to a segment of a message. Then, a First Code comprising the Partial CRC appended with a plurality of zero-bytes is generated. Finally, the Adjusted CRC is calculated according to the First Code. Therefore, the method and system of the invention can derive an Adjusted CRC directly from each segment of a message. After all segments of a message are received, all the derived Adjusted CRCs are merged to obtain a Final CRC of the message. The method and system of the invention can be quickly prototyped and implemented to various systems due to its simplicity.10-09-2008

Hsin Jen Lee, Hsinchu TW

Patent application numberDescriptionPublished
20100068442Trimethine Cyanine Compounds, Their Preparation and Their Use - The present invention relates to a trimethine cyanine represented by the formula (1):03-18-2010

Hsin-Ta Lee, Hsinchu TW

Patent application numberDescriptionPublished
20110164206LIQUID CRYSTAL DISPLAY DEVICE - The present invention provides an improved type of liquid crystal (LC) display device with wide-viewing angle and high optical transmittance. The LC display of the present invention consists of: at least one LC alignment apparatus, which makes the LC molecules within the display area forming a continuous-domain or multi-domain alignments, and hence improve its wide-viewing-angle characteristics; a LC layer formed by Nematic type LC with chiral dopants, and with optimal parameters of the optical path difference Δnd and LC rotations of d/p ratio, such that LC molecules can be aligned along all radial directions to achieve optimal transmittance, and thus producing an wide-viewing-angle LC display improved transmittance without the formation of dark fringes in the display area.07-07-2011

I-Long Lee, Hsinchu TW

Patent application numberDescriptionPublished
20080285342Method of Programming a Nonvolatile Memory Cell and Related Memory Array - A programming method for programming stored bits in floating gates of a flash memory cell or selected flash memory cells of a flash memory array is utilized for applying SSI injection on said flash memory cell or said selected flash memory cells of a flash memory array is disclosed. Constant charges at the drain regions of said flash memory cell or said selected flash memory cells of the flash memory array is implemented with a capacitor and a related switch for suppressing variant injected-charges-related properties in applying the SSI injection. A constant biasing current, which may be implemented with a constant current source or a current mirror equipped with a constant current source, is applied on source regions of said flash memory cell or said selected flash memory cells of the flash memory array for enhancing the suppression of said variant biasing properties.11-20-2008

In-Shuen Lee, Hsinchu TW

Patent application numberDescriptionPublished
20110029992Casing assembling structure of optical disc drive - A casing assembling structure of an optical disc drive is provided to comprise a bottom cover; a top cover combined with the bottom cover to form a space, wherein the top cover has a first side wall and a fixing portion, which is extended from the first side wall and is positioned under the bottom cover; and a first screw screwed on the fixing portion, wherein the top cover, the first side wall and the fixing portion are formed as a integral.02-03-2011

Jenq Kuen Lee, Hsinchu TW

Patent application numberDescriptionPublished
20080270771METHOD OF OPTIMIZING MULTI-SET CONTEXT SWITCH FOR EMBEDDED PROCESSORS - A method of optimizing multi-set context switch for embedded processors includes the steps of partitioning a plurality of registers into a plurality of register sets based on a live-range-sensitive context-switch procedure that is associated with a usage frequency of each of the registers, storing contents of first target registers according to live set information of a current task, wherein the first target registers are selected from the register sets, determining a next task by an operating system and updating the live set information according to the next task, and restoring contents of second target registers according to the updated live set information, wherein the second target registers are selected from the register sets.10-30-2008
20100037037METHOD FOR INSTRUCTION PIPELINING ON IRREGULAR REGISTER FILES - A method for pipelining instructions on a PAC processor includes determining a minimum initial interval, and grouping the instructions so that the operands of dependent instructions are assigned to the same local register file. The virtual registers of the instructions that have data dependency across the first functional unit and the second functional unit are assigned to a global register file. The instructions are then modulo scheduled based on a current value of initial interval. The virtual registers of the scheduled instructions are allocated to the corresponding register files. If the allocation fails, a set of virtual registers is transferred from the first or second register file to the global register file.02-11-2010
20110087922TEST METHOD AND TOOL FOR MASTER-SLAVE SYSTEMS ON MULTICORE PROCESSORS - A test method for a master-slave concurrent system running on a multicore processor includes the steps of establishing a PFA, otherwise called probabilistic finite automata, or probabilistic finite state machine, for a given regular expression; generating test patterns by running the PFA; splitting and merging the test patterns to generate an interleaved test pattern; and performing test on the master-slave system according to the interleaved test pattern. In an embodiment, the method further includes a step of debugging failures of the multicore processor during testing.04-14-2011

Patent applications by Jenq Kuen Lee, Hsinchu TW

Jia-Ling Lee, Hsinchu TW

Patent application numberDescriptionPublished
20090235894Lubrication apparatus for engines - A lubrication apparatus for an engine includes a crankshaft chamber, a camshaft chamber, and an oil reservoir chamber, wherein an oil-suction piping path is provided in the oil reservoir chamber, and is communicated between the crankshaft chamber and the oil reservoir chamber. The oil-suction piping path includes, among others, a rotatable pipe including a plurality of oil-suction orifices located at wall of the rotatable pipe. No matter the engine is situated at any state of declination, at least one of the oil-suction orifices and an air-suction vent is kept under the surface of the lubricant, so that the engine can be appropriately lubricated. Further, a one-way valve is arranged between the crankshaft chamber and the oil reservoir chamber, where most of the lubricant can flow back to the oil reservoir chamber during the descending stroke of a piston, so that a lubricant supply can be reduced.09-24-2009

Jian-Hsing Lee, Hsinchu TW

Patent application numberDescriptionPublished
20100289057INTEGRATED CIRCUITS USING GUARD RINGS FOR ESD, SYSTEMS, AND METHODS FOR FORMING THE INTEGRATED CIRCUITS - An integrated circuit includes at least one transistor over a substrate. A first guard ring is disposed around the at least one transistor. The first guard ring has a first type dopant. A second guard ring is disposed around the first guard ring. The second guard ring has a second type dopant. A first doped region is disposed adjacent to the first guard ring. The first doped region has the second type dopant. A second doped region is disposed adjacent to the second guard ring. The second doped region has the first type dopant. The first guard ring, the second guard ring, the first doped region, and the second doped region are capable of being operable as a first silicon controlled rectifier (SCR) to substantially release an electrostatic discharge (ESD).11-18-2010

Patent applications by Jian-Hsing Lee, Hsinchu TW

Jih-San Lee, Hsinchu TW

Patent application numberDescriptionPublished
20110193586Alternating Current (AC) Stress Test Circuit, Method for Evaluating AC Stress Induced Hot Carrier Injection (HCI) Degradation, and Test Structure for HCI Degradation Evaluation - An AC stress test circuit for HCI degradation evaluation in semiconductor devices includes a ring oscillator circuit, first and second pads, and first and second isolating switches. The ring oscillator circuit has a plurality of stages connected in series to form a loop. Each of the stages comprises a first node and a second node. The first and second isolating switches respectively connect the first and second pads to the first and second nodes of a designated stage and both are switched-off during ring oscillator stressing of the designated stage. The present invention also provides a method of evaluating AC stress induced HCI degradation, and a test structure.08-11-2011

Jin-Shyan Lee, Hsinchu TW

Patent application numberDescriptionPublished
20100142425TRANSMISSION POWER CONTROL METHOD AND SYSTEM - A transmitting power level control method and system are provided, whereby the power of a terminal device in a wireless sensor network is saved and the lifetime thereof is extended. The control method includes the steps of: (A) broadcasting a plurality of transmitting power level (TPL) messages, each of which represents a respective TPL and the respective TPLs are different from one another, wherein each of the plurality of TPL messages is broadcasted at the respective TPL thereof; and (B) setting a TPL for the terminal device at a minimum one of the TPLs represented by the TPL messages received by the terminal device.06-10-2010

Jin-Yuan Lee, Hsinchu TW

Patent application numberDescriptionPublished
20080296761Cylindrical Bonding Structure and method of manufacture - A cylindrical bonding structure and its method of manufacture. The cylindrical bonding structure is formed over the bonding pad of a silicon chip and the chip is flipped over to connect with a substrate board in the process of forming a flip-chip package. The cylindrical bonding structure mainly includes a conductive cylinder and a solder block. The conductive cylinder is formed over the bonding pad of the silicon chip and the solder block is attached to the upper end of the conductive cylinder. The solder block has a melting point lower than the conductive cylinder. The solder block can be configured into a cylindrical, spherical or hemispherical shape. To fabricate the cylindrical bonding structure, a patterned mask layer having a plurality of openings that correspond in position to the bonding pads on the wafer is formed over a silicon wafer. Conductive material is deposited into the openings to form conductive cylinders and finally a solder block is attached to the end of each conductive cylinder.12-04-2008
20080315424Structure and manufactruing method of chip scale package - A Chip Scale Package (CSP) and a method of forming the same are disclosed. Single chips without the conventional ball mountings, are first attached to an adhesive-substrate (adsubstrate) composite having openings that correspond to the input/output (I/O) pads on the single chips to form a composite chip package. Ball mounting is then performed over the openings, thus connecting the I/O pads at the chip sites to the next level of packaging directly. In another embodiment, the adhesive layer is formed on the wafer side first to form an adwafer, which is then die sawed in CSPs. Then the CSPs with the adhesive already on them are bonded to a substrate. The composite chip package may optionally be encapsulated with a molding material. The CSPs provide integrated and shorter chip connections especially suited for high frequency circuit applications, and can leverage the currently existing test infrastructure.12-25-2008
20090008778Structure and manufactruing method of chip scale package - A Chip Scale Package (CSP) and a method of forming the same are disclosed. Single chips without the conventional ball mountings, are first attached to an adhesive-substrate (adsubstrate) composite having openings that correspond to the input/output (I/O) pads on the single chips to form a composite chip package. Ball mounting is then performed over the openings, thus connecting the I/O pads at the chip sites to the next level of packaging directly. In another embodiment, the adhesive layer is formed on the wafer side first to form an adwafer, which is then die sawed in CSPs. Then the CSPs with the adhesive already on them are bonded to a substrate. The composite chip package may optionally be encapsulated with a molding material. The CSPs provide integrated and shorter chip connections especially suited for high frequency circuit applications, and can leverage the currently existing test infrastructure.01-08-2009
20090011542Structure and manufactruing method of chip scale package - A Chip Scale Package (CSP) and a method of forming the same are disclosed. Single chips without the conventional ball mountings, are first attached to an adhesive-substrate (adsubstrate) composite having openings that correspond to the input/output (I/O) pads on the single chips to form a composite chip package. Ball mounting is then performed over the openings, thus connecting the I/O pads at the chip sites to the next level of packaging directly. In another embodiment, the adhesive layer is formed on the wafer side first to form an adwafer, which is then die sawed in CSPs. Then the CSPs with the adhesive already on them are bonded to a substrate. The composite chip package may optionally be encapsulated with a molding material. The CSPs provide integrated and shorter chip connections especially suited for high frequency circuit applications, and can leverage the currently existing test infrastructure.01-08-2009
20090104769Semiconductor chip with coil element over passivation layer - A method for fabricating a circuitry component includes providing a semiconductor substrate, a first coil over said semiconductor substrate, a passivation layer over said first coil; and depositing a second coil over said passivation layer and over said first coil. Said second coil may be deposited by forming a first metal layer over said passivation layer, forming a pattern defining layer over said first metal layer, a first opening in said pattern defining layer exposing said first metal layer, forming a second metal layer over said first metal layer exposed by said first opening, removing said pattern defining layer, and removing said first metal layer not under said second metal layer.04-23-2009
20090289346Structure and manufacturing method of chip scale package - A Chip Scale Package (CSP) and a method of forming the same are disclosed. Single chips without the conventional ball mountings, are first attached to an adhesive-substrate (adsubstrate) composite having openings that correspond to the input/output (I/O) pads on the single chips to form a composite chip package. Ball mounting is then performed over the openings, thus connecting the I/O pads at the chip sites to the next level of packaging directly. In another embodiment, the adhesive layer is formed on the wafer side first to form an adwafer, which is then die sawed in CSPs. Then the CSPs with the adhesive already on them are bonded to a substrate. The composite chip package may optionally be encapsulated with a molding material. The CSPs provide integrated and shorter chip connections especially suited for high frequency circuit applications, and can leverage the currently existing test infrastructure.11-26-2009

Patent applications by Jin-Yuan Lee, Hsinchu TW

Johnsee Lee, Hsinchu TW

Patent application numberDescriptionPublished
20100214501IMAGE DISPLAY CAPABLE OF BEING AN ELECTRONIC CURTAIN - An image display comprises at least one display device having a first pair of transparent conductive layers, a second pair of transparent conductive layers spaced apart from the first pair transparent conductive layers, a display layer disposed between the first pair of transparent conductive layers, the display layer configured to display an image in response to a first set of voltages applied to the first pair of transparent conductive layers, and a light control layer disposed between the second pair of transparent conductive layers, the light control layer configured to operate in one of a transmissive mode to allow an incident light to pass toward the display layer and a reflective mode to reflect an incident light away from the display layer in response to a second set of voltages applied to the second pair of transparent conductive layers.08-26-2010

Jyi Hsiang Lee, Hsinchu TW

Patent application numberDescriptionPublished
20090170971METHOD FOR MANUFACTURING STARCH FOAM - A method for manufacturing a starch foam is provided. A mixture is mixed to form a foamable mixture. The mixture includes a starch, a nucleating agent, and a foaming agent. The foamable mixture is foamed to form a foam. The starch includes a cereal or a root crop. The cereal includes rice, wheat or corn. The root crop includes cassava, sweet potato or potato.07-02-2009

Kian-Leng Lee, Hsinchu TW

Patent application numberDescriptionPublished
20090083476SOLID STATE DISK STORAGE SYSTEM WITH PARALLEL ACCESSSING ARCHITECTURE AND SOLID STATE DISCK CONTROLLER - A solid state disk (SSD) storage system with a parallel accessing architecture, including a SSD controller and a plurality of transmission interfaces of a predetermined bit number and bandwidth, and a solid state disk controller thereof are provided. The SD controller forms channels for transmitting control signals and data with one or more flash memories through each of the transmission interfaces. That is, independent transmission channels are constituted between the SSD controller, the transmission interfaces with multiple bits, and the flash memories. In one embodiment, the transmission interfaces are compatible with MMC 4.0 protocol or higher. Moreover, a host controls and accesses the flash memories through a SATA bus interface and the SSD controller, and uses a direct memory access (DMA) engine with a bidirectional connection port in the SSD controller to transmit data.03-26-2009

Ko-Yi Lee, Hsinchu TW

Patent application numberDescriptionPublished
20090121222Test Structure - A test structure to detect vertical leakage in a multi-layer flip chip pad stack or similar semiconductor device. The test structure is integrated into the semiconductor device when it is fabricated. A metal layer includes at least two portions that are electrically isolated from each other; one portion being disposed under a test pad, and another portion being disposed under a pad associated with a pad structure being tested. The metal layer in most cases is separated from a top metal layer directly underlying the pads by an inter-metal dielectric (IMD) layer. A metal layer portion underlying the pad to be tested forms a recess in which a conductive member is disposed without making electrical contact. The conductive line is electrically coupled to a test portion of the same or, alternately, of a different metal layer. The test structure may be implemented on multiple layers, with recesses portions underlying the same or different pads.05-14-2009

Kuan-Rong Lee, Hsinchu TW

Patent application numberDescriptionPublished
20090033688BRIGHTNESS ADJUSTING METHOD AND DEVICE FOR AN LED-BASED DISPLAY PANEL - A brightness adjusting device for a light-emitting diode (LED) display panel has at least one photo sensor, a control circuit, a timing controller and a driving circuit. The LED display panel is composed of multiple LEDs being divided into groups according to color. The photo sensor sequentially senses brightness of the groups of LEDs and generates brightness values. The control circuit compares the brightness values to standard brightness values. Based on the compared results, the driving circuit adjusts the brightness of corresponding LEDs.02-05-2009
20110109903Imaging Spectrometer - The present invention relates to an imaging device simultaneous records image and spectrum of an interested target utilizes spectral technology to acquire, process and exploit image data or spectrum data. The present invention allows for real time detection and identification of not only the traditional images but also the spectrum which shows the surface of the earth or reveals the chemical composition of the targeted tissue. The present invention includes a reflecting telescope, an imaging concave grating (ICG) system with spectrometer and a processor that performs spectral analysis on spectral data generated from the spectrometer.05-12-2011

Kuen-Ming Lee, Hsinchu TW

Patent application numberDescriptionPublished
20090172158MEMORY MANAGEMENT SYSTEM AND METHOD FOR OPEN PLATFORM - The present invention relates to a memory management system and method for open platform. The memory management system and method of the present invention utilizes the main spirit of sharing service in open platform. When the used memory in local open platform exceeds an upper limit, the standard service bundle access interface is used for accessing the standard service bundle in remote open platform. Therefore, the standard service bundle in local open platform can be off-loaded to release the memory space so as to resolve the memory shortage problem. The stability of the whole system can be maintained.07-02-2009

Liu-Chung Lee, Hsinchu TW

Patent application numberDescriptionPublished
20090167975Liquid Crystal Display Unit Structure and Manufacturing Method Thereof - A liquid crystal display unit structure and the manufacturing method thereof are provided. The method comprises the following steps: forming a patterned first metal layer with a first data line segment and a lower gate pad on a substrate; forming a patterned dielectric layer covering the first data line and the lower gate pad having a plurality of first openings and a second opening therein, forming a patterned second metal layer including a common line, a second data line segment and a upper gate pad, wherein the upper gate pad is electrically connected to the lower gate pad through the first openings, and the second data line segment is electrically connected to the first data line segment through the first openings; finally forming a patterned passivation layer and a patterned transparent conductive layer.07-02-2009
20110165725Pixel Structure and Method for Fabricating the Same - A pixel structure is disclosed. The pixel structure includes a substrate, a first data line having at least one end formed on the substrate, a first insulation layer overlying the first data line and exposing a part of the end of the first data line, a shielding electrode disposed on the first insulation layer and overlapped with the first data line, a second data line formed on the first insulation layer and electrically connected to the exposed end of the first data line, a second insulation layer overlying the shielding electrode and the second data line, and a pixel electrode formed on the second insulation layer and overlapped with the shielding electrode. The invention also provides a method for fabricating the pixel structure.07-07-2011

Patent applications by Liu-Chung Lee, Hsinchu TW

Lung-Cheng Lee, Hsinchu TW

Patent application numberDescriptionPublished
20110063434Monitor system for monitoring riverbed elevation change at bridge pier - A monitor system for monitoring riverbed elevation changes at bridge piers is revealed. The monitor system includes a container, a rail, a holder, a photographic unit, a processor and a transmission unit. The container is disposed at a pier under the water and the rail is mounted in the container. The holder is arranged at the rail and is moved on the rail. The photographic unit is disposed on the holder to capture a monitor image of a riverbed under the water. As to the processor, it processes the monitor image so as to learn elevation change of the riverbed under the water. By the transmission unit, the riverbed elevation change is sent to a remote monitor unit so as to get the riverbed elevation according to the riverbed elevation change. Thus the riverbed elevation change at the bridge pier is monitored in real time.03-17-2011

Meng-Ting Lee, Hsinchu TW

Patent application numberDescriptionPublished
20090295278Organic light-emitting laminate and organic electroluminescent device conatiaing the same - Provided is an organic light-emitting laminate for use in an organic electroluminescent device, characterized in comprising: 12-03-2009
20100314612WHITE ORGANIC LIGHT-EMITTING DEVICE - A white organic light-emitting device is provided by the present invention. The white organic light-emitting device includes an anode, a hole transport layer, a first light-emitting layer, a second light-emitting layer, a third light-emitting layer, an electron transport layer and a cathode, wherein the second light-emitting layer is formed between the first and the third light-emitting layers, the emission wavelength of the second light-emitting layer is longer than that of the first and third light-emitting layers, and the host material of the first and third light-emitting layer are different. The white organic light-emitting device of the present invention is capable of effectively increasing the luminous efficiency, reducing operating voltage, and providing color stability.12-16-2010

Ming Tang Lee, Hsinchu TW

Patent application numberDescriptionPublished
20090016358METHOD FOR TRANSMITTING DATA IN VIRTUAL WAN AND SYSTEM THEREOF - A system for transmitting data in a virtual WAN comprises a plurality of routers, and each router comprises at least one connection port, a network status receiver and a redirection-processing unit. The network status receiver is configured to obtain bandwidth utilization information of other routers through the connection port. The redirection-processing unit is configured to determine whether the router needs to conduct a redirection and to establish a feasible redirection path based on the bandwidth utilization information of other routers.01-15-2009

Min Hung Lee, Hsinchu TW

Patent application numberDescriptionPublished
20090302349STRAINED GERMANIUM FIELD EFFECT TRANSISTOR AND METHOD OF FABRICATING THE SAME - A strained germanium field effect transistor (FET) and method of fabricating the same is related to the strained Ge field effect transistor with a thin and pure Ge layer as a carrier channel. The pure Ge layer with the thickness between 1 nm and 10 nm is formed between an unstrained substrate and a gate insulation layer, and directly contacts with the unstrained substrate. The gate is disposed on the gate insulation layer. The germanium layer is used as a carrier transport channel of the strained Ge FET to improve the drive current and the carrier mobility, and to increase the devices performance effectively. Furthermore, a Si protective layer with extremely thin thickness can be deposed between and directly contacts with the gate insulation layer and the pure Ge layer.12-10-2009

Patent applications by Min Hung Lee, Hsinchu TW

Nan-Ching Lee, Hsinchu TW

Patent application numberDescriptionPublished
20090154179Back bezel for use in a back light module - A back bezel for use in a back light module is disclosed. The back bezel comprises a body and a reinforced structure. The body includes a plastic portion and a plurality of openings arranged in the plastic portion. The body further includes a first side and a second side opposite the first side. The reinforced structure of the back bezel is formed on the plastic portion to increase the structural strength of the body.06-18-2009

Pei Hung Lee, Hsinchu TW

Patent application numberDescriptionPublished
20100185698METHOD FOR AUTO UPLOADING FILES AND RELATED COMPUTER-READABLE MEDIUM - The present invention provides a method for auto uploading files and a related computer-readable medium. The method of the present invention comprises: determining whether file variations occur in at least a folder of a first electronic device to generate a determining result; and executing an auto uploading operation to auto upload files resulting in the file variations occurring in the folder to a data storage space of at least a second electronic device when the determining result indicating that the file variations occur in the folder. The present invention can be utilized for auto uploading different types of files to different types of network sharing spaces such as YouTube, Flickr, Picasa, and File Transfer Protocol (FTP) server. Thus, the present invention can help users to save a lot of time in uploading files to the different types of network sharing spaces.07-22-2010

Ping-Chang Lee, Hsinchu TW

Patent application numberDescriptionPublished
20100284585Method for Searching and Constructing 3D Image Database - The present invention relates to methods for searching and constructing a 3D motif image database, wherein said 3D motif image database can be used to understand the connection relationship of a 3D network, e.g. a neural network comprising biological neural networks or artificial neural networks. The searching and constructing methods are applied on the 3D motif image database, a proper computer-aided graphic platform. The database not only facilitates the management of the huge amount of categorized data but also rationally excavates the hidden information cloaked within.11-11-2010

Ren-Jie Lee, Hsinchu TW

Patent application numberDescriptionPublished
20110093828Pin-out Designation Method for Package-Board Codesign - A pin out designation method for package board codesign having steps of defining pin characteristics and requirements, generating multiple pin patterns, pin blocks construction and grouping and pin blocks floorplanning. Designers may use an EDA tool to generate multiple pin patterns, use the pin patterns to construct multiple pin blocks, group the pin blocks around four sides of a chip and adjusts the pin blocks into a minimized package size of the chip.04-21-2011

Rong-Shen Lee, Hsinchu TW

Patent application numberDescriptionPublished
20110156249WAFER-TO-WAFER STACK WITH SUPPORTING PEDESTAL - An electronic device having a stacked structure is provided. The electronic device includes a first electronic layer, a second electronic layer disposed on the first electronic layer, and at least a post. The first electronic layer has a first interface, and including a first substrate and a first device layer disposed on the first substrate. The first interface is located between the first substrate and the first device layer, and the first device layer has a surface opposite to the first interface. The post is arranged in the first device layer, and extending from the first interface to the surface of the first device layer.06-30-2011

Sea-Huang Lee, Hsinchu TW

Patent application numberDescriptionPublished
20090002645LENS-SHIFTING DEVICE - A lens-shifting device including a base, two fixing rods, a sliding plate, a first and a second gear set is provided. The sliding plate is slidably mounted on the fixing rods via the fixing rods. A lens is fixed on the sliding plate and the sliding plate has a rack disposed on one side thereof. The first gear set has a first gear and a worm gear co-axial therewith. One of the fixing rods passes through the first gear such that the first gear and the worm gear may rotate relative to the fixing rod. The second gear set having a worm wheel and a second gear co-axial therewith is disposed between the fixing rod and the rack. The worm gear is for driving the worm wheel and the second gear is used for driving the rack such that the sliding plate moves relative to the fixing rods.01-01-2009
20090075151FUEL CELL AND MIXING MODULE THEREOF - A fuel cell is provided comprising a cell module and a mixing module. The mixing module is connected to the cell module. A vapor current enters the mixing module from the cell module. The mixing module comprises a condensing unit, a mixing sink, and a check valve. The vapor current enters the condensing unit to be condensed into a first liquid. The mixing sink comprises a sink body and a spacer, wherein the sink body receives a second liquid, the spacer spaces the sink body and the condensing unit, the spacer comprises a through hole, and the first liquid enters the mixing sink through the through hole. The check valve is disposed in the through hole, wherein the check valve comprises a valve body and a valve cover, the valve is disposed in the through hole, and the valve cover restricts the valve body in the through hole.03-19-2009

Shih-Fong Lee, Hsinchu TW

Patent application numberDescriptionPublished
20110105715Titanium Oxide Composition and the Application Thereof on Poly-Esterification - The application discloses a Titanium oxide composition and the application thereof. The mentioned Titanium oxide composition comprises Titanium co-precipitate(s), organic acid, diol, and water. According to this application, a catalyzed poly-esterification with said Titanium oxide composition is also disclosed. The mentioned polyesterification comprises a step of adding said Titanium oxide composition into at least one stage selected from slurry stage, esterification stage, and polycondensation stage.05-05-2011

Shi-Ri Lee, Hsinchu TW

Patent application numberDescriptionPublished
20100163752METHOD OF PROCESSING OBJECTS BY FOCUSED ION BEAM SYSTEM AND CARRIER USED THEREWITH - A method of processing objects by a FIB (Focused Ion Beam) system and a carrier used therewith are provided. The carrier includes a carrying member and a processing portion having an object disposed thereon. Before the carrier is disposed into the FIB system, the carrying member is set to be flush in height with the processing portion having the object disposed thereon. After an eucentric height adjustment inside the FIB system, both the carrying member and the processing portion are in a same plane with the eucentric point of the system. Therefore, after the object on the processing portion is processed, a processed object or a processed block of the object can be moved to the carrying member without performing further eucentric height adjustment with respect to the carrying member.07-01-2010

Shi-Wei Lee, Hsinchu TW

Patent application numberDescriptionPublished
20090028581Burst mode optical receiver and system and method therefor - A communications system includes an optical receiver for receiving optical signals and for converting the optical signals into electrical signals, a transimpedance amplifier (“TIA”) for filtering the electrical signals, a limiting amplifier coupled with the TIA, an automatic threshold control (“ATC”) coupled with the TIA for providing a reference voltage for the limiting amplifier. The ATC further includes a common emitter circuit and an emitter follower circuit, wherein logic high signals and logical low signals in the electrical signals are determined based on the reference voltage output from the ATC.01-29-2009

Shuenn-Gi Lee, Hsinchu TW

Patent application numberDescriptionPublished
20110066914Address Generation Apparatus And Method For Quadratic Permutation Polynomial Interleaver De-Interleaver - An address generation apparatus for a quadratic permutation polynomial (QPP) interleaver is provided. It comprises a basic recursive unit, and L recursive units represented by first recursive unit up to L03-17-2011

Shu-Pyng Lee, Hsinchu TW

Patent application numberDescriptionPublished
20090156344Conveyor belt and method for producing the same - The present invention provides a conveyor belt fabricated from a gray cloth weaved from tetragonal fibers. The conveyor belt of the present invention reduces the amount of rubber to achieve desired lightweight, with more preferable tensile strength and elongation at break than conveyor belts fabricated from circular fibers.06-18-2009

Sz-Yuan Lee, Hsinchu TW

Patent application numberDescriptionPublished
20090103170SOLID TUNABLE MICRO OPTICAL DEVICE AND METHOD - A solid tunable micro optical device for an micro-optical system is provided. The sold tunable micro optical device includes a first annular piece, a micro-lens with a spherical surface configured on the first annular piece, and a deforming device coupled to the first annular piece for deforming the micro-lens.04-23-2009

Tsan-Chung Lee, Hsinchu TW

Patent application numberDescriptionPublished
20090240862System Design for a Digital Electronic Sign Board - A system design for a digital electronic sign board comprises a main circuit module, an adapter module and a computer module; wherein the adapter module is fixed between the main circuit module and the computer module. The main circuit module and the adapter module are fixed in the digital electronic sign board. The computer module is externally inserted into the digital electronic sign board. Therefore the computer module and the main circuit module are electrically connected through the adapter module. The system design of the present invention removable and attached the computer module with the main circuit module. As a result, when a maintenance worker needs to perform maintenance on the computer module, he or she can conveniently pull out the computer module from the digital electronic sign board and insert the computer module back to the digital electronic sign board after maintenance is done so as to improve the efficiency and quality of maintenance.09-24-2009

Tsung-Hung Lee, Hsinchu TW

Patent application numberDescriptionPublished
20110012891GATE PULSE MODULATION CIRCUIT AND LIQUID CRYSTAL DISPLAY THEREOF - The present invention relates to a gate pulse modulation (GPM) circuit and the application of same in a liquid crystal display for improving the display performance thereof. The gate pulse modulation circuit is configured to modulate multi-phase clock pulse signals so as to correspondingly generate odd gate pulse waveforms and even gate pulse waveforms that are different from one another.01-20-2011

Tsung-Shiun Lee, Hsinchu TW

Patent application numberDescriptionPublished
20080203944LIGHTING APPARATUS WITH CURRENT FEEDBACK - A lighting apparatus comprises a plurality of light sources, a power conversion circuit, a plurality of load-driving coils and a feedback generation coil. The power conversion circuit generates a driving signal for the load-driving coils to generate substantially identical driving currents for driving every light source. Furthermore, the feedback generation coil generates a feedback signal based on the inductions of the currents flowing though the plurality of load driving coils.08-28-2008
20090009992BACKLIGHT MODULE - A backlight module including a plurality of lamps, a first circuit board, and a second circuit board is provided. Each lamp has a first electrode and a second electrode. The first circuit board has a plurality of first openings and first conductive clips. The first electrode is disposed to extend through the first opening and to be clamped by the first conductive clip. Furthermore, a plurality of current adjustment devices is disposed on the first circuit board. The current adjustment device is electrically coupled to the first electrode through the first conductive clips. In the backlight module, the conductive clips or clamping pins of the current adjustment devices are used to hold the electrodes of lamps, thereby facilitating the assembly process of backlight module.01-08-2009

Tsung-Xian Lee, Hsinchu TW

Patent application numberDescriptionPublished
20100109028Vertical ACLED structure - This application related to an opto-electrical device, comprising a first ACLED having a first n-type semiconductor layer, a first light emitting layer, a first p-type semiconductor layer, a first p-type electrode and a first n-type electrode; a second ACLED having a second n-type semiconductor layer, a second light emitting layer, a second p-type semiconductor layer, a second p-type electrode and a second n-type electrode, wherein each of the first ACLED and the second ACLED are vertical stack structure and is connected in anti-parallel manner.05-06-2010
20100283062OPTOELECTRONIC SYSTEM - An embodiment of the invention discloses an optoelectronics system and a method of making the same. The method includes steps of providing a temporary substrate; providing un-packaged optoelectronic elements on the temporary substrate; forming a trench between two of the un-packaged optoelectronic elements; providing an adhesive material to fill the trench and cover the optoelectronic elements; providing a permanent substrate on the adhesive material; and removing the temporary substrate.11-11-2010

Tu Chen Lee, Hsinchu TW

Patent application numberDescriptionPublished
20090079462Semiconductor device testing apparatus - A semiconductor device testing apparatus includes a test head Hifix, a tester coupled to the test head Hifix, two or more device-under-tests (DUTs), and one or more processor devices disposed on the test head Hifix and coupled to the DUTs for transmitting and receiving test signals between the tester and the DUTs and for receiving and processing a number of test signals from the DUTs into a single output signal and for transmitting the output signal to the tester for testing purposes. The tester may generate and transmit test signals to the test head Hifix and the DUTs for testing the DUTs to ensure that the DUTs function properly in the consumer domain.03-26-2009

Tung-Chou Lee, Hsinchu TW

Patent application numberDescriptionPublished
20100241967SETTING AND MODIFYING METHOD OF USER OPERATING INTERFACE FOR USE IN DIGITAL AUDIO/VIDEO PLAYBACK SYSTEM - A setting and modifying method of a user operating interface is used between a user device and a digital audio/video signal receiving and processing device through a network. The setting and modifying method includes the following steps. Firstly, the user device acquires a first user operating interface setting information from the digital audio/video signal receiving and processing device. Then, the contents of the first user operating interface setting information are modified to generate a second user operating interface setting information. Afterwards, the second user operating interface setting information is transmitted from the user device to the digital audio/video signal receiving and processing device through the network for setting the user operating interface.09-23-2010
20100325661VIDEO/AUDIO BROADCASTING SYSTEM AND CUSTOMIZED BROADCASTING METHOD OF SAME - A video/audio broadcasting system and customized video/audio broadcasting method selects a corresponding graphic user interface among multiple graphic user interfaces according to an operation of a user on the video/audio broadcasting system, and uses the corresponding graphic user interface to operate the video/audio broadcasting system, for receiving and broadcasting corresponding contents of a video/audio signal.12-23-2010

Tze-Liang Lee, Hsinchu TW

Patent application numberDescriptionPublished
20100015814MOSFET Device With Localized Stressor - MOSFETs having localized stressors are provided. The MOSFET has a stress-inducing layer formed in the source/drain regions, wherein the stress-inducing layer comprises a first semiconductor material and a second semiconductor material. A treatment is performed on the stress-inducing layer such that a reaction is caused with the first semiconductor material and the second semiconductor material is forced lower into the stress-inducing layer. The stress-inducing layer may be either a recessed region or non-recessed region. A first method involves forming a stress-inducing layer, such as SiGe, in the source/drain regions and performing a nitridation or oxidation process. A nitride or oxide film is formed in the top portion of the stress-inducing layer, forcing the Ge lower into the stress-inducing layer. Another method embodiment involves forming a reaction layer over the stress-inducing layer and performing a treatment process to cause the reaction layer to react with the stress-inducing layer.01-21-2010
20100075480STI STRESS MODULATION WITH ADDITIONAL IMPLANTATION AND NATURAL PAD SIN MASK - A method of manufacturing a semiconductor structure is provided. The method includes forming a hard mask pattern on a semiconductor substrate, wherein the hard mask pattern covers active regions; forming a trench in the semiconductor substrate within an opening defined by the hard mask pattern; filling the trench with a dielectric material, resulting in a trench isolation feature; performing an ion implantation to the trench isolation feature using the hard mask pattern to protect active regions of the semiconductor substrate; and removing the hard mask pattern after the performing of the ion implantation.03-25-2010
20100291751METHOD FOR FABRICATING AN ISOLATION STRUCTURE - The invention relates to integrated circuit fabrication, and more particularly to an electronic device with an isolation structure made having almost no void. An exemplary method for fabricating an isolation structure, comprising: providing a substrate; forming a trench in the substrate; partially filling the trench with a first silicon oxide; exposing a surface of the first silicon oxide to a vapor mixture comprising NH3 and a fluorine-containing compound; heating the substrate to a temperature between 100° C. to 200° C.; and filling the trench with a second silicon oxide, whereby the isolation structure made has almost no void.11-18-2010
20100323494NARROW CHANNEL WIDTH EFFECT MODIFICATION IN A SHALLOW TRENCH ISOLATION DEVICE - A method of manufacturing a semiconductor structure is provided. The method includes forming a hard mask pattern on a semiconductor substrate, wherein the hard mask pattern covers active regions; forming a trench in the semiconductor substrate within an opening defined by the hard mask pattern; filling the trench with a dielectric material, resulting in a trench isolation feature; performing an ion implantation to the trench isolation feature using the hard mask pattern to protect active regions of the semiconductor substrate; and removing the hard mask pattern after the performing of the ion implantation.12-23-2010
20110049567BOTTLE-NECK RECESS IN A SEMICONDUCTOR DEVICE - The present disclosure provides a method for fabricating a semiconductor device that includes providing a silicon substrate, forming a gate stack over the silicon substrate, performing a biased dry etching process to the substrate to remove a portion of the silicon substrate, thereby forming a recess region in the silicon substrate, performing a non-biased etching process to the recess region in the silicon substrate, thereby forming a bottle-neck shaped recess region in the silicon substrate, and epi-growing a semiconductor material in the bottle-neck shaped recess region in the silicon substrate. An embodiment may include a biased dry etching process including adding HeO2 gas and HBr gas. An embodiment may include performing a first biased dry etching process including N2 gas and performing a second biased dry etching process not including N2 gas. An embodiment may include performing an oxidation process to the recess region in the silicon substrate by adding oxygen gas to form silicon oxide on a portion of the recess region in the silicon substrate. As such, these processes form polymer protection to help form the bottle-neck shaped recess.03-03-2011

Patent applications by Tze-Liang Lee, Hsinchu TW

Tzung-Chi Lee, Hsinchu TW

Patent application numberDescriptionPublished
20090218623SOI DEVICES AND METHODS FOR FABRICATING THE SAME - Silicon on insulator (SOI) devices and methods for fabricating the same are provided. An exemplary embodiment of a SOI device comprises a substrate. A first insulating layer is formed over the substrate. A plurality of semiconductor islands is formed over the first insulating layer, wherein the semiconductor islands are isolated from each other. A second insulating layer is formed over the first insulating layer, protruding over the semiconductor islands and surrounding thereof. At least one recess is formed in a portion of the second insulating layer adjacent to a pair of the semiconductor islands. A first dielectric layer is formed on a portion of each of the semiconductor islands. A conductive layer is formed over the first dielectric layer and over the second insulating layer exposed by the recess. A pair of source/drain regions is oppositely formed in portions of each of the semiconductor islands not covered by the first dielectric layer and the conductive layer.09-03-2009
20090298243SOI DEVICES AND METHODS FOR FABRICATING THE SAME - Silicon on insulator (SOI) devices and methods for fabricating the same are provided. An exemplary embodiment of a SOI device comprises a substrate. A first insulating layer is formed over the substrate. A plurality of semiconductor islands is formed over the first insulating layer, wherein the semiconductor islands are isolated from each other. A second insulating layer is formed over the first insulating layer, protruding over the semiconductor islands and surrounding thereof. At least one recess is formed in a portion of the second insulating layer adjacent to a pair of the semiconductor islands. A first dielectric layer is formed on a portion of each of the semiconductor islands. A conductive layer is formed over the first dielectric layer and over the second insulating layer exposed by the recess. A pair of source/drain regions is oppositely formed in portions of each of the semiconductor islands not covered by the first dielectric layer and the conductive layer.12-03-2009

Wai-Hon Lee, Hsinchu TW

Patent application numberDescriptionPublished
20110187964LIQUID CRYSTAL PANEL MODULE, BACKLIGHT MODULE AND LIQUID CRYSTAL DISPLAY - A liquid crystal panel module, a backlight module and a liquid crystal display (LCD) are provided. The liquid crystal panel module includes a liquid crystal panel and a diffraction grating layer. The liquid crystal panel has a plurality of pixels. The diffraction grating layer is disposed on the liquid crystal panel, and a maximum period of a grating of the diffraction grating layer is smaller than 1/10 of a size of the pixels. The backlight module includes a light guide plate, a light emitting element and a diffraction grating film. A light provided by the light emitting element emits from a light emitting surface of the light guide plate and is bended towards the light emitting element after passing through the diffraction grating film. The liquid crystal panel module and the backlight module can be applied to the LCD together or individually.08-04-2011

Wei-I Lee, Hsinchu TW

Patent application numberDescriptionPublished
20090061636Etching method for nitride semiconductor - The invention discloses etching method for the nitride semiconductor. Firstly dielectric layer is formed on gallium nitride. The line pattern or dot pattern is formed on the dielectric layer by using the exposure, development, and etching processes. The dielectric layer is used as the mask for the epitaxial lateral overgrowth of follow-up gallium nitride layer. The thick gallium nitride film is grown on the dielectric layer. Then the wet etching process is used to remove the dielectric layer, and the thick gallium nitride film on the dielectric layer is etched to form the specific shape as required.03-05-2009
20100193843MANUFACTURE METHOD OF MULTILAYER STRUCTURE HAVING NON-POLAR A-PLANE III-NITRIDE LAYER - A manufacture method of a multilayer structure having a non-polar a-plane {11-22} III-nitride layer includes forming a nucleation layer on a r-plane substrate, wherein the nucleation layer is composed of multiple nitride layers; and forming a non-polar a-plane {11-20} III-nitride layer on the nucleation layer. The nucleation layer features reduced stress, reduced phase difference of lattice, blocked elongation of dislocation, and reduced density of dislocation. Thus, the non-polar a-plane {11-20} III-nitride layer with flat surface can be formed.08-05-2010

When-Chin Lee, Hsinchu TW

Patent application numberDescriptionPublished
20080315321System and Method for Forming a Semiconductor Device Source/Drain Contact - The present invention discloses a semiconductor source/drain contact structure, which comprises a substrate, a source/drain region disposed in the substrate, at least one non-silicided conductive layer including a barrier layer disposed over and in contact with the source/ drain region, and one or more contact hole filling metals disposed over and in contact with the at least one non-silicided conductive layer, wherein a first contact area between the at least one non-silicided conductive layer and the source/drain region is substantially larger than a second contact area between the one or more contact hole filling metals and the at least one non-silicided conductive layer.12-25-2008

Ya Chi Lee, Hsinchu TW

Patent application numberDescriptionPublished
20110074651ASSEMBLY OF CLAMPING MECHANISM AND LNB AND DISH ANTENNA USING THE SAME - An assembly comprises a clamping mechanism and an LNB (low noise block down converter). The clamping mechanism includes a first clamping part, a second clamping part, and a plurality of rectangular grooves. The LNB includes a shell, at least one flexible portion, and at least one rib portion. The first clamping part and the second clamping part clasp around the LNB, and are combined with each other by at least one fastening part. The at least one flexible portion is disposed on the shell of the LNB, and the rib portion is on the flexible portion. The plurality of rectangular grooves are closely arranged in parallel on the inner surface of the second clamping part, and the rib portion is contained in one of the rectangular grooves. By rotating the combination of the first clamping part and the second clamping part, the rib portion is forced to move between the rectangular grooves and then is positioned again. During the movement, the flexible portion is temporarily deformed.03-31-2011

Yai-Nan Lee, Hsinchu TW

Patent application numberDescriptionPublished
20090245400METHOD FOR SELECTION OF ERROR-CORRECTION CODE IN MIMO WIRELESS COMMUNICATION SYSTEMS - A method that selects an error-correction code for use in a multiple-input multiple output (MIMO) wireless communication system is disclosed that optimizes the performance of the MIMO wireless communication system. The method selects the error-correction code according to at least one system parameter and at least one channel parameter of the MIMO wireless communication system, such that the selected error-correction code matches the hardware configuration and channel setting of the MIMO wireless communication system.10-01-2009

Ya-Ju Lee, Hsinchu TW

Patent application numberDescriptionPublished
20090111205Method of seperating two material systems - An embodiment of this invention discloses a method of separating two material systems, which comprises steps of providing a bulk sapphire; forming a nitride system on the bulk sapphire; forming at least two channels between the bulk sapphire and the nitride system; etching at least one inner surface of the channel; and separating the bulk sapphire and the nitride system.04-30-2009
20100084679LIGHT-EMITTING DEVICE - A light-emitting device having a substrate, a light-emitting stack, and a transparent connective layer is provided. The light-emitting stack is disposed above the substrate and comprises a first diffusing surface. The transparent connective layer is disposed between the substrate and the first diffusing surface of the light-emitting stack; an index of refraction of the light-emitting stack is different from that of the transparent connective layer.04-08-2010
20100314991LIGHT-EMITTING DEVICE HAVING A PATTERNED SUBSTRATE AND THE METHOD THEREOF - This disclosure provides a light-emitting device including a patterned substrate and the manufacturing method thereof. The patterned substrate has a plurality of depressions and/or extrusions for scattering light emitted from a light-emitting layer. Each of the plurality of depressions and/or extrusions comprises a top portion, a bottom portion, and a sidewall portion enclosing the top portion and the bottom portion, and at least part of the sidewall portion comprises a curve. In a preferred embodiment, the light-emitting device further comprises a rough surface formed on at least one of the top portion, the bottom portion, and the sidewall portion.12-16-2010

Patent applications by Ya-Ju Lee, Hsinchu TW

Yan-Ching Lee, Hsinchu TW

Patent application numberDescriptionPublished
20100003912MEDICAL MINI-ENVIRONMENT DEVICE - A ventilation apparatus for forming a sterile medical area mainly includes an operation module for ventilating the air. The apparatus for ensuring the air cleanliness includes a filtering unit for filtering dusts and particles in the air and a sterilizing unit for eliminating micro organisms. The clean and sterilized air is sent into the medical area via an air outlet to form a quasi-laminar air flow pattern. By application of the ventilation apparatus, the cleanliness of the medical area can be ensured.01-07-2010

Yen-Wei Lee, Hsinchu TW

Patent application numberDescriptionPublished
20110175682PHASE-LOCKED LOOP FREQUENCY SYNTHESIZER AND LOOP LOCKING METHOD THEREOF - A phase-locked loop frequency synthesizer and a loop locking method thereof are provided. The phase-locked loop frequency synthesizer includes a reference route sigma-delta modulator feedback circuit, a reference phase integration circuit coupled to the output end of the reference route sigma-delta modulator feedback circuit, a phase/frequency detector coupled to the output ends of the reference and feedback phase integration circuit, a loop filter coupled to the output end of the phase/frequency detector and the input end of the reference route sigma-delta modulator feedback circuit, an oscillator coupled to the output end of the loop filter, and a feedback phase integration circuit coupled to the output end of the oscillator and the input end of the phase/frequency detector. In the phase-locked loop frequency synthesizer, the oscillator generates corresponding frequency output signals which yield the advantages of resisting noise signals, enhancing resolution, and facilitating integration.07-21-2011

Yeong-Shyang Lee, Hsinchu TW

Patent application numberDescriptionPublished
20090101913APPARATUS AND METHOD FOR REDUCING PHOTO LEAKAGE CURRENT FOR TFT LCD - A method of forming a thin film transistor (TFT) array panel, comprising the steps of: (i) forming a patterned first conductive layer, which includes a gate line and a shielding portion, on a substrate, (ii) forming a gate insulating layer on the patterned first conductive layer and the substrate, (iii) forming a patterned semiconductor layer on the gate insulating layer, (iv) forming a patterned second conductive layer, which includes a source electrode, and a drain electrode on the patterned semiconductor layer, and a data line that is electrically connected to the source electrode, (v) forming a patterned passivation layer on the patterned second conductive layer and the substrate, and (vi) forming a patterned transparent conductive layer on the patterned passivation layer.04-23-2009

Yi-Chung Lee, Hsinchu TW

Patent application numberDescriptionPublished
20110122729Controlling Method for Ultra-sound Sensor - A controlling method for ultra-sound sensor is provided. The method includes the steps of measuring a distance of an obstacle, determining whether the distance is smaller than a distance threshold, and adjusting a driving voltage if the distance is smaller than the distance threshold.05-26-2011
20110133653ULTRASONIC LAMP AND CONTROL METHOD THEREOF - An ultrasonic lamp control method is provided. The control method includes the following steps. The ultrasonic lamp emits a first burst, and detects whether a first echo is received within a fixed period of time after the emission of the first burst. If the first echo is received within the fixed period of time, then the ultrasonic lamp neglects the first echo and emits a second burst. The ultrasonic lamp detects whether a second echo is received within the fixed period of time after the emission of the second burst. If the second echo is received within the fixed period of time, then the ultrasonic lamp enters a control mode.06-09-2011
20110134725ULTRASONIC SYSTEM AND COMMUNICATION METHOD THEREOF - An ultrasonic system including an ultrasonic transmitter and an ultrasonic receiver is provided. The ultrasonic transmitter emits a transmission signal, which includes a synchronous burst and multiple data bursts. The ultrasonic receiver receives a synchronous echo, and determines whether the amplitude of the synchronous echo is larger than a first threshold. If the amplitude of the synchronous echo is larger than the first threshold, then the ultrasonic receiver interprets the multiple data echoes corresponding to the data bursts to obtain a digital signal.06-09-2011

Patent applications by Yi-Chung Lee, Hsinchu TW

Yuan-Chuan Lee, Hsinchu TW

Patent application numberDescriptionPublished
20100291540CARBOHYDRATE BINDING MODULE AND USE THEREOF - The present invention relates to an antibody mimetic of carbohydrate binding module (CBM) which specifically binds to an epitope on HIV glycoprotein. The present invention also relates to a method of detecting HIV glycoprotein.11-18-2010
20100291601CARBOHYDRATE BINDING MODULE AND USE THEREOF - The present invention relates to an antibody mimetic of carbohydrate binding module (CBM) which specifically binds to an epitope on HIV glycoprotein. The present invention also relates to a method of detecting HIV glycoprotein.11-18-2010

Yung-Liang Lee, Hsinchu TW

Patent application numberDescriptionPublished
20080281661Real-time Advertisement Displaying System and Method thereof - A method for displaying advertisements in a real-time manner includes the step of getting an external information having one of the image data and the audio data, the step of managing the external data, the step of generating triggered messages, the step of displaying the advertisements according to the triggered messages corresponding to the external data, and the step of recording a number of displayed times of the advertisements. With the abovementioned method, sights of observers may be significantly attracted by displayed advertisements.11-13-2008
20090201165ANGLE-ADJUSTABLE METHOD AND AUTOMATIC ANGLE-ADJUSTABLE DISPLAY DEVICE - An automatic angle-adjustable display device and an angle-adjustable method are provided. The automatic angle-adjustable display device includes a screen, three wireless transmitting and receiving sensors, an angle adjustment mechanism and a control unit. The wireless transmitting and receiving sensors are respectively disposed at first, second and third positions of the screen. In response to a control signal issued from the control unit, the angle adjustment mechanism is driven to adjust the viewing angle of the screen with respect to the viewer. The angle-adjustable method includes steps of triggering the wireless transmitting and receiving sensors to emit these wireless signals, measuring first, second and third distances between the first, second and third positions of the screen and the viewer according to the reflected wireless signals, and adjusting the viewing angle of the screen with respect to the viewer according to these distance differences.08-13-2009

Zong-Huai Lee, Hsinchu TW

Patent application numberDescriptionPublished
20100084978System And Method For Driving LED Vehicle Lights - A system and method for driving LED vehicle lights is provided, for diving an LED taillight and brake light, an LED reversing light and an LED direction indicator. The system and method uses direction indicator controller to receive the direction indicator enabling signal generated by vehicle light power controller and generate an direction indicator control signal to an enabling switch controller to avoid the flasher frequency of the direction indicator from being affected by the lighted taillight and brake light and reversing light so as to provide the driving capability that can stabilize the flasher frequency of the direction indicator.04-08-2010